Infineon Technologies TDA21102
- Part No.:
- TDA21102
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 14-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
TDA21102.pdf
- Description:
- IC HALF BRIDGE DRIVER DSO14-3
- Quantity:
- Payment:

- Shipping:

Inventory:2,719
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Product details
Overview
TDA21102 from Infineon Technologies is a dual high-speed N-channel MOSFET gate driver IC designed for synchronous half-bridge topologies in multi-phase CPU VRMs. It delivers 4 A peak sink/source current per channel, supports up to 2 MHz switching frequency, and features adjustable high-side gate drive voltage (5–12 V) via the PVCC pin. It integrates bootstrap diodes and adaptive shoot-through protection for reliable operation in motherboard power delivery.
For engineers reviewing the TDA21102 datasheet, TDA21102 pinout, TDA21102 application, or TDA21102 equivalent, key selection considerations include propagation delay (≤35 ns HS turn-on), thermal resistance (Rth-JA = 116.2 K/W), bootstrapped high-side drive capability, and compatibility with standard PWM controllers such as Intersil and Analog Devices parts.
Technical Context
The TDA21102 implements two independent, matched high-side/low-side driver channels with integrated bootstrap diodes and adaptive dead-time control to prevent cross-conduction. Each channel features separate PVCC-adjustable gate drive voltage and dedicated PHASE/BOOT/GATEHS/GATELS terminals for precise half-bridge node control.
It operates across a 10.8–13.2 V VCC range and 5–13.2 V PVCC range, with under-voltage lockout thresholds at 9.7 V (rising) and 7.6 V (falling). The device sustains 25 V DC phase-node voltage rating and supports pulse-mode phase-node transients up to ±30 V (500 ns, 2% duty).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 10.8–13.2 V - ensures stable operation in 12 V rail-based VRM systems |
| PVCC Adjustment | 5–13.2 V - enables optimization of high-side gate drive voltage for ON-resistance vs. switching loss trade-off |
| Peak Output Current | ±4 A - drives high-Qg MOSFETs with fast edge rates and low switching losses |
| Max Switching Frequency | 2 MHz - supports high-density, high-efficiency multi-phase CPU power stages |
| Propagation Delay (HS) | 18–35 ns - minimizes timing skew between PWM input and gate output for tight phase alignment |
| Rth-JA | 116.2 K/W - defines thermal derating limits in P-DSO-14-3 package on standard 2-layer PCB |
| Phase Node Voltage Rating | −1 to +25 V DC - supports operation in buck-derived topologies with negative flyback excursions |
Pinout & Package
Package: P-DSO-14-3 (14-pin plastic dual small outline, 1.27 mm pitch, exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PWM1 | Input control signal for Channel 1 | Accepts TTL/CMOS-compatible PWM logic; enables independent channel control |
| PWM2 | Input control signal for Channel 2 | Matches PWM1 timing behavior; supports interleaved multi-phase operation |
| GND | Analog ground reference | Reference for internal bias circuitry and PWM input thresholds |
| GATELS1 | Low-side gate drive output (Ch1) | Drives N-channel MOSFET source-connected to GND; ±4 A peak capability |
| PVCC | Adjustable gate drive supply | Sets high-side gate voltage level (5–12 V); decoupled from VCC for loss optimization |
| PGND | Power ground return | Separate low-impedance path for high-current gate drive return currents |
| GATELS2 | Low-side gate drive output (Ch2) | Electrically isolated from GATELS1; enables dual-phase independent drive |
| PHASE2 | High-side source node connection (Ch2) | Connects to drain-source junction of Ch2 half-bridge; withstands −1 to +25 V |
| GATEHS2 | High-side gate drive output (Ch2) | Floating output referenced to PHASE2; driven by internal bootstrap circuit |
| BOOT2 | Bootstrap capacitor connection (Ch2) | Charges external capacitor to generate gate voltage above PHASE2 for N-channel HS FET |
| BOOT1 | Bootstrap capacitor connection (Ch1) | Independent bootstrap node for Channel 1; eliminates shared bootstrap coupling |
| GATEHS1 | High-side gate drive output (Ch1) | Floating output referenced to PHASE1; matches GATEHS2 timing and drive strength |
| PHASE1 | High-side source node connection (Ch1) | Connects to drain-source junction of Ch1 half-bridge; same voltage rating as PHASE2 |
| VCC | Main supply input | Powers internal logic, level shifters, and low-side drivers; UVLO protected |
Key Features
| Feature | Design Value |
|---|---|
| Integrated bootstrap diode | Eliminates external diode per channel, reducing BOM count and layout area in dual-phase designs |
| Adaptive shoot-through protection | Hardware-enforced dead-time prevents simultaneous HS/LS conduction without external timing components |
| Adjustable gate drive voltage (PVCC) | Enables fine-tuning of gate overdrive to balance conduction loss vs. gate charge loss across MOSFET families |
| Three-state shutdown mode | Reduces quiescent current to ≤4.9 mA when PWM inputs are held in 1.8–3.0 V window |
| High phase-node voltage rating | Supports robust operation in high-dV/dt environments typical of high-frequency synchronous buck converters |
Applications
| Desktop CPU VRM | Multi-phase Server PSU |
|---|---|
Use Scenario: Power delivery to Intel/AMD desktop processors requiring >100 A with tight voltage regulation and dynamic load response. IC Role / Device Role / Timing Role: Dual-channel gate driver enabling interleaved 2-phase or 4-phase (with multiple ICs) synchronous buck conversion. Use Value: 2 MHz capability and <35 ns propagation delay allow high-frequency operation that shrinks output filter size while maintaining transient response. | Use Scenario: High-efficiency, high-density power stage in 1U server PSUs supporting dual-socket Xeon platforms. IC Role / Device Role / Timing Role: Half-bridge driver for parallel-phase power stages with independent PWM control and thermal-aware layout. Use Value: Adjustable PVCC and integrated bootstrap reduce component count and improve reliability versus discrete bootstrap solutions. |
| Class-D Audio Amplifier | Industrial Motor Drive |
Use Scenario: Full-bridge output stage in high-fidelity audio amplifiers requiring low EMI and minimal dead-time distortion. IC Role / Device Role / Timing Role: Dual high-side/low-side driver per bridge leg, configured for complementary PWM with adaptive dead-time. Use Value: Matched propagation delays (<5 ns inter-channel skew) and fast rise/fall times (<28 ns) minimize crossover distortion. | Use Scenario: Low-voltage BLDC motor control in factory automation equipment with space-constrained PCBs. IC Role / Device Role / Timing Role: Gate driver for N-channel half-bridge inverter legs, operating from 12 V bus with bootstrap high-side bias. Use Value: 25 V phase-node rating and −25 °C to +150 °C junction temperature range support industrial ambient conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual high-side/low-side gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR2110PbF | Higher propagation delay (60–120 ns), no integrated bootstrap diode, fixed 10–20 V gate drive | Lacks PVCC adjustability and adaptive shoot-through protection; requires external bootstrap diodes | Lower cost but increases BOM and layout complexity; suitable for lower-frequency (<500 kHz), non-critical applications |
| LM5113MMX/NOPB | Single-channel, higher peak current (5 A), no integrated bootstrap diode, 100 V phase rating | Requires two units per dual-phase design; lacks PVCC adjustment and three-state shutdown | Better for ultra-high-voltage (>60 V) or single-channel optimized designs; not drop-in compatible |
Compared with IR2110PbF and LM5113MMX/NOPB, the TDA21102 provides tighter timing control, reduced component count via integrated bootstrap diodes, and flexible gate drive voltage tuning-making it optimal for high-frequency, space-constrained multi-phase VRMs where efficiency and layout simplicity are critical.
Availability
TDA21102 is available at Aetrix Electronics and suitable for desktop CPU VRMs, multi-phase server PSUs, Class-D audio amplifiers, and industrial BLDC motor drives requiring stable component supply and long-term lifecycle support.
Supply support for TDA21102 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
The TDA21102 belongs to Infineon's CoreControl™ family of high-speed gate drivers, engineered specifically for high-efficiency, high-density synchronous DC/DC converters in computing and communications infrastructure.
FAQ
What is the maximum allowable voltage on the PHASE pin during pulsed operation?
The PHASE pin supports up to +30 V or −20 V for pulses ≤500 ns with ≤2% duty cycle, as specified in the Absolute Maximum Ratings table. This enables safe operation during high-dV/dt switching transitions in synchronous buck topologies without clamping or snubbing circuits.
Does the TDA21102 require external bootstrap diodes?
No. The TDA21102 integrates bootstrap diodes for both high-side channels, eliminating the need for external diodes. This reduces component count, PCB area, and potential failure points in multi-phase VRM designs while maintaining reliable bootstrap capacitor charging.
How does the PVCC pin affect gate drive performance?
The PVCC pin sets the high-side gate drive voltage level between 5 V and 13.2 V. A higher PVCC reduces RDS(on) conduction loss in the high-side MOSFET but increases gate charge loss; adjusting it allows system-level optimization of total power loss in high-frequency applications.
Can the TDA21102 be used in single-phase configurations?
Yes. Either channel (PWM1/GATEHS1/GATELS1/PHASE1/BOOT1 or PWM2/GATEHS2/GATELS2/PHASE2/BOOT2) can be used independently in single-phase half-bridge applications. Unused pins should be left unconnected or tied according to layout best practices for noise immunity and thermal management.
TDA21102 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoreControl™
- Package/Case:
- 14-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge (2)
- Applications:
- DC-DC Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- 1.4Ohm LS, 1Ohm HS
- Current - Output / Channel:
- -
- Current - Peak Output:
- 4A
- Voltage - Supply:
- 10.8V ~ 13.2V
- Voltage - Load:
- 5V ~ 13.2V
- Operating Temperature:
- -25°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-DSO-14-3
TDA21102 FAQ
1.How can I place an order for TDA21102 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21102 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21102 reliable?
The price and inventory of TDA21102 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21102 is usually 5 days.
3.What payment methods are accepted for TDA21102?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21102 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21102?
TDA21102 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21102 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21102?
For technical support, including TDA21102 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21102 requirements.
6.How does Aetrix verify that TDA21102 is sourced from the original manufacturer or authorized distributors?
All TDA21102 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21102 meets industry standards.
7.What is the process for return or replacement of TDA21102?
All TDA21102 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21102, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21102 part is unused and in its original packaging.
Return procedure for TDA21102:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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