Infineon Technologies TDA21201-B7
- Part No.:
- TDA21201-B7
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- TO-263-7, D2PAK (6 Leads + Tab)
- Datasheet:
-
TDA21201-B7.pdf
- Description:
- IC HALF BRIDGE DRVR 30A TO263-7
- Quantity:
- Payment:

- Shipping:

Inventory:2,223
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Product details
Overview
TDA21201-B7 from Infineon is an integrated power stage combining a MOSFET driver, high-side and low-side Power MOSFETs, and internal bootstrap circuitry in a single TO-263-7-2 package. It delivers up to 30 A DC output current for 12 V to sub-3.3 V synchronous buck conversion, features 4.8 mΩ low-side and 13.3 mΩ high-side RDS(on) at Tj = 25 °C, and supports standard 5 V TTL PWM inputs for motherboard VRMs and multi-phase CPU voltage regulators.
For engineers reviewing the TDA21201-B7 datasheet, TDA21201-B7 pinout, TDA21201-B7 application, or TDA21201-B7 equivalent, key selection considerations include its integrated bootstrap elimination, three-state shutdown capability (1.2–1.6 V input window), thermal shutdown at 150 °C, and compatibility with 100–500 kHz PWM controllers in high-density DC/DC power stages.
Technical Context
The TDA21201-B7 implements a fully self-contained synchronous buck power stage with monolithic integration of gate driver logic, high-side and low-side silicon MOSFETs, and internal charge-pump bootstrapping-eliminating external diodes and capacitors. Its input accepts standard 5 V TTL-level PWM signals, where 'Low' enables the low-side FET and 'High' enables the high-side FET, with a dedicated 1.2–1.6 V shutdown window that disables both FETs for zero gate-charge loss during no-load conditions.
Thermal coupling between driver and MOSFETs enables coordinated overtemperature protection at 150 °C, while dual VCC pins (pins 6 and 7) feed both the driver supply and high-side gate drive, with ∆VCC monitoring (≥0.45 V for >2 µs) to detect solder joint faults or supply imbalance. The device operates across 9–15 V VCC, with no abrupt UVLO threshold-gate drive strength and RDS(on) scale gradually with supply voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 30 A DC - supports high-current CPU core rails without parallel phases |
| RDS(on) Low-Side | 4.8 mΩ @ 25 °C - minimizes conduction loss in low-voltage, high-current output paths |
| RDS(on) High-Side | 13.3 mΩ @ 25 °C - optimized for 12 V input with sub-3.3 V output in buck topology |
| IN-to-OUT Delay (ON) | 110–150 ns - ensures tight timing control for multi-phase synchronization |
| Shutdown Input Window | 1.2–1.6 V for >1.5 µs - enables clean, low-power disable without external logic |
| VCC Range | 9–15 V - tolerates ATX rail variation without functional interruption |
| Thermal Shutdown | 150 °C typical - protects driver and MOSFETs jointly via monolithic thermal coupling |
Pinout & Package
Package: TO-263-7-2 (D²PAK), surface-mount, thermally enhanced with exposed tab connected to VOUT (pin 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1,2,3 | GND | Common ground reference for driver logic and low-side source; electrically tied to PCB ground plane |
| 4 / Tab | VOUT | Switch node output; connects to output inductor and serves as thermal path via exposed copper tab |
| 5 | IN | PWM input accepting 5 V TTL logic; high-impedance interface drawing <80 µA at 4.5 V |
| 6,7 | VCC | Dual supply pins feeding driver and high-side gate charge pump; monitored for ∆VCC fault detection |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Circuitry | Eliminates external bootstrap capacitor and diode-reduces BOM count and layout complexity |
| Three-State Input Logic | 'Low' = low-side on, 'High' = high-side on, 1.2–1.6 V = both FETs off-enables seamless controller interoperability |
| Monolithic Thermal Protection | Single junction temperature sensor shuts down both FETs and driver simultaneously at 150 °C-prevents localized overheating failure |
| Dual VCC Pin Monitoring | ∆VCC ≥ 0.45 V for >2 µs disables device-detects open-solder or asymmetric supply routing before damage occurs |
| Optimized MOSFET Pairing | Asymmetric RDS(on) (13.3 mΩ HS / 4.8 mΩ LS) tailored for 12 V → 1.6–3.3 V buck conversion efficiency |
Applications
| Server CPU Voltage Regulator | Desktop Motherboard VRM |
|---|---|
Use Scenario: Multi-phase 12 V input to 1.2 V/1.8 V CPU core supply on dual-socket server boards with strict thermal and space constraints. IC Role / Device Role / Timing Role: Integrated power stage per phase-replaces discrete driver + HS/LS FETs + bootstrap components; handles full switching node transitions. Use Value: Reduces per-phase component count by ≥5 parts and PCB area by >40%, while maintaining <150 ns propagation delay for phase interleaving. | Use Scenario: Compact 4- or 6-phase VRM delivering 3.3 V to chipset I/O and memory termination on ATX form-factor motherboards. IC Role / Device Role / Timing Role: Synchronous buck power stage with integrated gate drive-accepts standard PWM outputs from ISL63xx or IR35xx controllers. Use Value: Enables direct replacement of discrete solutions without redesigning gate drive loop or adding bootstrap routing, lowering EMI risk. |
| Laptop GPU Core Supply | Network Switch ASIC Rail |
Use Scenario: High-efficiency 12 V to 1.05 V GPU core rail in thin-and-light notebooks requiring minimal heatsink volume. IC Role / Device Role / Timing Role: Single-chip power stage supporting 300 kHz–1 MHz operation-delivers 25 A peak with integrated thermal foldback. Use Value: Achieves >90% efficiency at 15 A due to low RDS(on) pairing and eliminates external bootstrap losses. | Use Scenario: 12 V to 2.5 V supply for packet processing ASICs in enterprise switches with burst-load transient requirements. IC Role / Device Role / Timing Role: Fast-switching integrated stage-uses 10–25 ns rise/fall times to maintain regulation during 10 A/µs load steps. Use Value: Delivers stable output under dynamic loads without external gate resistors or snubbers, simplifying transient response tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR3557M | Higher RDS(on) (HS: 16.5 mΩ, LS: 6.2 mΩ); requires external bootstrap capacitor; 5×5 mm QFN package | Targeted at ultra-compact mobile VRMs; lower thermal mass limits sustained 30 A operation | Select when board space is constrained and thermal budget allows higher conduction loss |
| MP86957 | Integrated current sense amplifier; 12 V max VCC; no ∆VCC fault detection; 30 A rating at 105 °C ambient only | Designed for industrial DC/DC modules with telemetry needs; lacks shutdown window for controller compatibility | Select when real-time current monitoring is required and ATX-compatible shutdown is not needed |
Compared with IR3557M and MP86957, the TDA21201-B7 uniquely combines full bootstrap integration, robust ∆VCC fault detection, and a standardized three-state input-making it optimal for legacy and new ATX-compliant motherboard VRMs where reliability and drop-in controller compatibility are critical.
Availability
TDA21201-B7 is available at Aetrix Electronics and suitable for server CPU voltage regulators, desktop motherboard VRMs, laptop GPU core supplies, and network switch ASIC rails requiring stable component supply and long-lifecycle support.
Supply support for TDA21201-B7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon power devices and integrated power systems.
The TDA21201 belongs to Infineon's Integrated Power Stage (IPS) product line, engineered specifically for high-efficiency, high-density DC/DC conversion in computing infrastructure-emphasizing thermal robustness, controller interoperability, and BOM reduction in multi-phase VRMs.
FAQ
What is the function of the dual VCC pins (6 and 7) on the TDA21201-B7?
Pins 6 and 7 are paralleled VCC inputs supplying power to both the internal MOSFET driver and the high-side gate charge pump. They are monitored differentially: if ∆VCC ≥ 0.45 V for >2 µs, the device disables to prevent malfunction from asymmetric supply routing or poor solder joints-this is a hardware-level fault detection feature independent of external circuitry.
Does the TDA21201-B7 require external bootstrap components?
No. The TDA21201-B7 integrates all necessary bootstrap circuitry-including charge pump and level-shifting logic-within the monolithic package. Only three external connections are required: GND (pins 1–3), VCC (pins 6–7), and IN (pin 5). This eliminates external bootstrap capacitors and diodes, reducing layout complexity and improving reliability.
How does the shutdown mode operate, and what input voltage triggers it?
The TDA21201-B7 enters shutdown when the IN pin (pin 5) is held at 1.2–1.6 V for more than 1.5 µs. In this state, both high-side and low-side MOSFETs turn off completely, eliminating gate drive current and static conduction loss. The shutdown releases automatically when IN transitions to either logic-low (<0.8 V) or logic-high (>2.1 V), restoring normal PWM-controlled operation.
Can the TDA21201-B7 be used in a single-phase 12 V to 5 V converter?
While the TDA21201-B7 is optimized for 12 V to sub-3.3 V conversion (e.g., 1.2 V, 1.8 V), it can operate at 5 V output-but efficiency drops significantly due to increased duty cycle and higher RMS currents in the low-side FET. Its RDS(on) ratio and thermal design target low-VOUT applications; for 5 V outputs, discrete or higher-VOUT-optimized stages are recommended.
TDA21201-B7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-263-7, D2PAK (6 Leads + Tab)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- 4.8mOhm LS, 13.3mOhm HS
- Current - Output / Channel:
- 30A
- Current - Peak Output:
- -
- Voltage - Supply:
- 9V ~ 15V
- Voltage - Load:
- 9V ~ 15V
- Operating Temperature:
- -25°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Over Temperature, Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-7-2
TDA21201-B7 FAQ
1.How can I place an order for TDA21201-B7 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21201-B7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21201-B7 reliable?
The price and inventory of TDA21201-B7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21201-B7 is usually 5 days.
3.What payment methods are accepted for TDA21201-B7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21201-B7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21201-B7?
TDA21201-B7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21201-B7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21201-B7?
For technical support, including TDA21201-B7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21201-B7 requirements.
6.How does Aetrix verify that TDA21201-B7 is sourced from the original manufacturer or authorized distributors?
All TDA21201-B7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21201-B7 meets industry standards.
7.What is the process for return or replacement of TDA21201-B7?
All TDA21201-B7 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21201-B7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21201-B7 part is unused and in its original packaging.
Return procedure for TDA21201-B7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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