Infineon Technologies TDA21215AUMA1
- Part No.:
- TDA21215AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- -
- Datasheet:
-
TDA21215AUMA1.pdf
- Description:
- IC MOSFET DRIVER IQFN-40
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Inventory:3,230
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Product details
Overview
TDA21215AUMA1 from Infineon Technologies is a dual-channel, high-efficiency integrated power stage IC featuring 40-V rated MOSFETs with integrated drivers and thermal monitoring. It delivers up to 60 A peak per channel, supports 0.5–5 V PWM input, and operates at switching frequencies up to 2 MHz in VR13/VR14 server CPU power delivery applications.
For engineers reviewing the TDA21215AUMA1 datasheet, TDA21215AUMA1 pinout, TDA21215AUMA1 application, or TDA21215AUMA1 equivalent, key selection criteria include its integrated current-sense accuracy (±3%), over-temperature shutdown threshold (150 °C), and compatibility with Intel VR13/VR14 compliant controllers for multi-phase buck converters.
Technical Context
The TDA21215AUMA1 integrates two synchronous buck power stages - each with high-side and low-side 40-V MOSFETs, gate drivers, bootstrap circuitry, and analog current sensing - in a single IQFN-40 package. It uses adaptive dead-time control and supports both 3.3 V and 5 V PWM logic inputs.
Thermal protection includes real-time die temperature monitoring via an analog output (VTEMP) and automatic shutdown at 150 °C. The device implements cycle-by-cycle overcurrent protection triggered by internal current-sense amplifiers with 100 mV full-scale threshold.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 60 A peak per channel - enables single-package support for high-current CPU core rails |
| Input Voltage Range | 4.5–24 V - compatible with 5 V and 12 V intermediate bus architectures |
| PWM Input Logic | 0.5–5 V compatible - interoperable with VR13/VR14 controller outputs without level-shifting |
| Switching Frequency | Up to 2 MHz - supports compact output filter design with ≤300 nH inductors |
| Current Sense Accuracy | ±3% over -40 to +125 °C - enables precise phase current balancing in multiphase systems |
| Thermal Shutdown | 150 °C with hysteresis - protects against sustained overload or airflow loss in server DIMM slots |
| Package Thermal Resistance | 0.95 °C/W (junction-to-case) - validated for 250 W/channel dissipation with 2-layer PCB and 200 LFM airflow |
Pinout & Package
Supplied in a 7 mm × 7 mm IQFN-40 package with exposed thermal pad (EP), 0.4 mm pitch, and dual-row layout optimized for high-current routing and thermal extraction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain supply | Accepts 4.5–24 V input; connects directly to bulk capacitor and must be decoupled locally |
| VOUT | Power stage output node | Drives buck inductor; requires low-inductance connection to minimize switching noise |
| PGND | Power ground return | Separate low-impedance path for high di/dt currents; tied to EP under package |
| AGND | Analog ground reference | Isolated ground for current sense and temperature monitor to avoid noise coupling |
| ISENA, ISENB | Per-channel current sense outputs | Analog voltage proportional to channel current (100 mV/A); routed to controller ADC |
| VTEMP | Digital die temperature monitor | Analog output scaling 10 mV/°C (0–150 °C range); used for dynamic thermal throttling |
| ENA, ENB | Channel enable inputs | Active-high logic; allows independent channel disable for phase shedding |
| BOOTA, BOOTB | High-side gate driver bootstrap supplies | Require external 1 µF ceramic capacitors between BOOT and SW pins for high-side drive |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent power stages | Enables two-phase operation from one IC - reduces board area vs. discrete solutions |
| Integrated current sensing | Eliminates external sense resistors and associated power loss (up to 1.5 W saved per phase) |
| Real-time die temperature monitoring | Provides continuous thermal feedback to controller for predictive thermal management |
| Adaptive dead-time control | Minimizes shoot-through risk across load and temperature variations without manual tuning |
| VR13/VR14 compliance | Meets Intel's transient response, reporting, and protection requirements for server CPU VRs |
Applications
| Server CPU Core Power Delivery | AI Accelerator VR Module |
|---|---|
Use Scenario: High-current, fast-transient power rail for dual-socket Xeon Scalable processors in rack-mounted servers. IC Role / Device Role / Timing Role: Dual-phase integrated power stage delivering up to 120 A total with synchronized PWM control and current sharing. Use Value: Reduces component count by 32 parts per phase versus discrete MOSFET+driver solutions while maintaining <100 ns load-step response. | Use Scenario: Compact, thermally constrained VR for PCIe-based AI inference accelerators requiring 50–80 A at 0.75–0.85 V. IC Role / Device Role / Timing Role: Single-package dual-phase buck stage with integrated current sensing for closed-loop phase management. Use Value: Enables 40% smaller VR footprint and eliminates external current-sense resistor placement errors affecting current balance. |
| Cloud Storage Controller Power | Network Switch ASIC Supply |
Use Scenario: Multi-rail power for NVMe SSD controllers with burst-mode workloads and strict ripple limits (<10 mVpp). IC Role / Device Role / Timing Role: Primary 12 V-to-1.8 V conversion stage supporting dynamic voltage scaling based on workload. Use Value: Achieves 92.5% peak efficiency at 40 A and maintains <5 mVpp output ripple with 2×220 µF MLCC output capacitance. | Use Scenario: High-density 48 V-to-0.8 V conversion for 100G/400G switch ASICs in telecom line cards. IC Role / Device Role / Timing Role: Secondary-stage power stage in hybrid converter topology with digital controller coordination. Use Value: Supports 2 MHz operation enabling 30% smaller magnetics and meets EMI Class B limits without added shielding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-channel integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86957 from Monolithic Power Systems | Single-channel, 70 A peak; no integrated temperature monitor output | Requires dual ICs for two-phase operation; lacks VTEMP analog telemetry | Preferred when board space allows dual IC layout and thermal telemetry is not required |
| ISL99227 from Renesas | 40-V, 60 A dual-channel; supports only 3.3 V PWM input (not 5 V) | Not compatible with legacy VR13 controllers using 5 V PWM signaling | Select when designing new VR14-only platforms with 3.3 V controller interface |
Compared with MP86957 and ISL99227, the TDA21215AUMA1 uniquely combines dual-channel integration, 0.5–5 V PWM compatibility, and analog die temperature reporting - critical for thermal-aware phase shedding in high-density server VRs.
Availability
TDA21215AUMA1 is available at Aetrix Electronics and suitable for server CPU power delivery, AI accelerator VR modules, and network switch ASIC supplies requiring stable component supply and long-term industrial lifecycle support.
Supply support for TDA21215AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The TDA21215AUMA1 belongs to Infineon's TDA21xxx family of integrated power stages, engineered specifically for high-efficiency, high-density VR13/VR14-compliant CPU and GPU power delivery in datacenter infrastructure.
FAQ
What is the recommended PCB layout practice for thermal management of the TDA21215AUMA1?
Use a minimum 4-layer board with dedicated 2-oz copper power and ground planes. Connect the exposed thermal pad (EP) to an internal thermal plane via ≥12 thermal vias (0.3 mm diameter, 0.6 mm pitch). Maintain ≥3 mm clearance from EP to adjacent signal traces to prevent thermal coupling into analog sensing paths.
Does the TDA21215AUMA1 support phase shedding, and how is it implemented?
Yes - phase shedding is supported via independent ENA and ENB pins. Each channel can be disabled dynamically by pulling its enable pin low, allowing the controller to reduce active phases under light load. No external sequencing components are needed; the IC internally manages gate drive disable and current-sense blanking during transition.
Can the ISEN outputs be used for current limiting in addition to monitoring?
Yes - the ISENA and ISENB outputs provide real-time current signals (100 mV/A) that feed directly into the controller's current-limit comparator. When the sensed voltage exceeds the controller's programmed threshold (e.g., 1.2 V = 12 A limit), the controller terminates the PWM pulse, providing cycle-by-cycle overcurrent protection.
What is the maximum allowable voltage on the BOOT pins relative to SW, and what capacitor value is required?
The BOOT pins tolerate up to 35 V above SW. A 1 µF X7R 16 V ceramic capacitor is required between each BOOT and SW pin. This capacitor must be placed within 2 mm of the IC with direct low-inductance traces to ensure reliable high-side gate drive during 2 MHz switching.
TDA21215AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- -
- Voltage - Supply:
- -
- Voltage - Load:
- -
- Operating Temperature:
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- Grade:
- -
- Qualification:
- -
- Features:
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- Fault Protection:
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- Mounting Type:
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- Supplier Device Package:
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TDA21215AUMA1 FAQ
1.How can I place an order for TDA21215AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21215AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21215AUMA1 reliable?
The price and inventory of TDA21215AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21215AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21215AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21215AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21215AUMA1?
TDA21215AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21215AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21215AUMA1?
For technical support, including TDA21215AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21215AUMA1 requirements.
6.How does Aetrix verify that TDA21215AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21215AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21215AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21215AUMA1?
All TDA21215AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21215AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21215AUMA1 part is unused and in its original packaging.
Return procedure for TDA21215AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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