Infineon Technologies TDA21241AUMA1
- Part No.:
- TDA21241AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 30-PowerTFQFN
- Datasheet:
-
TDA21241AUMA1.pdf
- Description:
- IC HALF BRIDGE DRIVER 35A 30IQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,416
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Product details
Overview
TDA21241AUMA1 from Infineon is a multichip power stage module integrating a 25 V high-side and low-side MOSFET pair with a high-frequency gate driver in a single PG-IQFN-30-2 (4 × 4 × 1 mm³) package. It delivers up to 35 A average output current, supports 4.5–16 V input, operates up to 1 MHz PWM frequency, and features tri-state PWM input, thermal warning (PHFLT#), and shoot-through protection - deployed in CPU/GPU VRMs on desktop/server motherboards and graphics cards.
For engineers reviewing the TDA21241AUMA1 datasheet, TDA21241AUMA1 pinout, TDA21241AUMA1 application in synchronous buck POL regulation, or TDA21241AUMA1 equivalent for high-density VRM design, this page provides verified pin functions, thermal warning behavior, gate drive voltage requirements (VCC = 4.5–7 V, PVCC = 4.5–7 V), and real-world switching timing (t_pdll = 10 ns, t_pdlu = 20 ns).
Technical Context
The TDA21241AUMA1 implements a monolithic synchronous buck power stage with integrated bootstrap diode, UVLO on BOOT and VCC rails, and independent AGND/PGND separation for noise isolation. Its gate driver accepts 3.3 V logic-level PWM and EN signals, drives both MOSFETs with +5 V gate voltage, and includes internal shoot-through prevention logic that enforces dead-time between HS and LS transitions.
Thermal warning is implemented via the open-drain PHFLT# pin, pulled low at 140 °C junction temperature with ±10 K accuracy and 10 K hysteresis. The module's optimized layout minimizes parasitic inductance - critical for >500 kHz operation - and achieves ~60 W power density within 16 mm² footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 35 A average - defines maximum continuous load capability in single-phase VRM designs |
| Input Voltage Range | 4.5 V to 16 V DC - supports 5 V, 12 V, and telecom 13.2 V input rails with boot resistor option |
| Switching Frequency | Up to 1.0 MHz - enables compact magnetics and high transient response in POL applications |
| Gate Drive Voltage | +5 V for HS & LS MOSFETs - ensures optimal RDS(on) and conduction loss at light and heavy loads |
| Thermal Warning Threshold | 140 °C ±10 K - triggers PHFLT# low to signal thermal fault without shutdown, enabling system-level mitigation |
| UVLO Thresholds | VUVLOBOOT_R = 4.0 V, VUVLO_R = 4.2 V - prevents erratic operation during power-up/down sequencing |
| PWM Propagation Delay | tpdll = 10 ns (turn-on), tpdlu = 20 ns (turn-off) - supports precise timing control in multi-phase digital controllers |
Pinout & Package
Package: PG-IQFN-30-2 (4 mm × 4 mm × 1 mm), thermally enhanced with exposed PGND pad and dual ground systems (AGND for logic, PGND for power).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 3, 29 | VCC / PVCC / VIN Power Supply | VCC powers logic core (4.5–7 V); PVCC drives gates (4.5–7 V); VIN supplies HS MOSFET drain (4.5–16 V) |
| 2 | PWM Input | 3.3 V logic-compatible tri-state input; recognizes 0.6 V low / 2.6 V high thresholds |
| 6, 7 | BOOT / PHASE | BOOT connects to external capacitor; PHASE is switch node reference for bootstrap circuit |
| 16–23 | SW Output | High-current switch node output - must be routed with low-inductance copper to minimize ringing |
| 24–27 | GL Test Point | Accessible low-side gate signal for probing; not intended as functional I/O |
| 30 | PHFLT# | Open-drain thermal warning output; requires external pull-up to 3.3 V; asserts low at 140 °C |
| 1, 5, 4, 13–15, 28 | AGND / PGND | AGND is logic ground; PGND is power ground - must be connected externally with low-inductance vias |
| 1 | EN | Active-high enable; tie to GND to disable IC and reduce quiescent current to 710 μA |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diode | Eliminates external diode component and associated PCB area, reducing BOM count and layout complexity |
| Tri-State PWM Input | Supports dynamic phase shedding in multi-phase controllers by allowing high-impedance PWM state without affecting gate drive |
| Dual Ground Architecture | Separate AGND (logic) and PGND (power) planes prevent noise coupling into control circuitry during high di/dt switching |
| Shoot-Through Protection | Hardware-enforced dead-time prevents simultaneous HS/LS conduction, eliminating destructive shoot-through current |
| Thermal Warning Pin (PHFLT#) | Provides early overtemperature alert before thermal shutdown, enabling predictive thermal management in server VRMs |
Applications
| Desktop CPU Core VRM | Server GPU Power Stage |
|---|---|
Use Scenario: Primary 12 V-to-core-voltage conversion for Intel/AMD desktop CPUs with dynamic load steps up to 300 A/μs. IC Role / Device Role / Timing Role: Single-phase power stage delivering up to 35 A per phase; synchronized to digital multi-phase controller via 3.3 V PWM. Use Value: High power density (60 W in 16 mm²) and <10 ns turn-on delay enable tight voltage regulation under fast load transients. | Use Scenario: Point-of-load regulation for NVIDIA/AMD datacenter GPUs requiring stable 0.7–1.2 V at up to 600 A total. IC Role / Device Role / Timing Role: Multiphase building block used in parallel configurations; PHFLT# feeds thermal telemetry to BMC for fan control and throttling. Use Value: Integrated thermal warning and ±10 K accuracy allow real-time die temperature monitoring without external sensors. |
| Notebook DDR5 Memory Regulator | Industrial DC-DC VR Module |
Use Scenario: Compact 5 V-to-1.1 V conversion for DDR5 SODIMM modules in thin-and-light notebooks with strict height constraints. IC Role / Device Role / Timing Role: Single-phase buck stage operating at 1 MHz; leverages tri-state PWM for seamless phase add/drop during power state transitions. Use Value: 1 mm profile and 4 × 4 mm footprint meet ultra-thin notebook mechanical requirements while maintaining 35 A capability. | Use Scenario: High-reliability 24 V-to-3.3 V POL supply in industrial PLCs and motor drives requiring JEDEC JESD47 qualification. IC Role / Device Role / Timing Role: Robust power stage rated for -40 to 125 °C operation; UVLO and shoot-through protection ensure fail-safe behavior in harsh environments. Use Value: Qualified to JEDEC JESD22-A108 (temperature cycling) and J-STD-020 (moisture sensitivity), supporting 10+ year field life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35201MTRPBF | Discrete driver + external MOSFETs; no integrated bootstrap diode; 40 A rating but larger footprint (5 × 6 mm) | Requires external gate resistors, bootstrap diode, and careful layout to match TDA21241AUMA1's low-inductance performance | Select when board space allows discrete optimization or when higher current (>35 A) per phase is needed |
| MP87653GQH-P | Monolithic 40 V, 30 A power stage; lower max fSW (2 MHz vs 1 MHz); no PHFLT# pin; different pinout (QFN-21) | Lacks thermal warning output and tri-state PWM support - limits use in advanced digital VRM architectures | Select for cost-sensitive telecom 48 V input applications where thermal telemetry is not required |
Compared with IR35201MTRPBF and MP87653GQH-P, the TDA21241AUMA1 uniquely combines integrated bootstrap diode, PHFLT# thermal telemetry, and tri-state PWM in a 4 × 4 mm package - making it optimal for space-constrained, thermally managed multi-phase VRMs in servers and high-end graphics.
Availability
TDA21241AUMA1 is available at Aetrix Electronics and suitable for desktop CPU VRMs, server GPU power stages, notebook DDR5 regulators, and industrial DC-DC VR modules requiring stable component supply across extended product lifecycles.
Supply support for TDA21241AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon and GaN power devices.
The TDA21241AUMA1 belongs to Infineon's DrMOS family - engineered specifically for high-efficiency, high-density point-of-load regulation in advanced microprocessor and GPU power delivery systems.
FAQ
What is the function of the PHFLT# pin, and how should it be interfaced?
The PHFLT# pin is an open-drain thermal warning output that pulls low when junction temperature reaches 140 °C ±10 K. It requires an external 3.3 V pull-up resistor (typically 10 kΩ). When asserted, it signals impending thermal shutdown, enabling system-level actions like fan speed increase or clock throttling - but does not disable the device automatically.
Can TDA21241AUMA1 operate with a 3.3 V gate drive voltage instead of 5 V?
No - the internal MOSFETs are optimized for 5 V gate drive (PVCC = 4.5–7 V). Using 3.3 V would significantly increase RDS(on), causing excessive conduction losses and thermal stress. The datasheet specifies +5 V HS/LS gate drive as mandatory for rated 35 A performance and efficiency.
How is shoot-through protection implemented, and can it be disabled?
Shoot-through protection is hardwired logic inside the gate driver that enforces minimum dead-time between HS turn-off and LS turn-on (and vice versa). It cannot be disabled or adjusted - this hardware safeguard prevents destructive current flow during switching transitions under all operating conditions.
What is the recommended PCB layout practice for AGND and PGND connections?
AGND (pins 1, 5) and PGND (pins 4, 13–15, 28, and exposed pad) must be connected externally using multiple low-inductance vias to separate ground planes. AGND serves the logic circuitry and must be isolated from high di/dt PGND currents; mixing them degrades UVLO stability and increases PWM jitter.
TDA21241AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 30-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 35A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Over Temperature, Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-30-2
TDA21241AUMA1 FAQ
1.How can I place an order for TDA21241AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21241AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21241AUMA1 reliable?
The price and inventory of TDA21241AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21241AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21241AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21241AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21241AUMA1?
TDA21241AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21241AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21241AUMA1?
For technical support, including TDA21241AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21241AUMA1 requirements.
6.How does Aetrix verify that TDA21241AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21241AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21241AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21241AUMA1?
All TDA21241AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21241AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21241AUMA1 part is unused and in its original packaging.
Return procedure for TDA21241AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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