Infineon Technologies TDA21242AUMA1
- Part No.:
- TDA21242AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 30-PowerTFQFN
- Datasheet:
-
TDA21242AUMA1.pdf
- Description:
- IC HALF BRIDGE DRIVER 25A 30IQFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,481
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Product details
Overview
TDA21242AUMA1 from Infineon Technologies is a multichip power stage module integrating a 25 A synchronous buck gate driver, high-side and low-side MOSFETs in a single PG-IQFN-30-2 (4 × 4 × 1 mm³) package. It operates with 4.5–16 V input, supports >500 kHz switching, delivers up to 25 A average output current, and features tri-state PWM compatibility, thermal warning (PHFLT#), and shoot-through protection - deployed in CPU/GPU VRMs on desktop/server motherboards and graphics cards.
For engineers reviewing the TDA21242AUMA1 datasheet, TDA21242AUMA1 pinout, TDA21242AUMA1 application, or TDA21242AUMA1 equivalent, key selection criteria include its 25 A continuous current rating, 5 V gate drive capability for both HS/LS MOSFETs, integrated bootstrap diode, remote disable (EN), and thermal warning functionality with ±10 K accuracy at 140 °C trip point.
Technical Context
The TDA21242AUMA1 implements a monolithic synchronous buck power stage with dedicated AGND and PGND planes, enabling precise separation of control and power return paths. Its gate driver accepts independent VCC (5 V logic supply) and PVCC (5 V gate drive supply), supports tri-state PWM inputs (1.2–2.0 V shutdown window), and incorporates UVLO on BOOT (4.0 V rising / 3.8 V falling) and VCC (4.2 V rising / 3.7 V falling).
It features fast propagation delays (t_pdll = 10 ns turn-on, t_pdlu = 20 ns turn-off), 15 ns tri-state-to-SW response, and robust switching node tolerance (VSW/PHASE: −1 to +25 V DC; AC spikes limited to 322 V for ≤2 ns). Thermal warning (PHFLT#) asserts low at 140 °C with 10 K hysteresis and 37.5–80 Ω pull-down resistance under fault.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 25 A average - defines maximum sustained load for CPU/GPU core rail regulation |
| Input Voltage Range | 4.5 V to 16 V - supports 5 V, 12 V, and telecom 13.2 V input rails with boot resistor option |
| Switching Frequency | Up to 1.0 MHz - enables compact magnetics and high-density VRM designs |
| Gate Drive Voltage | +5 V for HS & LS MOSFETs - ensures optimal RDS(on) and conduction loss at light/heavy loads |
| Thermal Warning Threshold | 140 °C ±10 K - provides early overtemperature indication before thermal shutdown |
| UVLO Threshold (VCC) | 4.2 V rising / 3.7 V falling - prevents erratic operation during brown-out conditions |
| Package Thermal Resistance | θJA = 13 K/W (8-layer server board) - enables thermal management in high-power density applications |
Pinout & Package
Package: PG-IQFN-30-2 (4 mm × 4 mm × 1 mm), RoHS-compliant, thermally enhanced with exposed PGND pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 EN | Enable input | Active-high logic control (0–0.8 V low, 2.0–3.3 V high); tie to GND to disable module |
| 2 PWM | PWM logic input | Tri-state compatible 3.3 V interface; 1.2–2.0 V range disables output regardless of state |
| 6 BOOT | Bootstrap supply | Connects to external bootstrap capacitor; referenced to PHASE node for HS gate drive |
| 7 PHASE | Switch node reference | Internally tied to SW; serves as return for BOOT capacitor and HS driver reference |
| 16–23 SW | High-current switch node | Power output terminal connecting to inductor; must be routed with low-inductance copper |
| 24–27 GL | Low-side gate test point | Accessible signal for probing LS MOSFET gate waveform during debug or validation |
| 30 PHFLT# | Thermal warning output | Open-drain logic-low alert at 140 °C; requires external pull-up to 3.3 V |
| 8–12, 29 VIN / PVCC | Power inputs | VIN supplies HS drain; PVCC powers both gate drivers (5 V nominal) |
| 3, 5, 4/13–15/28 VCC / AGND / PGND | Bias & ground returns | VCC/AGND for logic; multiple PGND pins require low-inductance vias to power plane |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diode | Eliminates external diode, reducing BOM count and layout area in high-frequency buck stages |
| Shoot-Through Protection | Hardware-level dead-time enforcement prevents simultaneous HS/LS conduction and catastrophic current spikes |
| Remote Driver Disable | EN pin allows system-level power sequencing and safe shutdown without controller intervention |
| Optimized Light-Load Efficiency | Gate timing tuned to minimize switching losses at low duty cycles typical in modern CPU C-states |
| Thermal Warning with Hysteresis | PHFLT# alerts at 140 °C with 10 K hysteresis, enabling graceful throttling before thermal shutdown |
Applications
| CPU Core Voltage Regulation | GPU Power Delivery |
|---|---|
Use Scenario: Regulating 0.6–1.2 V core voltage for Intel/AMD desktop/server CPUs with dynamic load steps up to 25 A/μs. IC Role / Device Role / Timing Role: Integrated power stage providing high-current, high-efficiency buck conversion synchronized to digital multi-phase controller PWM. Use Value: Enables <1.5% output voltage deviation under 50 A transient load with sub-100 ns response, leveraging low-inductance PG-IQFN package and matched MOSFETs. | Use Scenario: Delivering stable 0.8–1.1 V to discrete GPU cores (e.g., NVIDIA RTX series) on PCIe graphics cards with tight ripple (<10 mVpp) requirements. IC Role / Device Role / Timing Role: Single-phase POL power stage controlled by GPU VR controller; PHFLT# feeds thermal telemetry to GPU firmware. Use Value: Achieves >92% peak efficiency at 12 V input / 0.9 V @ 20 A, reducing board-level heat density versus discrete MOSFET+driver solutions. |
| DDR Memory VRM | High-Density Server VRM |
Use Scenario: Supplying 1.2 V or 1.35 V to DDR4/DDR5 memory modules in dual-channel server DIMMs with strict EMI limits. IC Role / Device Role / Timing Role: Compact, shielded power stage minimizing layout parasitics to meet CISPR-32 Class B conducted emissions. Use Value: Delivers <5 mVpp output ripple at 1 MHz switching, enabled by integrated gate driver timing and low-ESR internal MOSFETs. | Use Scenario: Building scalable 4–8 phase VRMs for AI accelerator cards requiring >400 W total core power in 2U chassis. IC Role / Device Role / Timing Role: Drop-in replaceable power stage per phase, supporting interleaved PWM with <15 ns propagation skew across phases. Use Value: Reduces per-phase footprint by 35% vs. discrete solution while maintaining θJA ≤13 K/W on 8-layer PCB with 2 oz copper. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP86957GQ-Z (Monolithic Power Systems) | 20 A max current, 5 V gate drive, no integrated thermal warning pin | Lacks PHFLT# output; requires external temperature monitoring IC for thermal telemetry | Preferred where cost sensitivity outweighs need for embedded thermal alerting |
| ISL99227BIRZ (Renesas) | 30 A max current, 5 V gate drive, includes thermal warning but uses analog voltage output (not open-drain) | Analog THRM pin requires ADC input; incompatible with digital GPIO-based fault handling | Chosen when system already includes ADC resources and needs higher current headroom |
Compared with MP86957GQ-Z and ISL99227BIRZ, the TDA21242AUMA1 uniquely combines 25 A capability, open-drain thermal warning (PHFLT#), tri-state PWM support, and shoot-through protection in a 4×4 mm package-making it optimal for space-constrained, thermally aware CPU/GPU VRMs requiring minimal external components.
Availability
TDA21242AUMA1 is available at Aetrix Electronics and suitable for CPU core regulation, GPU power delivery, DDR memory VRMs, and high-density server VRMs requiring stable component supply, JEDEC-qualified reliability, and thermal-aware power staging.
Supply support for TDA21242AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and advanced power stage integration.
The TDA21242AUMA1 belongs to Infineon's DrMOS family, designed specifically for high-efficiency, high-frequency, digitally controlled voltage regulator modules targeting next-generation microprocessors and graphics processors.
FAQ
What is the function of the PHFLT# pin and how should it be interfaced?
The PHFLT# pin is an open-drain thermal warning output that pulls low when junction temperature reaches 140 °C ±10 K. It must be externally pulled up to 3.3 V via a resistor (typically 4.7–10 kΩ). No external driver is needed - the pin sinks up to 8 mA and has 37.5–80 Ω on-resistance. Leaving it open disables thermal alerting.
Can the TDA21242AUMA1 operate with a 3.3 V gate drive supply (PVCC)?
No. The TDA21242AUMA1 requires PVCC = 4.5–7 V (typical 5 V) to properly drive both high-side and low-side MOSFETs. At 3.3 V, the internal MOSFETs cannot achieve specified RDS(on) or switching performance, risking excessive conduction loss and thermal runaway under 25 A load.
How does the tri-state PWM input improve light-load efficiency?
The tri-state PWM input allows the controller to float the PWM line into a high-impedance state (1.2–2.0 V window), forcing the TDA21242AUMA1 to enter discontinuous conduction mode (DCM) with zero-voltage switching. This eliminates reverse recovery losses in the low-side MOSFET and reduces gate drive power, improving efficiency by up to 8% at 10% load compared to forced PWM operation.
Is the TDA21242AUMA1 compatible with digital multi-phase controllers such as IR35201 or ISL68127?
Yes. The TDA21242AUMA1 is explicitly designed for interoperability with Infineon's and third-party digital multi-phase controllers. Its 3.3 V logic-compatible PWM input, 10–20 ns propagation delays, and tri-state support align with IR35201 and ISL68127 timing specifications. Layout guidelines recommend separate AGND and PGND planes with ≥6 vias per PGND pad for optimal noise immunity.
TDA21242AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 30-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Half Bridge
- Applications:
- Synchronous Buck Converters
- Interface:
- PWM
- Load Type:
- Inductive
- Technology:
- Power MOSFET
- Rds On (Typ):
- -
- Current - Output / Channel:
- 25A
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.5V ~ 7V
- Voltage - Load:
- 4.5V ~ 16V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- Bootstrap Circuit
- Fault Protection:
- Over Temperature, Shoot-Through, UVLO
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-30-2
TDA21242AUMA1 FAQ
1.How can I place an order for TDA21242AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21242AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21242AUMA1 reliable?
The price and inventory of TDA21242AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21242AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21242AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21242AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21242AUMA1?
TDA21242AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21242AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21242AUMA1?
For technical support, including TDA21242AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21242AUMA1 requirements.
6.How does Aetrix verify that TDA21242AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21242AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21242AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21242AUMA1?
All TDA21242AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21242AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21242AUMA1 part is unused and in its original packaging.
Return procedure for TDA21242AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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