Infineon Technologies TDA21462AUMA1
- Part No.:
- TDA21462AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 39-PowerVFQFN
- Datasheet:
-
TDA21462AUMA1.pdf
- Description:
- IC GATE DRVR C_IFX POWERSTAGE
- Quantity:
- Payment:

- Shipping:

Inventory:4,940
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Product details
Overview
TDA21462AUMA1 from Infineon Technologies is a co-packaged OptiMOS™ power stage integrating synchronous buck gate driver, high-side and low-side MOSFETs, and Schottky diode in a single 5 mm × 6 mm PQFN package. It delivers up to 70 A output current, supports input voltage from 4.25 V to 16 V, operates at switching frequencies up to 1.5 MHz, and provides on-chip 5 mV/A current sensing with temperature compensation for CPU core power delivery in server applications.
For engineers reviewing the TDA21462AUMA1 datasheet, TDA21462AUMA1 pinout, TDA21462AUMA1 application, or TDA21462AUMA1 equivalent, key selection criteria include its integrated current sense accuracy (±0.8 A offset), deep-sleep mode for PS3/PS4 power states, bootstrap auto-replenishment, body-braking transient support, and compatibility with 3.3-V tri-state PWM control interfaces.
Technical Context
The TDA21462AUMA1 implements a synchronous buck topology with internal gate driver logic that enforces anti-shoot-through timing between high-side and low-side MOSFETs. Its phase-fault detection monitors HS FET short conditions via PHASE node monitoring, while cycle-by-cycle over-current protection uses programmable OCSET resistor biasing to set thresholds from fixed 80 A down to lower values.
Current sensing relies on RDS(on)-based emulation referenced to REFIN (1.1–2.0 V), delivering 5 mV/A output at IOUT with ±0.8 A offset trim. Temperature reporting is analog: TOUT outputs 8 mV/°C + 0.6 V, enabling real-time junction monitoring and thermal shutdown at 150 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.25 V to 16 V - supports wide-input industrial and server DC-DC rails without external pre-regulation |
| Max Output Current | 70 A - defines continuous load capability before OCP activation; enables single-phase CPU core supply in mid-tier servers |
| Switching Frequency | Up to 1.5 MHz - allows smaller output inductors and capacitors while maintaining fast transient response |
| Current Sense Accuracy | 5 mV/A ±0.8 A offset - enables precise multiphase current balancing and dynamic phase shedding |
| Thermal Reporting | 8 mV/°C + 0.6 V on TOUT - provides linear analog junction temperature feedback for system-level thermal management |
| Deep-Sleep Quiescent Current | <0.2 µA - reduces idle power in PS3/PS4 states without disabling fault monitoring |
| Package | 5 mm × 6 mm × 1 mm PQFN - optimized for PCB thermal spreading and minimal switch-node ringing with proper layout |
Pinout & Package
Package: 40-pin PQFN (5 mm × 6 mm × 1 mm), RoHS-compliant, exposed thermal pad (Pin 24) for direct PCB thermal coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 25–30) | High-current input supply | Parallel connection of six pins minimizes IR drop and inductance for >70 A peak currents |
| SW (Pins 10–19) | Switch node | 10-pin parallel connection reduces parasitic inductance and EMI during high di/dt transitions |
| GATEL (Pins 6, 41) | Low-side gate drive output | Accessible for oscilloscope probing to verify dead-time and gate waveform integrity |
| BOOT (Pin 33) | Bootstrap capacitor supply | Requires ≥0.22 µF X7R ceramic; adds 2 Ω series resistor if VIN > 13.2 V to limit charge current |
| PWM (Pin 34) | 3.3-V tri-state logic input | Supports high-Z state to disable both FETs-critical for body-braking and phase shedding |
| OCSET (Pin 37) | OCP threshold programming | Resistor-to-LGND sets custom current limit; floating defaults to ~80 A typical |
| TOUT/FLT (Pin 36) | Temp output / fault flag | Normal operation: 8 mV/°C analog; fault condition pulls to 3.3 V for controller interrupt |
| IOUT (Pin 38) | Current sense output | Differential signal vs. REFIN; 5 mV/A scaling enables accurate phase current readback |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MOSFET current sensing | 5 mV/A with ±0.8 A offset trim and temperature compensation - eliminates need for external DCR sensing network and improves current matching across phases |
| Auto-replenishing bootstrap circuit | Prevents under-voltage on BOOT during extended low-duty-cycle operation - ensures reliable high-side FET turn-on in light-load and deep-sleep modes |
| Body-braking load transient support | VOS pin enables active discharge of output inductor energy during sudden load drops - reduces output voltage overshoot without external components |
| Phase fault detection | Monitors PHASE node for HS FET short-to-rail - asserts FLT flag before catastrophic failure, enabling graceful phase disable |
| Deep-sleep ultra-low IQ mode | <0.2 µA quiescent current with EN = 0 V - maintains fault monitoring while cutting standby power by >99% vs. active mode |
Applications
| Server CPU Core Power | AI Accelerator GPU Supply |
|---|---|
Use Scenario: Dual-socket x86 server motherboard delivering dynamic 12–70 A per phase to CPU cores under SPECpower workload cycles. IC Role / Device Role / Timing Role: Single-phase power stage in multiphase VR13/VR14-compliant regulator delivering 0.25–1.8 V at up to 1.5 MHz. Use Value: Integrated current sense enables precise per-phase current reporting for digital controller-based phase shedding, improving efficiency by 2–3% at light loads. | Use Scenario: PCIe-based AI training card powering NVIDIA A100-class GPU memory and compute domains with fast load transients. IC Role / Device Role / Timing Role: High-frequency (1.2 MHz) phase in DDR5 memory rail and GPU core rail, supporting body-braking during inference burst termination. Use Value: VOS-enabled body braking reduces 12 V → 0.8 V transient overshoot from 120 mV to <40 mV, eliminating need for extra bulk capacitance. |
| DDR5 Memory Subsystem | Edge AI Inference Module |
Use Scenario: DDR5 UDIMM power module supplying 1.1 V to 1.8 V at up to 40 A with tight regulation (<±15 mV) across temperature. IC Role / Device Role / Timing Role: Dedicated power stage for VDDQ/VPP rails with REFIN-biased current sensing referenced to controller's analog reference. Use Value: 5 mV/A current output referenced to stable REFIN (1.1–2.0 V) achieves ±2% current measurement accuracy across –40°C to +125°C. | Use Scenario: Fanless edge inference box using ARM-based SoC with bursty NPU workloads requiring rapid 0→50 A transitions. IC Role / Device Role / Timing Role: Primary power stage in compact 2-phase VR delivering 0.6–0.9 V at 1.5 MHz with deep-sleep entry on idle detection. Use Value: Deep-sleep mode cuts quiescent power to <1 mW per phase, extending battery runtime by 3.2× in always-on vision analytics use cases. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL99390HRZ-T | 40-A rated, 3.3-V PWM compatible, but lacks integrated temperature reporting and deep-sleep mode | No analog TOUT output; requires external temp sensor for thermal loop closure | Select when cost sensitivity outweighs need for on-die thermal telemetry and ultra-low-power idle states |
| MP86957DQKT-Z | 60-A rated, includes current sense but uses external DCR sensing; no VOS pin for body braking | Requires external RC network for transient suppression; less accurate current reporting due to DCR drift | Prefer for legacy designs already using DCR-based controllers and where board space permits added passive components |
Compared with ISL99390HRZ-T and MP86957DQKT-Z, the TDA21462AUMA1 uniquely integrates temperature-proportional analog output, deep-sleep IQ <0.2 µA, and VOS-based body braking-enabling tighter thermal control, longer battery life in edge systems, and reduced output capacitance in high-transient applications.
Availability
TDA21462AUMA1 is available at Aetrix Electronics and suitable for server CPU core power, AI accelerator GPU supply, and DDR5 memory subsystems requiring stable component supply, long-lifecycle availability, and validated thermal performance under sustained 70-A loads.
Supply support for TDA21462AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and RF solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The TDA21462AUMA1 belongs to Infineon's OptiMOS™ Power Stage product line, engineered specifically for high-efficiency, high-density CPU/GPU/DDR power delivery in datacenter and AI infrastructure where thermal headroom, transient response, and current-sense fidelity are critical.
FAQ
What is the recommended bootstrap capacitor value and placement for TDA21462AUMA1?
A minimum 0.22 µF X7R ceramic capacitor must be placed directly between BOOT and PHASE pins. For VIN > 13.2 V, a 2 Ω resistor must be added in series with the capacitor to limit inrush current. Layout requires shortest possible trace length and direct connection to the thermal pad ground plane to minimize ringing and ensure reliable high-side gate drive.
How does the TDA21462AUMA1 implement body-braking during load transients?
Body-braking is enabled via the VOS pin, which connects to the converter output. When load drops rapidly, the controller drives VOS low, activating internal circuitry that turns on the low-side MOSFET to actively sink inductor current. This prevents output voltage overshoot without requiring external Schottky clamps or complex controller firmware.
Can the TDA21462AUMA1 operate with a 12-V input and 0.8-V output at 1.5-MHz switching frequency?
Yes. The device supports VIN from 4.25 V to 16 V and VOUT from 0.25 V to 5.5 V. At 1.5 MHz, it maintains >90% efficiency at 0.8 V/40 A with appropriate external components (e.g., 0.33 µH inductor, 220 µF total output capacitance), verified in Infineon's reference design RD-TDA21462-1.5MHz.
What is the function of the REFIN pin and how should it be biased?
REFIN serves as the reference voltage for the IOUT current sense amplifier. It must be tied to a stable 1.1–2.0 V source-typically the bias rail from a compatible PWM controller (e.g., ISL68127). No additional decoupling is required, as the internal amplifier is designed to reject noise from standard controller reference outputs.
TDA21462AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 39-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.25V ~ 16V
- Voltage - Load:
- -
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-39-2
TDA21462AUMA1 FAQ
1.How can I place an order for TDA21462AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21462AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21462AUMA1 reliable?
The price and inventory of TDA21462AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21462AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21462AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21462AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21462AUMA1?
TDA21462AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21462AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21462AUMA1?
For technical support, including TDA21462AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21462AUMA1 requirements.
6.How does Aetrix verify that TDA21462AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21462AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21462AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21462AUMA1?
All TDA21462AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21462AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21462AUMA1 part is unused and in its original packaging.
Return procedure for TDA21462AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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