Infineon Technologies TDA21470
- Part No.:
- TDA21470
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- -
- Datasheet:
-
TDA21470.pdf
- Description:
- IC CONTROLLER
- Quantity:
- Payment:

- Shipping:

Inventory:1,169
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA21470 from Infineon Technologies is a 25 V integrated power stage (IPS) designed for high-current CPU/GPU/DDR core power delivery in server and datacom systems. It delivers up to 70 A continuous output current, operates at switching frequencies up to 1.5 MHz, supports 4.25–16 V input, 0.25–5.5 V output, and achieves >95% peak efficiency with dual-edge-trimmed dead time control.
For engineers reviewing the TDA21470 datasheet, TDA21470 pinout, TDA21470 application, or TDA21470 equivalent, key selection criteria include its Kelvin-sense-enabled RDS(on) current reporting accuracy, programmable OCSET current limit, UVLO protection, deep-sleep PS4 mode (<200 µA), and 5×6 mm PQFN package compatibility with multi-phase VR designs.
Technical Context
The TDA21470 integrates high-side and low-side MOSFETs with a dedicated gate driver in a single multichip PQFN package, using advanced low-voltage silicon technology optimized for 5 V gate drive. Its internal current sensing relies on MOSFET RDS(on) with Kelvin GND connection and integrated temperature compensation-eliminating reliance on inductor DCR sensing.
It implements cycle-by-cycle overcurrent protection with user-programmable threshold via OCSET pin and provides a fault flag output. UVLO ensures stable startup across the 4.25–16 V input range, while PS4 deep-sleep mode reduces quiescent current to <200 µA for system-level power state management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 70 A continuous - supports high-power CPU/GPU core rails in multi-phase configurations |
| Input Voltage Range | 4.25 V to 16 V - compatible with standard 5 V, 12 V intermediate bus architectures |
| Output Voltage Range | 0.25 V to 5.5 V - covers DDR4/5, GPU core, and SoC VDD ranges |
| Switching Frequency | Up to 1.5 MHz - enables smaller passive components and faster transient response |
| Peak Efficiency | >95% at 500 kHz, 12 VIN, 1.82 VOUT - includes driver, FET, and inductor losses in measurement |
| Current Sensing | RDS(on)-based with Kelvin GND + temp compensation - ±3% full-scale accuracy vs. ±10% typical for DCR sensing |
| Quiescent Current | <200 µA in PS4 deep-sleep mode - enables ultra-low standby power in multi-rail PMIC subsystems |
Pinout & Package
Package: 5 mm × 6 mm × 0.9 mm overmolded PQFN with 0.45 mm pitch, thermally enhanced exposed pad (EP), RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain supply | Primary input power rail connection; requires local bulk and high-frequency decoupling |
| VOUT | Power stage output node | Connects directly to output inductor; forms half-bridge switching node |
| GND | Power ground reference | High-current return path; separate Kelvin GND pin available for precision current sense |
| KGND | Kelvin sense ground | Dedicated low-noise ground for RDS(on) current sensing; must be routed separately from power GND |
| OCSET | Overcurrent threshold programming | Analog voltage input (0.5–1.5 V) setting cycle-by-cycle current limit threshold |
| EN | Enable control | Active-high logic input enabling normal operation; pulls low to enter PS4 deep-sleep mode |
| FAULT | Open-drain fault indicator | Asserts low during overcurrent, UVLO, or thermal shutdown; requires external pull-up |
| EP | Exposed thermal pad | Must be soldered to PCB thermal plane for junction-to-board thermal resistance ≤ 2.5°C/W |
Key Features
| Feature | Design Value |
|---|---|
| Dual-edge-trimmed dead time | Reduces shoot-through loss and improves peak efficiency by dynamically optimizing HS/LS overlap timing |
| Integrated RDS(on) current sensing | Eliminates need for external DCR network or current-sense resistor, saving board space and BOM cost |
| Programmable OCSET threshold | Enables precise current limiting without external components-supports dynamic margining and phase shedding |
| PS4 deep-sleep mode | Reduces ICC to <200 µA while retaining configuration state, critical for multi-rail power sequencing |
| UVLO with hysteresis | Ensures clean startup and shutdown behavior across varying input conditions in server backplane environments |
Applications
| Server CPU Core VR | AI Accelerator GPU Power |
|---|---|
Use Scenario: High-current, fast-transient power delivery to dual-socket Xeon Scalable processors in 1U/2U rack servers. IC Role / Device Role / Timing Role: Integrated power stage in 6+1 or 8+1 phase buck converter delivering 0.8–1.2 V at up to 70 A per phase. Use Value: >95% efficiency at 500 kHz reduces heat density and enables higher power density without additional cooling. | Use Scenario: Multi-phase core power for NVIDIA A100 or AMD MI250X GPU modules in AI training clusters. IC Role / Device Role / Timing Role: High-frequency (1–1.5 MHz) power stage supporting rapid load-step response under dynamic compute workloads. Use Value: Dual-edge dead time trimming and Kelvin-sense accuracy enable tighter current balancing across 12+ phases. |
| DDR5 Memory Subsystem | Telecom Baseband Processor |
Use Scenario: Dedicated 1.1 V VDDQ rail for DDR5 RDIMMs in high-bandwidth memory channels. IC Role / Device Role / Timing Role: Single-phase or 2-phase power stage supplying tightly regulated, low-noise output with fast transient recovery. Use Value: PS4 deep-sleep mode (<200 µA) allows independent rail shutdown during memory self-refresh cycles. | Use Scenario: Core power for multi-core baseband SoCs in 5G macrocell and small-cell radio units. IC Role / Device Role / Timing Role: High-efficiency 0.7–1.0 V output stage operating from 48 V intermediate bus via intermediate 12 V bus. Use Value: 4.25–16 V input range accommodates wide-input DC-DC front-end variations common in telecom power architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35411 | 60 A max current, same 5×6 PQFN package, no PS4 deep-sleep mode (<1 mA IQ) | Lacks sub-200 µA low-power state; less suitable for multi-rail systems requiring fine-grained power gating | Select when peak current demand is ≤60 A and deep-sleep functionality is not required. |
| TDA21460 | 60 A rating, identical feature set and pinout, but lower RDS(on) and thermal resistance optimized for 60 A thermal envelope | Same functional compatibility; preferred where thermal margin is constrained but 70 A headroom is unnecessary | Choose for cost-optimized 60 A implementations with identical layout and firmware compatibility. |
Compared with IR35411 and TDA21460, the TDA21470 uniquely delivers 70 A capability with deep-sleep PS4 mode-enabling both higher power density and finer system-level power state control in next-gen server and AI hardware.
Availability
TDA21470 is available at Aetrix Electronics and suitable for server CPU VR, AI accelerator GPU power, and DDR5 memory subsystems requiring stable component supply across multi-year production cycles.
Supply support for TDA21470 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs, with global R&D and manufacturing infrastructure.
The TDA21470 belongs to Infineon's integrated power stage (IPS) portfolio, engineered specifically for high-efficiency, high-current point-of-load conversion in datacenter and telecom infrastructure.
FAQ
What is the recommended PCB layout practice for KGND on the TDA21470?
KGND must be routed as a dedicated, short, low-inductance trace directly to the Kelvin sense point at the source of the low-side MOSFET-separate from power GND. Avoid sharing vias or copper pours with high-current GND paths to maintain ±3% current sense accuracy. A dedicated inner-layer microstrip is preferred.
Does the TDA21470 support multiphase synchronization via external clock input?
No-the TDA21470 does not accept an external clock signal. It operates autonomously with internal oscillator and supports phase interleaving only through external controller coordination (e.g., via PWM input from a digital multiphase controller like IR35223). Synchronization is achieved at the controller level, not the IPS.
Can the OCSET pin be used for dynamic current limit adjustment during operation?
Yes-OCSET accepts a DC voltage (0.5–1.5 V) that linearly sets the cycle-by-cycle overcurrent threshold from ~40 A to 70 A. This allows real-time adaptation to changing thermal or load conditions when driven by an external DAC or analog control loop, without requiring device reset.
What thermal derating applies above 85°C case temperature?
Per Infineon's datasheet, the TDA21470 maintains full 70 A rating up to 85°C case temperature. Above 85°C, current capability derates linearly to 0 A at 125°C case, with thermal shutdown activating at 150°C junction. Required θJA must be ≤ 12°C/W for full-load operation in still air.
TDA21470 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- -
- Voltage - Supply:
- -
- Voltage - Load:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
TDA21470 FAQ
1.How can I place an order for TDA21470 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21470 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21470 reliable?
The price and inventory of TDA21470 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21470 is usually 5 days.
3.What payment methods are accepted for TDA21470?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21470 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21470?
TDA21470 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21470 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21470?
For technical support, including TDA21470 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21470 requirements.
6.How does Aetrix verify that TDA21470 is sourced from the original manufacturer or authorized distributors?
All TDA21470 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21470 meets industry standards.
7.What is the process for return or replacement of TDA21470?
All TDA21470 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21470, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21470 part is unused and in its original packaging.
Return procedure for TDA21470:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA21470 Tags
-
NCP1393BDR2G
onsemi

-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi

-
A3909GLYTR-T
Allegro MicroSystems

-
SIC631CD-T1-GE3
Vishay Siliconix

-
BTN70301EPAXUMA1
Infineon Technologies

-
TDA21520AUMA1
Infineon Technologies

-
AOZ5116QI
Alpha & Omega Semiconductor Inc.

-
IRSM005-301MHTR
Infineon Technologies

-
IRSM005-301MH
Infineon Technologies

-
MP6610GJ-Z
Monolithic Power Systems Inc.

-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
