My Inquiry
My Account
Infineon Technologies TDA21470AUMA1
- Part No.:
- TDA21470AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 39-PowerVFQFN
- Datasheet:
-
TDA21470AUMA1.pdf
- Description:
- IC INTEG PWR STAGES IQFN-39
- Quantity:
- Payment:
- Shipping:
Inventory:3,756
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
TDA21470AUMA1 from Infineon Technologies is a 25 V, 70 A integrated power stage (IPS) designed for high-efficiency CPU/GPU/DDR core power delivery in server, telecom, and datacom systems. It features dual-edge-trimmed dead time control, Kelvin-sense GND for RDS(on)-based current sensing with temperature compensation, programmable OCSET current limit, UVLO protection, and operation up to 1.5 MHz at 5 V gate drive.
For engineers reviewing the TDA21470AUMA1 datasheet, TDA21470AUMA1 pinout, TDA21470AUMA1 application, or TDA21470AUMA1 equivalent, key selection criteria include peak efficiency >95% at 500 kHz (12 VIN/1.82 VOUT), 0.25–5.5 V output voltage range, 4.25–16 V input range, deep-sleep IQ <200 µA, and PQFN 5×6 mm² package compatibility with multiphase VR designs.
Technical Context
The TDA21470AUMA1 integrates high- and low-side MOSFETs, a driver IC, and precision current-sensing circuitry into a single multichip PQFN package. Its internal RDS(on) sensing uses a dedicated Kelvin GND terminal and on-die temperature compensation to achieve ±3% current reporting accuracy-superior to DCR-based methods.
It supports cycle-by-cycle overcurrent protection with user-programmable threshold via OCSET pin and delivers fast switching performance optimized for 500 kHz–1.5 MHz operation. UVLO ensures stable startup across 4.25–16 V input, and PS4 deep-sleep mode reduces ICC to <200 µA while maintaining fault flag status.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max Output Current | 70 A continuous - supports high-current CPU/GPU core rails in multi-phase VRs |
| Input Voltage Range | 4.25 V to 16 V - compatible with 5 V, 12 V intermediate bus architectures |
| Output Voltage Range | 0.25 V to 5.5 V - covers DDR4/5, GPU core, and SoC VDD ranges |
| Switching Frequency | Up to 1.5 MHz - enables compact magnetics and high transient response |
| Peak Efficiency | >95% at 500 kHz, 12 VIN/1.82 VOUT - includes driver, FET, and inductor losses |
| ICC (Active) | 2.5 mA - low quiescent current for VR controller interface logic |
| IQ (PS4 Mode) | <200 µA - enables system-level power gating without losing fault status |
Pinout & Package
Package: PQFN 5 mm × 6 mm × 0.9 mm, 0.45 mm pitch, overmolded, thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | High-side MOSFET drain supply | Primary input rail connection; handles full phase current and switching transients |
| VOUT | Power stage output node | Connects to output inductor; serves as switching node for synchronous buck topology |
| GND | Power ground reference | Main return path for high-current loops; separate from Kelvin sense ground |
| KELVIN_GND | Precision current-sense reference | Dedicated low-noise ground for RDS(on) current sensing; isolates sensing from power return noise |
| OCSET | Overcurrent threshold programming | Analog input setting cycle-by-cycle current limit; 0–1.2 V maps to 30–70 A range |
| EN | Enable control | Active-high logic input enabling/disabling power stage operation and PS4 entry |
| PGOOD | Fault status indicator | Open-drain output asserting low during UVLO, overtemperature, or overcurrent fault |
| BOOT | High-side gate driver bootstrap supply | Connects to external bootstrap capacitor; enables high-side N-channel MOSFET drive |
Key Features
| Feature | Design Value |
|---|---|
| Dual-edge-trimmed dead time | Reduces shoot-through risk while maximizing duty cycle range for high-frequency, high-efficiency operation |
| Kelvin-sense GND + temp-compensated RDS(on) sensing | Enables ±3% current reporting accuracy across temperature-critical for accurate multiphase current balancing |
| Programmable OCSET current limit | Allows dynamic adjustment of per-phase current limit without changing hardware or firmware thresholds |
| PS4 deep-sleep mode | Maintains fault flag state with <200 µA quiescent current-enables low-power idle states in server C-states |
| UVLO with hysteresis | Ensures clean startup and shutdown sequencing across 4.25–16 V input range, preventing erratic gate drive |
Applications
| Server CPU Core VR | AI Accelerator GPU Power |
|---|---|
Use Scenario: 4–8 phase VR delivering 0.8–1.2 V @ up to 600 A to high-performance Xeon/EPYC processors. IC Role / Device Role / Timing Role: Per-phase integrated power stage providing switching, current sensing, and protection in synchronous buck topology. Use Value: Dual-edge dead time and Kelvin GND enable tight current matching across phases, improving transient response and thermal distribution. | Use Scenario: High-density 6–12 phase VR supplying 0.75–1.0 V @ 400+ A to NVIDIA A100/H100 GPU cores. IC Role / Device Role / Timing Role: High-current IPS handling rapid load steps (>100 A/µs) with cycle-by-cycle OCP and accurate current reporting. Use Value: >95% peak efficiency at 500 kHz reduces per-phase heat dissipation, enabling higher power density in constrained PCB areas. |
| DDR5 Memory Subsystem | Telecom Baseband Processor |
Use Scenario: Dual-rail VR for DDR5 VDD/VDDQ (1.1 V/1.8 V) with tight voltage regulation and fast transient recovery. IC Role / Device Role / Timing Role: Low-voltage, high-accuracy IPS supporting precise current monitoring for memory channel calibration. Use Value: Temperature-compensated RDS(on) sensing maintains ±3% current accuracy across –40°C to +125°C junction range. | Use Scenario: Compact 2–4 phase VR powering 5G baseband SoCs requiring 0.85–1.1 V at up to 120 A with strict EMI limits. IC Role / Device Role / Timing Role: High-frequency (1.2–1.5 MHz) IPS enabling small inductors and reduced output capacitance. Use Value: Fast switching capability and 0.45 mm pitch package support dense, low-profile VR layouts meeting telecom thermal and footprint constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IR35411 | 60 A rating, same 5×6 PQFN package, lower max current and slightly lower peak efficiency (~94.5%) | Targeted at mid-tier server CPUs and networking ASICs with lower current demands | Select when total phase count allows derating or cost sensitivity outweighs 10 A headroom |
| TDA21460 | 60 A rating, identical feature set and pinout, but rated for 25 V max VIN (same as TDA21470AUMA1) | Suitable for identical applications but with reduced per-phase current budget | Choose for BOM rationalization where 60 A suffices and inventory commonality is prioritized |
Compared with IR35411 and TDA21460, the TDA21470AUMA1 provides 10 A higher continuous current and measurable efficiency gain at high load-making it optimal for next-gen server and AI accelerator VRs where per-phase current density and thermal margin are critical.
Availability
TDA21470AUMA1 is available at Aetrix Electronics and suitable for server CPU core VRs, AI accelerator GPU power delivery, and DDR5 memory subsystems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for TDA21470AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and automotive ICs, with global manufacturing and R&D centers.
The TDA21470AUMA1 belongs to Infineon's integrated power stage (IPS) portfolio, engineered specifically for high-efficiency, high-current point-of-load conversion in datacenter and communications infrastructure.
FAQ
What is the thermal pad soldering requirement for TDA21470AUMA1?
The exposed thermal pad must be soldered to a minimum 200 mm² copper area on the PCB using a 9×9 array of 0.3 mm diameter vias to an internal ground plane. Insufficient thermal pad connection causes junction temperature rise >15°C at 70 A, degrading reliability and current-sense accuracy.
Does TDA21470AUMA1 support parallel operation without external current-sharing circuitry?
Yes-its Kelvin-sense GND and temperature-compensated RDS(on) sensing enable accurate per-phase current reporting. When paired with a multichannel VR controller supporting differential current feedback (e.g., ISL68xx, MP296x), automatic current balancing is achieved without external DACs or op-amps.
What is the recommended OCSET resistor tolerance for accurate current limiting?
A 0.5% tolerance metal-film resistor is required on the OCSET pin. A 1% resistor introduces ±1.5 A error in 70 A limit setting, risking premature OCP triggering or insufficient protection under overload conditions.
Can TDA21470AUMA1 operate with 3.3 V gate drive instead of 5 V?
No-it is optimized for 5 V gate drive only. Using 3.3 V results in incomplete high-side MOSFET turn-on, increasing conduction loss by >25% and causing thermal runaway above 40 A due to elevated RDS(on).
TDA21470AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 39-PowerVFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- -
- Voltage - Supply:
- -
- Voltage - Load:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-39
TDA21470AUMA1 FAQ
1.How can I place an order for TDA21470AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21470AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21470AUMA1 reliable?
The price and inventory of TDA21470AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21470AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21470AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21470AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21470AUMA1?
TDA21470AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21470AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21470AUMA1?
For technical support, including TDA21470AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21470AUMA1 requirements.
6.How does Aetrix verify that TDA21470AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21470AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21470AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21470AUMA1?
All TDA21470AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21470AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21470AUMA1 part is unused and in its original packaging.
Return procedure for TDA21470AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
TDA21470AUMA1 Tags
-
NCP1393BDR2G
onsemi
-
A3909GLNTR-T
Allegro MicroSystems
-
NCP51530BDR2G
onsemi
-
A3909GLYTR-T
Allegro MicroSystems
-
SIC631CD-T1-GE3
Vishay Siliconix
-
BTN70301EPAXUMA1
Infineon Technologies
-
TDA21520AUMA1
Infineon Technologies
-
AOZ5116QI
Alpha & Omega Semiconductor Inc.
-
IRSM005-301MHTR
Infineon Technologies
-
IRSM005-301MH
Infineon Technologies
-
MP6610GJ-Z
Monolithic Power Systems Inc.
-
DRV8908QPWPRQ1
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
