Infineon Technologies TDA21472AUMA1

Overview

TDA21472AUMA1 from Infineon Technologies is a co-packaged OptiMOS™ power stage integrating synchronous buck gate driver, high-side and low-side MOSFETs, and Schottky diode in a single 5 mm × 6 mm PQFN package. It delivers up to 80 A output current, supports 4.25–16 V input, 0.25–5.5 V output, and operates up to 1.5 MHz switching frequency for CPU/GPU/DDR core power delivery in server-grade DC-DC converters.

For engineers reviewing the TDA21472AUMA1 datasheet, TDA21472AUMA1 pinout, TDA21472AUMA1 application, or TDA21472AUMA1 equivalent, key selection criteria include its on-chip 5 mV/A current sensing with temperature compensation, programmable 80 A OCP threshold, deep-sleep mode for PS3/PS4 compliance, and body-braking transient support in multiphase VRMs.

Technical Context

The TDA21472AUMA1 implements a fully integrated synchronous buck power stage with internal gate driver logic, anti-shoot-through control, and cycle-by-cycle over-current protection triggered via OCSET resistor programming. Its PWM interface accepts 3.3 V tri-state logic, enabling precise high-side/low-side FET control with configurable enable (EN) and bootstrap replenishment.

Thermal monitoring is achieved through an analog TOUT/FLT pin delivering 8 mV/°C slope (0.6 V offset), while current sensing uses a Kelvin-referenced IOUT–REFIN differential output at 5 mV/A gain with ±0.8 A offset trim. Phase fault detection and VCC/VDRV UVLO (3.85 V rise, 3.45 V fall) ensure robust operation under dynamic load and supply transients.

Key Specifications

Pinout & Package

Package: 40-pin PQFN (5 mm × 6 mm × 1 mm), RoHS-compliant, lead-free, with exposed thermal pad (Pin 24) for enhanced PCB heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power stage applications.

Compared with IR35201MTRPBF and TDA21490AUMA1, the TDA21472AUMA1 offers optimal balance of integration, thermal visibility, and transient performance for mainstream server CPU/GPU VRMs-delivering lower system-level cost and faster time-to-market than discrete alternatives, while avoiding over-specification of current capacity.

Availability

TDA21472AUMA1 is available at Aetrix Electronics and suitable for CPU core power delivery, GPU VRMs, and DDR memory array regulation requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.

Supply support for TDA21472AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

The TDA21472AUMA1 belongs to Infineon's OptiMOS™ Power Stage product line, engineered specifically for high-efficiency, high-density DC-DC conversion in datacenter and AI hardware where thermal performance, current accuracy, and multiphase scalability are critical.

FAQ

What is the recommended bootstrap capacitor value and placement for TDA21472AUMA1?

A minimum 0.22 µF X7R ceramic capacitor must be placed directly between BOOT and PHASE pins. For VIN > 13.2 V, a 2 Ω resistor must be added in series with the BOOT capacitor to limit inrush current and prevent overstress. Layout best practice requires shortest possible trace length and direct connection to the thermal pad ground plane.

How does the TDA21472AUMA1 achieve superior current sense accuracy versus DCR-based methods?

It uses on-die MOSFET R_DS(on) current sensing with real-time temperature compensation, delivering 5 mV/A gain and ±0.8 A offset trim across –40°C to +125°C. This eliminates DCR tolerance drift, copper aging effects, and layout-dependent parasitics inherent in external sense resistors or inductor DCR networks.

Can the TDA21472AUMA1 operate in single-phase configurations, or is it limited to multiphase use?

It is fully functional in single-phase VRMs and commonly used in low-power server SoCs or GPU memory rails. Its EN pin, deep-sleep mode, and tri-state PWM interface provide full standalone control. Multiphase operation is enabled via synchronization of multiple units using shared clock and current-sharing signals from compatible controllers.

What thermal derating guidance applies when using the TDA21472AUMA1 on a 2-layer PCB?

With a 2-layer board and standard 1 oz copper, maximum continuous output current is reduced to ~60 A due to higher θ_JA (~20.5 K/W). To sustain 80 A, a 4-layer board with internal ground/power planes, thermal vias under Pin 24, and ≥2 in² copper pour is required per Infineon's layout guidelines in AN2019-07.