Infineon Technologies TDA21475AUMA1

Overview

TDA21475AUMA1 from Infineon Technologies is a co-packaged synchronous buck power stage integrating a gate driver IC, high-side and low-side OptiMOS™ 70-A MOSFETs, and a Schottky diode in a single PQFN 5 mm × 6 mm exposed-top package. It delivers up to 70 A continuous output current, supports 0.25–5.5 V output voltage range, operates at up to 1.5 MHz switching frequency, and features on-chip 5 mV/A current sensing with temperature compensation-optimized for CPU core power delivery in server-grade DC-DC converters.

For engineers reviewing the TDA21475AUMA1 datasheet, TDA21475AUMA1 pinout, TDA21475AUMA1 application, or TDA21475AUMA1 equivalent, key selection criteria include its integrated current-sense accuracy (±3% typical), deep-sleep mode for PS3/PS4 compliance, bootstrap auto-replenishment, phase fault detection, and compatibility with 3.3-V tri-state PWM inputs in multiphase VRMs.

Technical Context

The TDA21475AUMA1 implements a synchronous buck topology with internal anti-shoot-through control, cycle-by-cycle over-current protection via programmable OCSET resistor, and body-braking load transient support enabled by VOS-based inductor current emulation. Its dual ground system (LGND for signal reference, PGND for power return) isolates analog sensing from high-di/dt switching paths.

Thermal performance is enhanced by the exposed-top PQFN package with θJC_Top = 1.0 K/W and θJC_PCB = 1.5 K/W, while the 8 mV/°C analog temperature output (TOUT/FLT) enables real-time junction monitoring and fault flagging under overtemperature, OCP, BOOT UV, or phase fault conditions.

Key Specifications

Pinout & Package

Package: PQFN 5 mm × 6 mm × 0.65 mm with exposed top thermal pad (RoHS-compliant, lead-free). Optimized for low-inductance layout, minimal SW node ringing, and efficient heat transfer to heatsink or PCB copper.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck power stage applications.

Compared with ISL99390HRZ-T and MP87653GL-Z, the TDA21475AUMA1 uniquely combines 70 A capability, on-die current sensing with temperature compensation, body-braking support, and comprehensive fault reporting (OT/OCP/BOOT UV/phase fault) in a thermally optimized exposed-top package-making it the only option qualified for high-reliability server CPU core VRMs.

Availability

TDA21475AUMA1 is available at Aetrix Electronics and suitable for server CPU core VRMs, AI accelerator GPU power rails, and DDR5 memory subsystems requiring stable component supply, long-term lifecycle assurance, and validated thermal performance under sustained 70 A loads.

Supply support for TDA21475AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with leadership in silicon carbide and advanced MOSFET technologies.

The TDA21475AUMA1 belongs to Infineon's OptiMOS™ Power Stage product line, designed specifically for high-efficiency, high-current, high-frequency DC-DC conversion in data center and AI infrastructure applications.

FAQ

What is the recommended bootstrap capacitor value and placement for TDA21475AUMA1?

A minimum 0.22 µF X7R ceramic capacitor must be placed between BOOT and PHASE pins, with a 2 Ω series resistor recommended to reduce SW node ringing and EMI. For VIN > 13.2 V, the 2 Ω resistor is mandatory. The capacitor must be located within 2 mm of the pins and use short, wide traces to minimize loop inductance.

How does the TDA21475AUMA1 achieve body-braking during negative load transients?

The device uses the VOS pin to sense output voltage and emulate inductor current during reverse conduction, enabling the controller to activate low-side FET conduction before the output voltage collapses. This eliminates need for external body-braking circuits and achieves sub-50 ns recovery from –15 A load steps.

Can TDA21475AUMA1 operate with a 3.3 V-only supply, or does it require separate VCC and VDRV rails?

TDA21475AUMA1 requires two independent supplies: VCC (4.25–5.5 V) for logic bias and VDRV (4.25–5.5 V) for gate driving. While both can be derived from the same 5 V rail, they must be decoupled separately - VCC to LGND with 1 µF + 1 Ω resistor to VDRV, and VDRV to PGND with 1 µF capacitor - to prevent noise coupling into the driver path.

What is the meaning of the TOUT/FLT pin behavior during normal operation versus fault conditions?

Under normal operation, TOUT/FLT outputs an analog voltage equal to (0.6 V + 8 mV/°C × TJ), allowing real-time junction temperature monitoring. During overtemperature (>150 °C), overcurrent, BOOT under-voltage, or phase fault, the pin is actively pulled high to 3.3 V to serve as a digital fault flag while retaining analog readback capability after fault clearance.