Infineon Technologies TDA21535AUMA1
- Part No.:
- TDA21535AUMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Full Half-Bridge (H Bridge) Drivers
- Package:
- 25-PowerTFQFN
- Datasheet:
-
TDA21535AUMA1.pdf
- Description:
- IFX POWERSTAGE/DRIVER
- Quantity:
- Payment:

- Shipping:

Inventory:4,282
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Product details
Overview
TDA21535AUMA1 from Infineon is an integrated power-stage IC combining a synchronous buck gate driver, high-side and low-side MOSFETs, and active diode structure for DDR memory and low-current voltage rails. It delivers 35 A output current, supports 4.25–16 V input, regulates down to 0.225 V, operates up to 1.5 MHz, and features on-chip current sensing with 5 µA/A gain and thermal monitoring via TMON pin.
For engineers reviewing the TDA21535AUMA1 datasheet, TDA21535AUMA1 pinout, TDA21535AUMA1 application in DDR memory regulation, or TDA21535AUMA1 equivalent for high-efficiency point-of-load conversion, this page provides verified electrical parameters, validated pin functions, real-world protection behavior (OCP, OTP, HSS), and layout-critical signal roles (SW, BOOT, PHASE, IMON).
Technical Context
The TDA21535AUMA1 implements a fully integrated synchronous buck power stage with internal MOSFET current sensing-replacing external DCR-based sensing-and active diode architecture that minimizes reverse recovery charge while achieving Schottky-like VSD. Its bootstrap capacitor auto-replenishment circuit ensures reliable high-side gate drive across duty cycles.
It accepts tri-state 3.3 V PWM input for precise control of high-side turn-on, low-side turn-on, and full-shutdown states, and integrates EN-controlled ultra-low-power DEEP SLEEP mode (32 µA) and auto SLEEP mode (1.7 mA) after 20 µs of PWM tri-state, enabling dynamic power management in memory subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 35 A continuous-supports high-density DDR4/DDR5 memory rail designs without external current sharing. |
| Input Voltage Range | 4.25 V to 16 V-compatible with 5 V, 12 V intermediate bus architectures in servers and networking equipment. |
| Switching Frequency | Up to 1.5 MHz-enables use of sub-300 nH inductors and compact ceramic output capacitors. |
| Current Sense Gain | 5 µA/A-delivers accurate, temperature-stable current reporting referenced to IMONREF (1.1–1.9 V), eliminating DCR tolerance drift. |
| Thermal Shutdown Threshold | Junction temperature >150 °C triggers shutdown-protects against sustained overload or poor PCB thermal design. |
| Bootstrap UVLO Threshold | Falling threshold at 3.61 V-prevents high-side MOSFET misfire during startup or light-load conditions. |
| EN Quiescent Current | 32 µA in DEEP SLEEP (EN = low)-reduces system standby power in memory subsystems requiring rapid wake-up. |
Pinout & Package
Package: PQFN 4 mm × 5 mm × 0.9 mm, RoHS-compliant, with exposed thermal pad (pin 15) for direct PCB heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 TMON / FLT | Analog output / fault flag | Provides temperature-scaled voltage (8 mV/°C + 0.6 V); pulled to 3.3 V during OTP, OCP, HSS, or BOOT UV. |
| 8–12 SW | Power switching node | Common drain connection of HS and LS MOSFETs; requires tight loop layout to minimize ringing and EMI. |
| 19 PHASE | Bootstrap reference node | AC-coupled return path for BOOT capacitor; must be connected directly to SW plane with minimal trace inductance. |
| 20 BOOT | High-side gate drive supply | Connects to PHASE via 0.22–0.56 µF X7R ceramic; auto-refresh prevents undercharge during extended low-duty operation. |
| 21 PWM | Tri-state logic interface | 3.3 V compatible: High = HS on, Low = LS on, Tri-state = both off-enables seamless integration with digital PWM controllers. |
| 22 EN | Enable control input | VCC-tolerant; internal 280 kΩ pull-down ensures safe default-off state; enables ultra-low IQ modes. |
| 24 IMONREF | Current sense reference | External bias point (1.1–1.9 V) for IMON output; sets common-mode level for accurate current reporting. |
| 25 IMON | Current sense output | 5 µA/A analog current mirror output; voltage across external RIMON (e.g., 1 kΩ) yields 5 mV/A scaling. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated active diode structure | Eliminates reverse recovery charge and associated switching loss-critical for high-frequency, high-efficiency operation below 1 V output. |
| On-chip MOSFET current sensing | Replaces error-prone DCR sensing with ±3% current accuracy over temperature-improves VRM transient response and load-line stability. |
| Bootstrap capacitor auto-replenishment | Maintains sufficient gate drive voltage during extended low-duty-cycle operation-prevents HS FET dropout in burst-mode or light-load conditions. |
| High-side MOSFET short detection (HSS) | Dedicated fault flag triggered by abnormal HS conduction-enables fast system-level shutdown before catastrophic failure. |
| Tri-state PWM compatibility | Supports industry-standard 3.3 V logic interface with hysteresis (40 mV) for noise immunity-simplifies controller selection and PCB routing. |
Applications
| DDR Memory Voltage Regulation | ASIC/FPGA Core Rail Supply |
|---|---|
Use Scenario: Regulating VDDQ for DDR4/DDR5 modules in enterprise SSDs and AI accelerators. IC Role / Device Role / Timing Role: Integrated power stage delivering tightly regulated 1.2 V / 1.1 V with fast transient response and current telemetry. Use Value: On-die current sensing enables precise per-rail current limiting and thermal derating-critical for JEDEC-compliant memory subsystem reliability. | Use Scenario: Powering low-voltage core rails (0.75–0.85 V) of high-performance ASICs in 5G baseband processors. IC Role / Device Role / Timing Role: High-efficiency, high-frequency buck stage synchronized to system clock for dynamic voltage scaling (DVS). Use Value: 1.5 MHz operation allows <300 nH inductors and eliminates bulk electrolytics-reducing board area by >40% vs. 500 kHz solutions. |
| Network Switch PHY Power | Industrial FPGA I/O Bank Supply |
Use Scenario: Providing clean, isolated 2.5 V or 3.3 V rails for multi-gigabit Ethernet PHYs in managed switches. IC Role / Device Role / Timing Role: Point-of-load regulator with cycle-by-cycle OCP and thermal flag for fault containment in dense backplane systems. Use Value: TMON/FLT pin provides real-time junction temperature feedback-enabling predictive fan control and thermal throttling without external sensors. | Use Scenario: Delivering stable 1.8 V or 3.3 V to FPGA I/O banks in programmable logic controllers with wide ambient temperature range (-40 to +85 °C). IC Role / Device Role / Timing Role: Robust power stage with -40 to +125 °C operating range and embedded EN pull-down for fail-safe power sequencing. Use Value: DEEP SLEEP mode (32 µA) reduces idle power in battery-backed industrial controllers-extending runtime during brownout events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated power-stage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP87651GQ-Z (Monolithic Power Systems) | 30 A rating, 600 kHz max switching frequency, no integrated TMON/FLT analog output. | Lacks real-time thermal reporting; requires external temperature sensor for closed-loop thermal management. | Select when cost sensitivity outweighs need for on-die thermal telemetry and higher-frequency operation. |
| ISL99390IRZ (Renesas) | 40 A rating, 1.2 MHz max frequency, IMON gain fixed at 10 µA/A, no auto-replenish BOOT circuit. | Higher current capability but reduced light-load efficiency due to absence of bootstrap refresh and deeper sleep modes. | Select for higher-current applications where 35 A margin is insufficient, accepting trade-offs in light-load IQ and thermal observability. |
Compared with MP87651GQ-Z and ISL99390IRZ, the TDA21535AUMA1 uniquely combines 35 A capability with 1.5 MHz operation, analog TMON/FLT signaling, and bootstrap auto-replenishment-making it optimal for thermally constrained, high-transient DDR and ASIC core rail designs requiring precision current and temperature visibility.
Availability
TDA21535AUMA1 is available at Aetrix Electronics and suitable for DDR memory regulation, ASIC/FPGA core rail supply, and network PHY power applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production lots.
Supply support for TDA21535AUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with leadership in silicon carbide and advanced power stages.
The TDA21535 belongs to Infineon's OptiMOS™ Power Stage product line, engineered specifically for high-efficiency, high-density point-of-load conversion in memory and processor subsystems where thermal performance, current accuracy, and fast transient response are critical.
FAQ
What is the recommended bootstrap capacitor value and dielectric type for TDA21535AUMA1?
The datasheet specifies a 0.22 µF to 0.56 µF X7R ceramic capacitor between BOOT and PHASE pins. X7R is required for stable capacitance across temperature and DC bias; NP0/C0G is not recommended due to lower volumetric efficiency and higher cost at these values. Mounting must minimize loop inductance using short, wide traces and direct vias to PGND.
How does the TDA21535AUMA1 implement cycle-by-cycle overcurrent protection?
OCP triggers within one switching cycle when sensed current exceeds the threshold derived from IMONREF voltage and internal gain. The FLT pin asserts high, and gate drive is immediately disabled. Recovery requires either PWM reset or EN toggle. This differs from average-current limiting-it protects against short-circuit faults before MOSFET thermal runaway occurs.
Can the IMON output be used for closed-loop current limiting in the controller?
Yes-IMON delivers a 5 µA/A proportional current referenced to IMONREF. When a resistor (e.g., 1 kΩ) connects IMON to IMONREF, the resulting voltage (5 mV/A) can feed a controller's current-limit comparator. This enables precise, temperature-stable per-phase current limiting without DCR calibration or external sense resistors.
Is the TDA21535AUMA1 pin-compatible with earlier TDA214xx series devices?
No-TDA21535AUMA1 uses a 28-pin PQFN package with different pin assignments (e.g., dedicated TMON/FLT on pin 1, dual SW pins 8–12, PHASE on pin 19). Pin count, thermal pad layout, and signal mapping differ significantly from TDA21472/TDA21490, requiring new PCB design and layout validation.
TDA21535AUMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 25-PowerTFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- -
- Applications:
- -
- Interface:
- -
- Load Type:
- -
- Technology:
- -
- Rds On (Typ):
- -
- Current - Output / Channel:
- -
- Current - Peak Output:
- -
- Voltage - Supply:
- 4.25V ~ 16V
- Voltage - Load:
- -
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Fault Protection:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-IQFN-25-1
TDA21535AUMA1 FAQ
1.How can I place an order for TDA21535AUMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for TDA21535AUMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for TDA21535AUMA1 reliable?
The price and inventory of TDA21535AUMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for TDA21535AUMA1 is usually 5 days.
3.What payment methods are accepted for TDA21535AUMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for TDA21535AUMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for TDA21535AUMA1?
TDA21535AUMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your TDA21535AUMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for TDA21535AUMA1?
For technical support, including TDA21535AUMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your TDA21535AUMA1 requirements.
6.How does Aetrix verify that TDA21535AUMA1 is sourced from the original manufacturer or authorized distributors?
All TDA21535AUMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that TDA21535AUMA1 meets industry standards.
7.What is the process for return or replacement of TDA21535AUMA1?
All TDA21535AUMA1 units undergo pre-shipment inspection (PSI). If there is an issue with TDA21535AUMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The TDA21535AUMA1 part is unused and in its original packaging.
Return procedure for TDA21535AUMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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