Infineon Technologies TLE94103EPXUMA1

Overview

TLE94103EPXUMA1 from Infineon is a protected triple half-bridge driver IC designed for automotive motion control, featuring three independently controlled half-bridge outputs, 16-bit SPI interface with daisy-chain capability, and comprehensive diagnostics including open-load detection in ON-state for both high-side and low-side paths. It operates from 5.5–20 V supply voltage, supports 3.3 V/5 V logic inputs, and delivers ≤1.8 Ω total R_DS(on) per half-bridge at 150°C.

For engineers reviewing the TLE94103EPXUMA1 datasheet, TLE94103EPXUMA1 pinout, TLE94103EPXUMA1 application, or TLE94103EPXUMA1 equivalent, key selection criteria include SPI-controlled motor direction/brake modes, integrated short-circuit and cross-current protection, thermal pre-warning, and AEC-Q100 qualification for under-hood automotive use.

Technical Context

The device implements three independent power stages, each comprising matched high-side and low-side MOSFET drivers with current-sense-based overload detection and temperature monitoring. All outputs support forward, reverse, brake, and high-impedance operation modes via SPI register writes.

Its SPI interface includes in-frame response for real-time status feedback, global error flag assertion on fault conditions (overtemperature, overvoltage, undervoltage, short circuit), and daisy-chain support for multi-device systems without additional chip-select lines.

Key Specifications

Pinout & Package

Package: PG-TSDSO-14 (exposed die pad), 5 mm × 6 mm, 0.65 mm pitch - optimized for thermal dissipation and PCB space efficiency in automotive ECUs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple half-bridge driver applications.

Compared with DRV8876PWPR and STSPIN32F0B, the TLE94103EPXUMA1 provides dedicated hardware-diagnostic coverage across all three channels, SPI-native scalability for multi-actuator clusters, and AEC-Q100 Grade 0 qualification-making it optimal for safety-critical, production-ready automotive motion modules where reliability and testability are non-negotiable.

Availability

TLE94103EPXUMA1 is available at Aetrix Electronics and suitable for automotive side mirror adjustment, HVAC flap actuation, and monostable/bistable relay driving requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant traceability.

Supply support for TLE94103EPXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification aligned to ISO/TS 16949.

The TLE94103EPXUMA1 belongs to Infineon's TLE94xx family of protected half-bridge drivers-designed specifically for automotive body electronics requiring robust fault handling, low quiescent power, and seamless integration into CAN/LIN-linked ECU architectures.

FAQ

What is the maximum continuous current per half-bridge output?

The TLE94103EPXUMA1 guarantees a minimum overcurrent threshold of 0.9 A per output, with thermal derating applied above 85°C junction temperature. Its 1.8 Ω total R_DS(on) per half-bridge limits power dissipation to ≤1.46 W at 0.9 A, enabling sustained operation within the PG-TSDSO-14 package's thermal limits under forced-air cooling.

Does the device support daisy-chaining multiple ICs on a single SPI bus?

Yes-the TLE94103EPXUMA1 supports true daisy-chain operation using its SDO pin to forward shifted-out status data to the SDI of the next device. This eliminates the need for individual CSN lines and enables synchronized configuration and fault polling across up to 16 devices using only four SPI signals (SCLK, SDI, SDO, CSN).

How does open-load diagnosis work in ON-state?

During active drive, the device injects a small diagnostic current through the high-side or low-side FET and measures resulting voltage drop. If the expected voltage signature is absent (indicating an open circuit), the corresponding bit in the SPI status register is set-and the global error flag is asserted-within one SPI frame cycle, enabling immediate corrective action.

Is the exposed die pad (EP) electrically connected internally?

No-the exposed die pad is thermally and electrically isolated from internal silicon. It serves only for PCB-level heat conduction and EMC shielding. Infineon explicitly states that electrical ground must be provided exclusively via Pin 8 (GND); connecting EP to any other net may compromise thermal performance or EMC behavior.