Infineon Technologies TLE94110ESXUMA1

Overview

TLE94110ESXUMA1 from Infineon Technologies is a protected ten-channel half-bridge driver IC for automotive motion control, featuring 10 independently controllable high-side/low-side outputs, SPI interface with daisy-chain capability, and integrated diagnostics including open-load (ON-state), overcurrent, and overtemperature detection. It operates from 5.5–18 V supply, supports 3.3 V/5 V logic inputs, and delivers <0.1 µA quiescent current in sleep mode - ideal for HVAC flap actuation in passenger vehicles.

For engineers reviewing the TLE94110ESXUMA1 datasheet, TLE94110ESXUMA1 pinout, TLE94110ESXUMA1 application, or TLE94110ESXUMA1 equivalent, key selection criteria include SPI-configurable PWM timing (80/100/200 Hz), selectable open-load thresholds for HS1/HS2, cross-current protection, and PG-TSDSO-24 thermal performance with exposed pad.

Technical Context

The TLE94110ESXUMA1 implements a fully integrated 10-fold half-bridge architecture with independent high-side and low-side drivers per channel, each equipped with dedicated current-sense paths and thermal monitoring. Its SPI interface supports 16-bit command frames with in-frame response and global error flag reporting for real-time fault aggregation.

Operation modes - forward, reverse, brake, and high-impedance - are controlled via register writes; PWM generation is internal with fixed frequencies (80/100/200 Hz) and 8-bit duty cycle resolution. Protection logic includes short-to-battery/ground detection, overvoltage (up to 40 V load dump), undervoltage lockout (VS min 5.5 V), and pre-warning overtemperature shutdown.

Key Specifications

Pinout & Package

Package: PG-TSDSO-24 (24-pin thermally enhanced fine-pitch SOIC with exposed die pad). The exposed pad (EP) must be connected to GND for optimal thermal dissipation and EMC performance; electrical ground is provided by pins 1, 12, 13, and 24.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ten-channel half-bridge driver applications.

Compared with TLE94110ESXUMA1, TLE94112ESXUMA1 offers enhanced signal integrity and diagnostics at identical footprint and pinout, while BTS724G lacks half-bridge topology, SPI, and ON-state diagnostics - making it unsuitable for HVAC or mirror motor control without significant external circuitry.

Availability

TLE94110ESXUMA1 is available at Aetrix Electronics and suitable for automotive HVAC systems, side mirror actuators, monostable relay interfaces, and LED status lighting requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.

Supply support for TLE94110ESXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with broad AEC-Q100 product coverage and ISO/TS 16949 certified manufacturing.

The TLE94110ESXUMA1 belongs to Infineon's TLE94xx family of protected multi-channel half-bridge drivers, designed specifically for automotive body electronics requiring high integration, robust diagnostics, and thermal resilience in space-constrained modules.

FAQ

What is the maximum allowable load dump voltage for TLE94110ESXUMA1?

The device supports up to 40 V load dump protection on VS1/VS2 pins per datasheet Section 1 (Product Summary). This rating applies under ISO 7637-2 Pulse 5a conditions and ensures survival during alternator load dump transients in 12 V automotive systems without external TVS clamping.

Can TLE94110ESXUMA1 drive both high-side and low-side configured loads simultaneously?

Yes - each of the ten outputs is a fully independent half-bridge channel capable of high-side, low-side, or H-bridge (dual-output) configuration. The internal architecture supports simultaneous forward, reverse, brake, and high-impedance states per channel via SPI register control, as defined in Section 5.2 and Figure 2.

Does TLE94110ESXUMA1 require external current-sense resistors for overcurrent protection?

No - overcurrent protection is implemented internally using MOSFET R_DS(on) sensing. Each channel monitors its own conduction path and triggers fault reporting when current exceeds the minimum threshold of 0.9 A (ISD), as specified in Table 1. No external sense resistor is needed for basic short-circuit or overload detection.

Is the exposed die pad (EP) electrically connected to ground inside the package?

No - the exposed die pad is thermally and EMC-coupled only; it is not internally connected to GND or any other signal. Datasheet Section 9 explicitly states that EP must be externally connected to GND for optimal thermal performance and EMC, but it serves no electrical function unless soldered to a grounded copper area on the PCB.