Infineon Technologies TLE94112ESXUMA1

Overview

TLE94112ESXUMA1 from Infineon Technologies is a protected 12-channel half-bridge driver IC for automotive motion control, featuring twelve independently controllable half-bridge outputs, SPI-based 16-bit command interface, and integrated diagnostics including open-load (HS/LS), short-circuit, overtemperature, and supply voltage monitoring. It operates from 5.5–18 V supply, supports 3.3 V/5 V logic inputs with hysteresis, and delivers ≤1.8 Ω total R_DS(on) per half-bridge at 150°C - used in HVAC flap actuation, mirror fold/adjustment, and monostable relay driving.

For engineers reviewing the TLE94112ESXUMA1 datasheet, TLE94112ESXUMA1 pinout, TLE94112ESXUMA1 application, or TLE94112ESXUMA1 equivalent, key selection criteria include its daisy-chain-capable SPI interface, ON-state open-load detection for all 12 channels, PWM capability at 80/100/200 Hz with 8-bit resolution, and PG-TSDSO-24 thermal-enhanced package with exposed die pad.

Technical Context

The TLE94112ESXUMA1 implements a fully integrated 12-fold half-bridge architecture with independent high-side and low-side drivers per channel, each equipped with current-sense-based overload protection and cross-current prevention logic. Its SPI interface supports in-frame response and daisy chaining for multi-device systems, enabling synchronized control and global error flag reporting without polling overhead.

Diagnosis is hardware-accelerated: open-load detection operates in ON-state for all outputs; short-to-battery and short-to-ground are monitored per channel; overtemperature pre-warning triggers before shutdown; and VS/VDD undervoltage/overvoltage lockout ensures robust power domain supervision - all implemented without external components.

Key Specifications

Pinout & Package

Package: PG-TSDSO-24 (24-pin thermally enhanced thin shrink small outline package with exposed die pad). The EP must be connected to GND for optimal thermal dissipation and EMC performance; electrical ground is provided via pins 1, 12, 13, and 24.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-channel half-bridge driver applications.

Compared with TLE94103ESXUMA1, the TLE94112ESXUMA1 scales channel count without compromising diagnostic granularity or thermal performance; versus BD3572FS-E2, it delivers superior automotive-grade protection, higher voltage resilience, and deterministic SPI-based system-level fault reporting.

Availability

TLE94112ESXUMA1 is available at Aetrix Electronics and suitable for automotive HVAC systems, electronic mirror control modules, body control units, and relay-driving subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for TLE94112ESXUMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in AEC-Q100-qualified automotive-grade components.

The TLE94112ESXUMA1 belongs to Infineon's TLE94xx family of protected half-bridge drivers, designed specifically for automotive motion control applications demanding functional safety, high integration density, and robust on-chip diagnostics.

FAQ

What is the maximum continuous current per half-bridge output?

The TLE94112ESXUMA1 supports up to 1.5 A continuous current per half-bridge under typical thermal conditions (T_A = 85°C, PCB copper area ≥ 200 mm² per VS/GND plane). This is derived from the specified minimum overcurrent threshold of 0.9 A and maximum R_DS(on) of 1.8 Ω, ensuring reliable operation within SOA limits without external current limiting.

Does the device support daisy-chained SPI communication?

Yes - the TLE94112ESXUMA1 supports true daisy-chain SPI topology using SDO of one device connected to SDI of the next, with simultaneous clocking via shared SCLK and CSN lines. Each device returns its 16-bit status in-frame during read operations, enabling synchronized multi-device diagnosis without additional GPIOs.

How is open-load detection performed in ON-state?

Open-load detection occurs actively while the output is driven ON: the device monitors voltage at the output node relative to VS and GND. For high-side outputs, an open load pulls the node to GND; for low-side, it pulls to VS. Internal comparators detect these states with programmable thresholds (HS1/HS2) and report via dedicated status bits in the SPI status register.

What thermal derating applies above 85°C ambient?

At T_A > 85°C, output current must be linearly derated based on junction temperature limit of 150°C. With R_thJA ≈ 45 K/W (PG-TSDSO-24, 2-layer PCB, EP grounded), maximum allowable power dissipation drops from ~2.5 W (at 85°C) to ~1.4 W (at 105°C ambient), reducing max continuous current per channel to ~1.1 A - verified in Section 3.3 and Figure 12 of the datasheet.