Infineon Technologies BCR183SH6433XTMA1

Overview

BCR183SH6433XTMA1 from Infineon Technologies is a PNP silicon digital transistor with integrated bias resistors (R1 = R2 = 10 kΩ), designed for switching, inverting, interface, and driver circuits in automotive and industrial control systems. It features dual isolated transistors in one SC74 package, AEC-Q101 qualification, 50 V V_CEO, 100 mA I_C, and 250 mW power dissipation at T_S ≤ 115°C.

For engineers reviewing the BCR183SH6433XTMA1 datasheet, BCR183SH6433XTMA1 pinout, BCR183SH6433XTMA1 application, or BCR183SH6433XTMA1 equivalent, key selection criteria include built-in resistor matching (R1/R2 = 0.9–1.1), low V_CE(sat) of 0.3 V at I_C = 10 mA/I_B = 0.5 mA, thermal resistance R_thJS ≤ 140 K/W, and RoHS-compliant SC74 packaging.

Technical Context

This dual-transistor device integrates two electrically isolated PNP digital transistors in a single SC74 (SOT-363) package, enabling compact high-density logic-level translation and signal inversion without external biasing components. Its matched R1/R2 ratio ensures consistent turn-on/off thresholds across both channels under varying temperature conditions (−40°C to +125°C).

The device operates as a current-controlled switch with defined input voltage thresholds: V_i(on) = 1–2.5 V and V_i(off) = 0.8–1.8 V at specified I_C conditions, supporting direct interfacing with microcontroller GPIOs and TTL/CMOS logic families while maintaining robust noise immunity.

Key Specifications

Pinout & Package

BCR183SH6433XTMA1 uses the SC74 (SOT-363) surface-mount package - a 6-pin, dual-transistor variant with symmetrical pin layout and no defined Pin 1 orientation in tape-and-reel delivery. Thermal performance is optimized for board-level conduction via exposed pad (if present per variant) and low R_thJS of ≤140 K/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital transistor applications.

Compared with BCR183W, BCR183SH6433XTMA1 offers dual-channel integration and matched biasing at the expense of slightly higher R_thJS; versus BC847B, it trades off external component freedom for guaranteed threshold consistency and automotive qualification.

Availability

BCR183SH6433XTMA1 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC input interfaces, and medical diagnostic equipment requiring stable component supply, long-term lifecycle support, and AEC-Q101 compliance.

Supply support for BCR183SH6433XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949.

This part belongs to Infineon's BCR family of digital transistors-designed specifically for replacing discrete BJT + resistor combinations in automotive and industrial logic interface applications where space, reliability, and qualification are critical.

FAQ

What is the maximum operating junction temperature for BCR183SH6433XTMA1?

The absolute maximum junction temperature is 150°C, with derated total power dissipation beginning at case temperature (T_S) above 115°C. At T_S = 115°C, P_tot = 250 mW; above that, power must be linearly reduced per the thermal curve in datasheet Figure 5. Operation beyond 150°C risks permanent parametric shift or failure.

Can BCR183SH6433XTMA1 be used in high-frequency switching applications?

Yes-it has a typical transition frequency (f_T) of 200 MHz, making it suitable for digital switching up to ~20 MHz with clean edges. However, its primary design intent is logic-level translation and medium-speed interface duties-not RF amplification or >50 MHz clock distribution-due to limited bandwidth optimization and lack of impedance-matched packaging.

Is there a recommended PCB footprint or thermal pad layout for SC74 packages?

The official SC74 footprint specifies 0.95 mm pin pitch, 1.9 mm body width, and 2.9 mm length. While the standard outline does not include an exposed thermal pad, layout should maximize copper area under pins 1–6 and connect to internal ground planes via multiple vias to achieve the rated R_thJS ≤ 140 K/W. Refer to Infineon Application Note AN077 for exact thermal modeling guidance.

How does the built-in resistor ratio affect switching behavior in noisy environments?

The R1/R2 ratio tolerance of 0.9–1.1 ensures balanced input impedance and consistent V_i(on)/V_i(off) thresholds across temperature and process variation. This tight matching reduces susceptibility to false triggering from ESD transients or coupled noise, especially in dual-channel configurations where mismatch could cause skew or shoot-through in complementary logic paths.