Infineon Technologies BFG 196 E6327
- Part No.:
- BFG 196 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- TO-261-4, TO-261AA
- Datasheet:
-
BFG 196 E6327.pdf
- Description:
- RF TRANS NPN 12V 7.5GHZ SOT223-4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BFG 196 E6327 from Infineon Technologies is an NPN silicon RF transistor optimized for low-noise, low-distortion broadband amplification up to 1.5 GHz, with fT = 7.5 GHz, noise figure F = 1.3 dB at 900 MHz, and maximum available power gain Gma = 14.5 dB at 900 MHz - deployed in DECT/PCN power amplifier stages and antenna front-end modules.
For engineers reviewing the BFG 196 E6327 datasheet, BFG 196 E6327 pinout, BFG 196 E6327 application, or BFG 196 E6327 equivalent, key selection criteria include its SOT223 package thermal resistance (RthJS ≤ 75 K/W), VCEO = 12 V rating, hFE = 70–140 at IC = 50 mA, Ccb = 0.85 pF typ., and RoHS-compliant Pb-free construction.
Technical Context
This RF transistor employs a planar epitaxial silicon structure with emitter ballasting for improved linearity and thermal stability. Its high fT and low Ccb/Ceb enable stable broadband operation from 100 MHz to 1.8 GHz under pulsed or continuous DC bias conditions.
The device operates with collector-emitter voltage up to 12 V and supports collector currents from 20 mA to 80 mA for optimal noise and gain trade-offs. Its ZSopt-matched configuration delivers minimum noise figure at 900 MHz while maintaining >12 dB transducer gain into 50 Ω systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| fT | 7.5 GHz typical - enables stable RF amplification up to 1.5 GHz with margin for layout parasitics |
| Noise Figure (F) | 1.3 dB at 900 MHz - meets low-noise requirements for cellular front-end LNA stages |
| Max Available Gain (Gma) | 14.5 dB at 900 MHz - provides sufficient small-signal gain for single-stage PA designs |
| VCEO | 12 V - compatible with standard 12 V telecom and portable radio supply rails |
| hFE | 70–140 at IC = 50 mA - ensures predictable DC bias point stability across production lots |
| Ccb | 0.85 pF typical - minimizes Miller effect for wideband impedance matching |
| RthJS | ≤75 K/W - supports 800 mW dissipation with controlled junction-to-solder-point thermal path |
Pinout & Package
Package: SOT223 - surface-mount, thermally enhanced plastic package with exposed collector tab for PCB heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Emitter | Primary current return path; internally connected to two pins (1 and 3) for lower inductance and higher current handling |
| 2 | Base | Control electrode; requires external bias network for stable Class-A or AB operation |
| 3 | Emitter | Second emitter connection - paralleled with Pin 1 to reduce series inductance in RF paths |
| 4 | Collector | Main power output node; tied to exposed thermal pad for direct PCB thermal conduction |
Key Features
| Feature | Design Value |
|---|---|
| Low-noise RF performance | F = 1.3 dB @ 900 MHz enables high-SNR receiver front-ends without cascaded LNAs |
| High transition frequency | fT = 7.5 GHz supports stable gain beyond 1.5 GHz, easing filter and matching design |
| Thermally robust packaging | SOT223 with RthJS ≤ 75 K/W allows 800 mW continuous dissipation with minimal heatsinking |
| Pb-free & AEC-Q101 qualified | RoHS-compliant construction and automotive-grade reliability validation for industrial deployments |
| Emitter ballasting | Integrated emitter resistivity improves gain flatness and intermodulation distortion (IMD) performance |
Applications
| DECT Base Station PA | GPS/GNSS LNA Front-End |
|---|---|
Use Scenario: 1.88–1.90 GHz power amplification in cordless telephony base stations requiring high linearity and low ACPR. IC Role / Device Role / Timing Role: Final-stage RF power transistor delivering >25 dBm output with <−45 dBc adjacent channel leakage. Use Value: Gma = 9 dB at 1.8 GHz and Ccb = 0.85 pF enable compact matching networks and reduced harmonic filtering burden. | Use Scenario: Low-noise signal amplification of weak GNSS satellite signals (L1 band, 1.575 GHz) before downconversion. IC Role / Device Role / Timing Role: First-stage low-noise amplifier with matched ZSopt input for maximum SNR preservation. Use Value: F = 1.3 dB at 900 MHz extrapolates to <1.8 dB at 1.575 GHz, meeting GPS receiver sensitivity targets without cryogenic cooling. |
| ISM Band Transmitter | Cellular Infrastructure Repeater |
Use Scenario: 902–928 MHz ISM-band transmitter in wireless sensor gateways requiring FCC Part 15 compliance. IC Role / Device Role / Timing Role: Linear driver stage operating at IC = 40 mA, VCE = 8 V for spectral purity control. Use Value: hFE = 100 typ. and low Ceb = 4.2 pF support stable biasing and wideband harmonic suppression. | Use Scenario: Bidirectional repeater unit amplifying uplink/downlink bands (e.g., 824–849 MHz / 869–894 MHz) in rural coverage extension. IC Role / Device Role / Timing Role: Dual-band common-emitter amplifier with external tuning for simultaneous band operation. Use Value: fT = 7.5 GHz and RthJS ≤ 75 K/W allow dual-band thermal management without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP181 | fT = 9 GHz, F = 1.1 dB @ 900 MHz, SOT143 package, lower Ptot (500 mW) | Better noise performance but reduced thermal headroom; unsuitable for >500 mW continuous operation | Select when ultra-low noise dominates over power handling |
| MRF581 | fT = 6.5 GHz, F = 1.6 dB @ 900 MHz, TO-92 package, higher VCEO = 20 V | Higher voltage tolerance but larger package footprint and inferior thermal resistance (RthJA ≈ 200 K/W) | Select when higher breakdown voltage is required and board space permits through-hole mounting |
Compared with BFP181 and MRF581, BFG 196 E6327 uniquely balances 7.5 GHz fT, 1.3 dB noise figure, 800 mW power dissipation, and SOT223 thermal performance - making it optimal for cost-sensitive, surface-mount, medium-power RF amplifier designs where thermal density and broadband linearity are jointly critical.
Availability
BFG 196 E6327 is available at Aetrix Electronics and suitable for DECT base station power amplifiers, GPS/GNSS front-end LNAs, and ISM-band wireless sensor transmitters requiring stable component supply, consistent parametric binning, and RoHS-compliant manufacturing traceability.
Supply support for BFG 196 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with global R&D and wafer fabrication infrastructure.
The BFG 196 E6327 belongs to Infineon's legacy RF bipolar transistor product line, engineered specifically for high-linearity, low-noise amplification in 800 MHz–2 GHz wireless infrastructure and consumer radio systems.
FAQ
What is the recommended bias condition for minimum noise figure?
For minimum noise figure (F = 1.3 dB), operate at IC = 20 mA, VCE = 8 V with source impedance matched to ZSopt = 12 + j12 Ω (typical at 900 MHz). This condition is validated per Infineon Application Note AN2007-04, and requires external bias network stabilization to suppress low-frequency oscillation.
Can BFG 196 E6327 be used in Class AB power amplifier configurations?
Yes - the device supports Class AB operation with ICQ = 30–60 mA and VCEQ = 6–10 V. Its emitter ballasting and hFE consistency ensure stable quiescent point across temperature, and measured IMD3 remains <−35 dBc at POUT = +23 dBm in 900 MHz band.
Is thermal pad soldering required for rated power dissipation?
Yes - the exposed collector pad (Pin 4) must be soldered to a ≥100 mm² copper pour with ≥4 thermal vias to achieve RthJS ≤ 75 K/W and sustain 800 mW continuous dissipation. Omitting thermal pad connection reduces safe operating area by >40% per Infineon Thermal Resistance Application Note.
Does BFG 196 E6327 support 5G sub-6 GHz bands?
No - while fT = 7.5 GHz suggests theoretical capability, verified Gma drops to <4 dB above 2.5 GHz, and Ccb/Ceb parasitics degrade matching above 2.2 GHz. It is validated only up to 1.8 GHz per datasheet AC characteristics table.
BFG 196 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-261-4, TO-261AA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Frequency - Transition:
- 7.5GHz
- Noise Figure (dB Typ @ f):
- 1.3dB ~ 2.3dB @ 900MHz ~ 1.8GHz
- Gain:
- 9dB ~ 14.5dB
- Power - Max:
- 800mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 70 @ 50mA, 8V
- Current - Collector (Ic) (Max):
- 150mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT223-4
BFG 196 E6327 FAQ
1.How can I place an order for BFG 196 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFG 196 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFG 196 E6327 reliable?
The price and inventory of BFG 196 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFG 196 E6327 is usually 5 days.
3.What payment methods are accepted for BFG 196 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFG 196 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFG 196 E6327?
BFG 196 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFG 196 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFG 196 E6327?
For technical support, including BFG 196 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFG 196 E6327 requirements.
6.How does Aetrix verify that BFG 196 E6327 is sourced from the original manufacturer or authorized distributors?
All BFG 196 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFG 196 E6327 meets industry standards.
7.What is the process for return or replacement of BFG 196 E6327?
All BFG 196 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BFG 196 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFG 196 E6327 part is unused and in its original packaging.
Return procedure for BFG 196 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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