Infineon Technologies BFP182WH6327XTSA1
- Part No.:
- BFP182WH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- SC-82A, SOT-343
- Datasheet:
-
BFP182WH6327XTSA1.pdf
- Description:
- RF TRANS NPN 12V 8GHZ SOT343-4
- Quantity:
- Payment:

- Shipping:

Inventory:8,479
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BFP182WH6327XTSA1 from Infineon Technologies is an NPN silicon RF transistor optimized for low-noise, high-gain broadband amplification at collector currents from 1 mA to 20 mA; features fT = 8 GHz, noise figure F = 0.9 dB at 900 MHz, VCEO = 12 V, Ptot = 250 mW, and SOT343 package; used in 900 MHz cellular front-end LNA stages.
For engineers reviewing the BFP182WH6327XTSA1 datasheet, BFP182WH6327XTSA1 pinout, BFP182WH6327XTSA1 application, or BFP182WH6327XTSA1 equivalent, key selection criteria include noise figure at 900 MHz, transition frequency, DC current gain (hFE = 70–140), thermal resistance (RthJS ≤ 235 K/W), and RoHS-compliant SOT343 footprint compatibility.
Technical Context
This device operates as a single NPN RF transistor with Gummel-Poon SPICE model parameters fully extracted and validated up to 6 GHz. Its internal parasitic network includes LBI = 0.43 nH, CBE = 68 fF, and CCB = 46 fF, enabling accurate small-signal modeling for LNA design.
Designed for broadband operation, it delivers maximum stable power gain (Gms) of 22 dB at 900 MHz and transducer gain |S21|² = 18 dB under 50 Ω conditions - critical for impedance-matched RF front-ends in mobile handsets and IoT transceivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| fT | 8 GHz typical - enables stable amplification up to UHF band without oscillation risk |
| Noise Figure | 0.9 dB at 900 MHz - meets stringent LNA requirements for cellular receiver sensitivity |
| hFE | 70–140 at IC = 10 mA, VCE = 8 V - supports bias stability across production lots |
| VCEO | 12 V - sets safe operating voltage ceiling for 3.3 V/5 V RF supply rails |
| Ptot | 250 mW at TS ≤ 91 °C - defines thermal derating limit for PCB layout copper area planning |
| Ccb | 0.34 pF typical - directly impacts input matching network Q and bandwidth trade-off |
| RthJS | ≤235 K/W - informs thermal pad design and solder joint reliability in compact modules |
Pinout & Package
Package: SOT343 - surface-mount, 4-pin plastic package with exposed thermal pad; dimensions 2.1 mm × 2.1 mm × 0.9 mm; RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (E) | Emiter | Main emitter connection; tied to RF ground in common-base LNA configurations |
| 2 (C) | Collector | RF output node; requires DC blocking and impedance matching to 50 Ω load |
| 3 (E) | Emiter | Second emitter terminal - internally connected to Pin 1; used for improved grounding in high-frequency layouts |
| 4 (B) | Base | RF input node; biased via resistive divider or RF choke; sensitive to parasitic inductance |
Key Features
| Feature | Design Value |
|---|---|
| Low-noise amplification | F = 0.9 dB at 900 MHz enables >1 dB improvement in receiver noise floor vs. higher-F alternatives |
| High fT with controlled parasitics | fT = 8 GHz + verified Ccb/Ceb values allow accurate wideband S-parameter simulation |
| Dual-emitter configuration | Pins 1 & 3 both emitter - reduces bond wire inductance and improves grounding above 1 GHz |
| AEC-Q101 qualified | Validated for automotive RF modules requiring reliability under temperature cycling and vibration |
| SPICE model provided | Full Gummel-Poon model with 49 parameters - eliminates need for behavioral approximation in Cadence/Spectre |
Applications
| Cellular Handset LNA | ISM Band Transceiver Front-End |
|---|---|
Use Scenario: Low-noise amplification of 900 MHz receive signal before downconversion in GSM/EDGE handset RFIC path. IC Role / Device Role / Timing Role: Discrete NPN RF transistor configured as common-emitter LNA with external matching networks. Use Value: 0.9 dB noise figure directly improves receiver sensitivity by ~1.2 dB over competing 1.2 dB solutions at same gain. | Use Scenario: 2.4 GHz Wi-Fi or Bluetooth receiver pre-amplifier in compact IoT sensor nodes. IC Role / Device Role / Timing Role: High-gain broadband amplifier operating at IC = 10 mA, VCE = 8 V with 50 Ω input/output match. Use Value: 22 dB maximum stable gain at 900 MHz scales predictably to 16.5 dB at 1.8 GHz - simplifies multi-band front-end reuse. |
| Automotive Keyless Entry Receiver | UWB Pulse Amplifier Stage |
Use Scenario: 315/433 MHz RKE receiver LNA in automotive body control modules. IC Role / Device Role / Timing Role: AEC-Q101-qualified discrete transistor providing robust gain and ESD immunity in harsh environments. Use Value: VESD > 2 kV (HBM) and RthJS ≤ 235 K/W ensure reliable operation during cold-cranking and thermal cycling. | Use Scenario: First-stage amplification of sub-nanosecond UWB pulses in IEEE 802.15.4a/Zigbee UWB systems. IC Role / Device Role / Timing Role: Fast-switching NPN transistor biased in Class-A for linear pulse amplification without slew-induced distortion. Use Value: fT = 8 GHz and Ceb = 0.8 pF support <100 ps rise time preservation in pulse shaping networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP196WH6327XTSA1 | fT = 12 GHz, F = 1.1 dB at 900 MHz, VCEO = 15 V, same SOT343 package | Higher gain-bandwidth but 0.2 dB higher noise - suitable where bandwidth >1 GHz dominates over minimum NF | Select when designing for LTE Band 7 (2.6 GHz) or dual-band 900/1800 MHz with shared matching |
| MRF581W | fT = 5 GHz, F = 1.3 dB at 900 MHz, TO-92 package, non-AEC-Q101 | Larger footprint, no automotive qualification, lower fT limits upper-frequency margin | Use only in cost-sensitive consumer-grade 900 MHz receivers where AEC-Q101 and miniaturization are not required |
Compared with BFP196WH6327XTSA1 and MRF581W, BFP182WH6327XTSA1 offers optimal balance of ultra-low noise (0.9 dB), AEC-Q101 compliance, and SOT343 size - making it preferred for space-constrained automotive and handset LNAs where NF is primary spec.
Availability
BFP182WH6327XTSA1 is available at Aetrix Electronics and suitable for cellular handset LNA design, automotive keyless entry receivers, and ISM-band transceiver front-ends requiring stable component supply and full traceability.
Supply support for BFP182WH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and RF components, with global R&D and manufacturing infrastructure.
BFP182WH6327XTSA1 belongs to Infineon's BFP series of silicon RF transistors, engineered specifically for low-noise, high-linearity amplification in 300 MHz–2.5 GHz wireless infrastructure and mobile terminal applications.
FAQ
What is the recommended bias condition for minimum noise figure?
For minimum noise figure (0.9 dB), bias at IC = 3 mA and VCE = 6 V with source impedance ZS = ZSopt = 25 + j15 Ω, as characterized in the official Infineon datasheet revision 2007-04-20. External matching must replicate this complex impedance using microstrip or lumped LC networks.
Is the SOT343 package thermally enhanced?
Yes - the SOT343 package includes an exposed thermal pad on the bottom side, and RthJS ≤ 235 K/W is measured from junction to soldering point. Optimal thermal performance requires ≥20 mm² of 2-oz copper connected to the pad via ≥4 thermal vias to inner ground planes.
Does BFP182WH6327XTSA1 support pulsed RF operation?
Yes - the device supports pulsed operation with duty cycle D = 0 and pulse width tp ≥ 100 ns, where peak power can reach 3× DC-rated Ptot (750 mW). Derating curves in datasheet Figure 5 define exact limits based on tp and ambient temperature.
How does the dual-emitter configuration affect PCB layout?
The dual-emitter pins (1 and 3) must be shorted together with minimal trace length (<0.5 mm) and connected to RF ground via separate vias. This reduces common-emitter inductance and improves S11 below 1 GHz - critical for broadband input match stability.
BFP182WH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SC-82A, SOT-343
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Frequency - Transition:
- 8GHz
- Noise Figure (dB Typ @ f):
- 0.9dB ~ 1.3dB @ 900MHz ~ 1.8GHz
- Gain:
- 22dB
- Power - Max:
- 250mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 70 @ 10mA, 8V
- Current - Collector (Ic) (Max):
- 35mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT343-3D
BFP182WH6327XTSA1 FAQ
1.How can I place an order for BFP182WH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFP182WH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFP182WH6327XTSA1 reliable?
The price and inventory of BFP182WH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP182WH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BFP182WH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFP182WH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFP182WH6327XTSA1?
BFP182WH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFP182WH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFP182WH6327XTSA1?
For technical support, including BFP182WH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP182WH6327XTSA1 requirements.
6.How does Aetrix verify that BFP182WH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BFP182WH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP182WH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BFP182WH6327XTSA1?
All BFP182WH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP182WH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFP182WH6327XTSA1 part is unused and in its original packaging.
Return procedure for BFP182WH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFP182WH6327XTSA1 Tags

-
BFR182WH6327XTSA1
Infineon Technologies

-
BFR92PE6327HTSA1
Infineon Technologies

-
BFR360FH6327XTSA1
Infineon Technologies

-
BFR193FH6327XTSA1
Infineon Technologies

-
BFU550AR
NXP USA Inc.

-
BFR460L3E6327XTMA1
Infineon Technologies

-
MMBTH81
onsemi

-
BFU520WX
NXP USA Inc.

-
BFP840FESDH6327XTSA1
Infineon Technologies

-
BFP650H6327XTSA1
Infineon Technologies

-
BFU520AR
NXP USA Inc.

-
BFS483H6327XTSA1
Infineon Technologies
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
