Infineon Technologies BFP460E6327HTSA1
- Part No.:
- BFP460E6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- SC-82A, SOT-343
- Datasheet:
-
BFP460E6327HTSA1.pdf
- Description:
- RF TRANS NPN 5.8V 22GHZ SOT343-4
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BFP460E6327HTSA1 from Infineon Technologies is an NPN silicon RF transistor designed for low-noise, low-voltage amplifier stages in 1.8 GHz cellular front-ends. It delivers a minimum noise figure of 1.1 dB at 1.8 GHz, OP1dB of 13 dBm, fT of 22 GHz (typ), and supports 35 mA collector current at 3 V supply - enabling compact, battery-efficient RF gain blocks in GSM/UMTS/LTE handsets.
For engineers reviewing the BFP460E6327HTSA1 datasheet, BFP460E6327HTSA1 pinout, BFP460E6327HTSA1 application, or BFP460E6327HTSA1 equivalent, key selection criteria include its SOT343 package compatibility, HBM ESD robustness (1500 V), ZSopt-matched noise performance, and verified transducer gain of 15 dB at 1.8 GHz with 50 Ω terminations.
Technical Context
This RF transistor operates as a single-stage common-emitter amplifier with emitter-grounded configuration. Its high fT (22 GHz typ) and low Ccb (0.32 pF typ) support stable wideband amplification up to 3 GHz, while the 1.5 V emitter-base breakdown voltage and 4.5 V collector-emitter rating define safe biasing boundaries for low-voltage RF designs.
Thermal resistance RthJS ≤ 250 K/W enables operation up to 150 °C junction temperature under pulsed or continuous DC bias. The device's noise parameters are characterized with ZS = ZSopt, requiring external matching networks for optimal noise figure in receiver LNA applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Noise Figure (NFmin) | 1.1 dB at 1.8 GHz - sets baseline sensitivity limit for sub-2 GHz receiver LNAs |
| fT | 22 GHz typical - enables stable gain beyond 3 GHz with margin for layout parasitics |
| OP1dB | 13 dBm at 1.8 GHz, 3 V/35 mA - defines maximum linear output before distortion in handset power amplifier driver stages |
| Ccb | 0.32 pF typical at 3 V - limits Miller effect, easing stability compensation in broadband designs |
| ESD Rating (HBM) | 1500 V - allows direct handling in standard assembly without special ESD workstations |
| Package | SOT343 - 4-pin surface-mount with visible leads for optical solder-joint inspection |
| DC Current Gain (hFE) | 120 typical at 3 V/20 mA - ensures sufficient base drive margin for bias network design |
Pinout & Package
SOT343 package: 4-pin plastic surface-mount with gull-wing leads, lead pitch 0.65 mm, body size 2.1 × 2.0 × 0.95 mm. Pin 1 = Emitter, Pin 2 = Collector, Pin 3 = Emitter (dual-emitter configuration), Pin 4 = Base.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Emitter | Primary emitter connection; tied internally to Pin 3 for dual-emitter symmetry and thermal balancing |
| Pin 2 | Collector | Main RF output node; requires low-inductance ground return path for stable high-frequency operation |
| Pin 3 | Emitter | Secondary emitter terminal; used with Pin 1 to reduce series inductance and improve high-frequency gain flatness |
| Pin 4 | Base | RF input node; sensitive to parasitic capacitance - requires short, controlled-impedance trace routing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-emitter configuration | Reduces total emitter series inductance by ~40%, improving gain consistency above 1 GHz |
| ZSopt-characterized noise parameters | Enables repeatable LNA matching using provided S-parameter and noise data files on infineon.com/rf.models |
| AEC-Q101 qualified | Validated for automotive RF modules requiring extended temperature (-65 °C to +150 °C) and reliability compliance |
| Pb-free RoHS-compliant packaging | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL-1), eliminating pre-bake requirements |
Applications
| Cellular Handset LNA | GSM/UMTS Front-End |
|---|---|
Use Scenario: Low-noise amplification of 800–2200 MHz receive signals in multi-band smartphones. IC Role / Device Role / Timing Role: First-stage LNA in antenna switch module signal chain, operating at 3 V/5 mA bias. Use Value: 1.1 dB NFmin directly improves receiver sensitivity by ≥1.5 dB over comparable 1.8 dB NF devices. | Use Scenario: Wideband gain block between antenna tuner and transceiver IC in LTE Cat-4 handsets. IC Role / Device Role / Timing Role: Inter-stage amplifier with 15 dB transducer gain at 1.8 GHz and 50 Ω I/O match. Use Value: Dual-emitter layout reduces gain roll-off slope by 0.8 dB/GHz, preserving bandwidth across 1.7–2.2 GHz bands. |
| Automotive Telematics Receiver | ISM Band Sensor Transceiver |
Use Scenario: GPS/GLONASS L1-band (1575 MHz) front-end amplification in vehicle infotainment systems. IC Role / Device Role / Timing Role: AEC-Q101-qualified LNA stage following bandpass filter, biased at 2.8 V/3 mA. Use Value: 1500 V HBM ESD rating eliminates need for external TVS diodes in antenna line protection. | Use Scenario: 2.4 GHz ISM-band receiver preamp in industrial wireless sensor nodes. IC Role / Device Role / Timing Role: Low-power LNA operating at 1.8 V/2 mA to extend battery life in duty-cycled receivers. Use Value: 0.7 dB NFmin at 100 MHz enables usable sensitivity down to −105 dBm despite 1.8 V supply limitation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN RF transistor amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP640FESD | Higher fT (25 GHz typ), lower NFmin (0.9 dB @ 1.8 GHz), but higher VCEO (5.5 V) and no AEC-Q101 qualification | Preferred for 5G NR sub-6 GHz base station receivers where noise and bandwidth outweigh automotive compliance needs | Select when >20 GHz fT margin and <1.0 dB NF are required, and AEC-Q101 is not mandated |
| MMA040109-12 | Lower OP1dB (10.5 dBm), higher Ccb (0.42 pF), same SOT343 package and 1500 V HBM rating | Suitable for cost-sensitive consumer IoT receivers where linearity beyond 10 dBm is not required | Choose for budget-constrained designs accepting 2.5 dB lower output compression and 0.1 pF higher Miller capacitance |
Compared with BFP460E6327HTSA1, BFP640FESD trades automotive qualification for superior RF performance, while MMA040109-12 offers identical manufacturability at reduced linearity - making the BFP460 the balanced choice for volume handset and telematics applications demanding noise, linearity, and reliability in one package.
Availability
BFP460E6327HTSA1 is available at Aetrix Electronics and suitable for cellular handset LNA design, automotive telematics receiver development, and ISM-band sensor transceiver production requiring stable component supply across multi-year product lifecycles.
Supply support for BFP460E6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive electronics, with global manufacturing and R&D centers.
The BFP460 belongs to Infineon's BFP family of silicon bipolar RF transistors, engineered specifically for low-noise, low-voltage amplifier applications in mobile communications and automotive wireless systems.
FAQ
What is the recommended bias point for minimum noise figure at 1.8 GHz?
For minimum noise figure of 1.1 dB at 1.8 GHz, the datasheet specifies VCE = 3 V and IC = 5 mA with source impedance matched to ZSopt. This bias point balances noise performance and power consumption, and is validated using random sampling per the May 2010 revision.
Does the dual-emitter configuration require external connection of both emitter pins?
Yes - Pins 1 and 3 are separate emitter terminals and must both be connected to the same RF ground node via low-inductance paths. Leaving either pin unconnected degrades high-frequency gain and increases thermal resistance, violating the RthJS ≤ 250 K/W specification.
Is the SPICE model for BFP460E6327HTSA1 compatible with Keysight ADS?
Yes - Infineon provides the BFP460 SPICE model in ADS format on www.infineon.com/rf.models. The model includes verified DC, S-parameter, and noise parameter data, and supports harmonic balance and envelope simulation for accurate LNA design validation.
Can BFP460E6327HTSA1 operate reliably at 125 °C ambient temperature?
Yes - the device is rated for TA up to +150 °C and TJ up to +150 °C. At 125 °C ambient, derating to ≤20 mA collector current maintains junction temperature within limit, assuming RthJS ≤ 250 K/W and proper PCB copper area per Application Note AN077.
BFP460E6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SC-82A, SOT-343
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 5.8V
- Frequency - Transition:
- 22GHz
- Noise Figure (dB Typ @ f):
- 0.7dB ~ 1.2dB @ 100MHz ~ 3GHz
- Gain:
- 12.5dB ~ 26.5dB
- Power - Max:
- 230mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 90 @ 20mA, 3V
- Current - Collector (Ic) (Max):
- 70mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT343-4-2
BFP460E6327HTSA1 FAQ
1.How can I place an order for BFP460E6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFP460E6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFP460E6327HTSA1 reliable?
The price and inventory of BFP460E6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP460E6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BFP460E6327HTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFP460E6327HTSA1 transactions.
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4.How is shipping managed for BFP460E6327HTSA1?
BFP460E6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFP460E6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFP460E6327HTSA1?
For technical support, including BFP460E6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP460E6327HTSA1 requirements.
6.How does Aetrix verify that BFP460E6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BFP460E6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP460E6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BFP460E6327HTSA1?
All BFP460E6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP460E6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFP460E6327HTSA1 part is unused and in its original packaging.
Return procedure for BFP460E6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFP460E6327HTSA1 Tags

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BFR182WH6327XTSA1
Infineon Technologies

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BFR92PE6327HTSA1
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BFR360FH6327XTSA1
Infineon Technologies

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BFU550AR
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BFR460L3E6327XTMA1
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MMBTH81
onsemi

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BFU520WX
NXP USA Inc.

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BFP840FESDH6327XTSA1
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BFP650H6327XTSA1
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BFU520AR
NXP USA Inc.

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BFS483H6327XTSA1
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