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Infineon Technologies BFP520H6327XTSA1

Part No.:
BFP520H6327XTSA1
Manufacturer:
Infineon Technologies
Category:
Bipolar RF Transistors
Package:
SC-82A, SOT-343
Datasheet:
AetrixBFP520H6327XTSA1.pdf
Description:
RF TRANS NPN 3.5V 45GHZ SOT343-4
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,000

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Product details

Overview

BFP540ESD from Infineon is a silicon NPN RF bipolar transistor in SOT343 package, designed for low-noise amplification at 1.8 GHz with NFmin = 0.9 dB, Gms = 21.5 dB, and OIP3 = 24.5 dBm under 2 V / 20 mA bias; used in LNB local oscillators and broadband CATV/DVB-T LNAs.

For engineers reviewing the BFP540ESD datasheet, BFP540ESD pinout, BFP540ESD application, or BFP540ESD equivalent, key selection criteria include ESD robustness (1 kV HBM), grounded-emitter SIEGET™ architecture, fT = 21–30 GHz, and industrial/AEC-Q101 qualification for RF front-end stability.

Technical Context

The BFP540ESD employs Infineon's fifth-generation SIEGET™ (Silicon Germanium Grounded-Emitter Transistor) structure, enabling high fT (21–30 GHz) and low noise via optimized emitter-base geometry and epitaxial layer design. Its ESD protection integrates on-chip diodes without degrading RF performance.

It operates with VCE = 2 V, IC = 5–20 mA, and delivers stable transducer gain and noise figure across 1.8–3 GHz; biasing requires external DC blocking and matching networks due to its grounded-emitter configuration and 50 Ω system compatibility.

Key Specifications

ParameterValue and Actual Design Meaning
NFmin0.9 dB at 1.8 GHz, 2 V, 5 mA - enables ultra-low-noise receive-chain amplification in sensitive RF front ends
Gms21.5 dB at 1.8 GHz, 2 V, 20 mA - provides high small-signal power gain for single-stage LNA designs
OIP324.5 dBm at 1.8 GHz, 2 V, 20 mA - supports strong linearity in multi-carrier CATV and DVB-T systems
fT21–30 GHz - ensures usable gain margin up to 3 GHz for wideband wireless applications
ESD Robustness1 kV HBM typical - eliminates need for external ESD protection in compact RF modules
VCEO4.5 V - defines maximum collector-emitter voltage swing before breakdown in grounded-emitter topology
hFE50–170 at VCE = 3.5 V, IC = 20 mA - supports predictable DC biasing and thermal stability in production designs

Pinout & Package

Package: SOT343 - surface-mount plastic package with 4 terminals, 1.3 mm × 1.3 mm footprint, 0.95 mm height, and lead pitch of 0.65 mm; optimized for RF layout with low parasitic inductance and thermal resistance RthJS = 290 K/W.

Pin/TerminalCircuit RoleDesign Meaning
1 (B)BaseRF input node requiring DC bias and AC coupling; base-emitter junction controls transconductance
2 (E)EmitterAC ground reference and DC return path; dual emitter pins (2 & 4) reduce series inductance
3 (C)CollectorRF output node with DC supply feed; collector-emitter voltage must stay ≤4.5 V
4 (E)EmitterSecond emitter terminal for parallel connection to minimize bond wire inductance and improve high-frequency stability

Key Features

FeatureDesign Value
SIEGET™ grounded-emitter architectureReduces base resistance and emitter inductance, enabling higher fT and lower NF than conventional top-emitter RF transistors
Integrated ESD protection1 kV HBM rating allows direct PCB mounting without external TVS, reducing bill-of-materials in space-constrained RF modules
Industrial and AEC-Q101 qualifiedValidated per JEDEC JESD47/JESD22/J-STD-020 and AEC-Q101 - suitable for automotive infotainment and industrial wireless gateways
Dual emitter terminalsTwo separate emitter pins (2 & 4) enable symmetric grounding and improved thermal dissipation in high-gain amplifier layouts

Applications

LNB Local OscillatorCATV Broadband LNA

Use Scenario: Low-phase-noise signal generation in satellite TV downconverters operating at 950–2150 MHz.

IC Role / Device Role / Timing Role: NPN RF transistor configured as grounded-emitter oscillator core with external LC tank and bias network.

Use Value: NFmin = 0.9 dB and fT > 21 GHz support low close-in phase noise and stable oscillation at Ku-band frequencies.

Use Scenario: First-stage amplification in coaxial cable distribution systems handling 5–1002 MHz DOCSIS signals.

IC Role / Device Role / Timing Role: Single-transistor common-emitter LNA with 50 Ω input/output matching and DC bias stabilization.

Use Value: OIP3 = 24.5 dBm ensures minimal intermodulation distortion across multi-channel QAM carriers.

DVB-T Tuner Front EndCordless Phone RF Receiver

Use Scenario: Terrestrial digital TV reception in portable set-top boxes and integrated tuners (470–862 MHz).

IC Role / Device Role / Timing Role: Low-noise pre-amplifier preceding SAW filter and mixer; biased at 2 V / 5 mA for optimal NF.

Use Value: 0.9 dB NFmin directly improves receiver sensitivity and BER performance in weak-signal urban environments.

Use Scenario: 1.9 GHz DECT 6.0 handset receiver front end with stringent ESD requirements in consumer housing.

IC Role / Device Role / Timing Role: Input-stage LNA with integrated ESD protection and minimal external components.

Use Value: 1 kV HBM rating eliminates need for discrete ESD diodes, reducing PCB area and assembly cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF bipolar transistor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
BFP640H6327XTSA1fT = 40 GHz, NFmin = 0.75 dB at 2 GHz, but VCEO = 3.5 V and Ptot = 150 mWBetter noise and speed, but lower voltage headroom and power handlingSelect when optimizing for ultra-low NF in narrowband 2.4 GHz ISM receivers
MMA040407-100SiGe HBT, NFmin = 0.8 dB at 1.9 GHz, OIP3 = 25.5 dBm, but requires 3.3 V bias and larger SOT-343 variantHigher integration level with internal bias resistors; not drop-in compatibleChoose for simplified biasing in new designs where board space permits revised layout

Compared with BFP540ESD, BFP640 offers superior noise and bandwidth but reduced voltage tolerance, while MMA040407-100 delivers higher linearity and integrated biasing at the cost of pinout and footprint compatibility.

Availability

BFP540ESD is available at Aetrix Electronics and suitable for LNB local oscillators, CATV broadband LNAs, and DVB-T tuner front ends requiring stable component supply, full traceability, and long-term lifecycle support.

Supply support for BFP540ESD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with global manufacturing and R&D infrastructure.

The BFP540ESD belongs to Infineon's fifth-generation SIEGET™ RF bipolar transistor family, engineered specifically for high-performance, cost-effective low-noise amplification in consumer and industrial wireless infrastructure.

FAQ

What is the recommended bias condition for minimum noise figure?

The BFP540ESD achieves NFmin = 0.9 dB at 1.8 GHz with VCE = 2 V and IC = 5 mA. This requires precise DC biasing using emitter degeneration and base voltage divider networks to stabilize quiescent current against temperature drift and process variation.

Can BFP540ESD replace BFP520 in existing designs?

No - BFP520 is a legacy 3-pin SOT-23 device with different pinout, lower fT (~12 GHz), and no integrated ESD protection. BFP540ESD uses SOT343 with dual emitters and requires PCB layout revision, matching network re-optimization, and updated biasing.

Is thermal derating required above 77 °C soldering point temperature?

Yes - total power dissipation drops linearly beyond TS = 77 °C, reaching zero at TS = 125 °C per Figure 1. Designers must limit ambient temperature, use thermal vias, and verify junction temperature stays below 150 °C under worst-case RF + DC load.

Does the dual-emitter configuration require both pins to be connected?

Yes - both emitter pins (2 and 4) must be tied together and connected to RF ground and DC return. Leaving either unconnected increases effective emitter inductance, degrading gain flatness and stability above 1 GHz.

BFP520H6327XTSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
SC-82A, SOT-343
Packaging:
Tape & Reel (TR)
Product Status:
Active
Transistor Type:
NPN
Voltage - Collector Emitter Breakdown (Max):
3.5V
Frequency - Transition:
45GHz
Noise Figure (dB Typ @ f):
0.95dB @ 1.8GHz
Gain:
22.5dB
Power - Max:
100mW
DC Current Gain (hFE) (Min) @ Ic, Vce:
70 @ 20mA, 2V
Current - Collector (Ic) (Max):
40mA
Operating Temperature:
150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-SOT343-3D

BFP520H6327XTSA1 FAQ

1.How can I place an order for BFP520H6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BFP520H6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BFP520H6327XTSA1 reliable?

The price and inventory of BFP520H6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP520H6327XTSA1 is usually 5 days.

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Once your BFP520H6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BFP520H6327XTSA1?

For technical support, including BFP520H6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP520H6327XTSA1 requirements.

6.How does Aetrix verify that BFP520H6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BFP520H6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP520H6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BFP520H6327XTSA1?

All BFP520H6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP520H6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BFP520H6327XTSA1 part is unused and in its original packaging.

Return procedure for BFP520H6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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