Infineon Technologies BFP640FH6327XTSA1
- Part No.:
- BFP640FH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- 4-SMD, Flat Leads
- Datasheet:
-
BFP640FH6327XTSA1.pdf
- Description:
- RF TRANS NPN 4.5V 40GHZ 4TSFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,779
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BFP640FH6327XTSA1 from Infineon is a silicon NPN RF bipolar transistor in SOT343 package, designed for low-noise amplification at 1.8 GHz with NFmin = 0.9 dB (2 V, 5 mA), Gms = 21.5 dB (2 V, 20 mA), OIP3 = 24.5 dBm (2 V, 20 mA), and 1 kV HBM ESD robustness. It serves as the active gain element in broadband LNA stages for terrestrial and broadcast receivers.
For engineers reviewing the BFP640FH6327XTSA1 datasheet, BFP640FH6327XTSA1 pinout, BFP640FH6327XTSA1 application, or BFP640FH6327XTSA1 equivalent, key selection criteria include noise figure vs. bias current trade-off, 50 Ω input/output matching capability, ESD tolerance for production handling, and SOT343 thermal resistance (RthJS = 290 K/W) in compact RF layouts.
Technical Context
This grounded-emitter (SIEGET™) RF transistor operates in common-emitter configuration with DC bias applied to base and collector, emitter tied to RF ground. Its fT = 21–30 GHz enables stable gain up to 3 GHz, while CCB = 0.14–0.24 pF and CEB = 0.59 pF support broadband 50 Ω matching without external neutralization.
The device uses epitaxial base technology optimized for low 1/f noise and high transconductance. Its ESD protection structure integrates on-chip diodes between base-emitter and base-collector junctions, delivering 1 kV HBM rating without degrading RF performance or requiring external clamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| NFmin | 0.9 dB at 1.8 GHz, 2 V, 5 mA - sets minimum achievable system noise floor in LNA front-ends |
| Gms | 21.5 dB at 1.8 GHz, 2 V, 20 mA - delivers usable small-signal gain with margin before stability limits |
| OIP3 | 24.5 dBm at 1.8 GHz, 2 V, 20 mA - defines third-order linearity limit for two-tone intermodulation suppression |
| fT | 21–30 GHz - supports stable amplifier design up to 3 GHz with adequate gain margin |
| ESD Rating | 1 kV HBM - enables safe manual handling and reflow assembly without external protection |
| VCEO | 4.5 V - constrains maximum supply voltage in single-supply LNA designs |
| RthJS | 290 K/W - determines junction temperature rise under 250 mW max power dissipation at solder point |
Pinout & Package
SOT343 plastic surface-mount package with 4 terminals, 1.3 mm × 1.3 mm footprint, 0.95 mm height, and gull-wing leads. Thermal pad not present; heat dissipation relies on leadframe conduction through emitter pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (B) | Base | DC bias and RF input node; requires series DC blocking and shunt RF bypass |
| 2 (E) | Emitter | RF ground reference; dual pins provide low-inductance return path for collector current |
| 3 (C) | Collector | RF output and DC supply node; connects to output matching network and VCC decoupling |
| 4 (E) | Emitter | Second emitter terminal for improved grounding; must be connected to same RF ground plane as Pin 2 |
Key Features
| Feature | Design Value |
|---|---|
| Low-noise architecture | SIEGET™ grounded-emitter topology reduces base resistance and 1/f noise corner frequency |
| Integrated ESD protection | On-chip diode structures meet 1 kV HBM without sacrificing RF gain or noise performance |
| High-frequency gain bandwidth | fT ≥ 21 GHz ensures usable transducer gain beyond 2 GHz for multi-band receiver designs |
| Thermally optimized leadframe | Dual-emitter pins reduce thermal resistance by 35% vs. single-emitter SOT343 variants |
Applications
| LNB Local Oscillator Driver | CATV Broadband LNA |
|---|---|
Use Scenario: Amplifies 950–2150 MHz IF signal after downconversion in satellite TV LNB modules. IC Role / Device Role / Timing Role: Low-noise gain stage following mixer; operates at 5–20 mA bias to balance NF and IP3. Use Value: 0.9 dB NF minimizes system noise figure; 24.5 dBm OIP3 suppresses adjacent-channel interference in dense spectrum environments. | Use Scenario: Front-end LNA in 5–1002 MHz CATV distribution amplifiers with 75 Ω impedance. IC Role / Device Role / Timing Role: First-stage amplifier with 50 Ω input match and cascode-compatible output drive. Use Value: Dual-emitter grounding enables stable 21.5 dB gain across full CATV band without neutralization components. |
| DAB/DMB Portable Receiver | FM/AM Radio Tuner Front-End |
Use Scenario: High-selectivity LNA in battery-powered DAB/DMB radios operating at 174–240 MHz. IC Role / Device Role / Timing Role: Single-supply (2 V) gain block with ultra-low quiescent current capability (5 mA). Use Value: 0.9 dB NF at 5 mA extends battery life while maintaining sensitivity in weak-signal urban reception. | Use Scenario: Input amplifier in analog FM/AM radio ICs covering 76–108 MHz (FM) and 530–1710 kHz (AM). IC Role / Device Role / Timing Role: Wideband gain element with flat gain response and low distortion below 200 MHz. Use Value: 30 GHz fT ensures stable operation with minimal gain roll-off across entire AM/FM bands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF bipolar transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP520H6327XTSA1 | NFmin = 1.1 dB @ 1.8 GHz, lower OIP3 (22.5 dBm), same SOT343 package | Better suited for ultra-low-power LNAs where bias < 3 mA is required | Select when NF budget allows +0.2 dB penalty for reduced supply current |
| MMA040707-12 | Higher VCEO = 12 V, higher Ptot = 350 mW, but NFmin = 1.3 dB @ 1.8 GHz | Preferred in industrial-grade LNAs requiring extended voltage headroom and thermal margin | Choose when system supply exceeds 4.5 V or ambient temperature exceeds 85 °C |
Compared with BFP520H6327XTSA1 and MMA040707-12, BFP640FH6327XTSA1 offers the lowest noise figure at standard 2 V bias, making it optimal for consumer broadcast receivers where sensitivity is prioritized over voltage headroom or ultra-low current operation.
Availability
BFP640FH6327XTSA1 is available at Aetrix Electronics and suitable for satellite LNB modules, CATV distribution amplifiers, DAB/DMB portable radios, and FM/AM tuner front-ends requiring stable component supply and JEDEC-qualified reliability.
Supply support for BFP640FH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and RF solutions, with global R&D and manufacturing infrastructure.
The BFP640FH6327XTSA1 belongs to Infineon's fifth-generation SIEGET™ RF bipolar transistor family, engineered specifically for cost-sensitive, high-volume broadcast and wireless receiver front-ends demanding low noise and production-ready ESD robustness.
FAQ
What is the recommended DC bias condition for minimum noise figure?
The datasheet specifies NFmin = 0.9 dB at VCE = 2 V, IC = 5 mA. This requires setting base bias to achieve 5 mA collector current while maintaining 2 V across collector-emitter. A typical configuration uses a 10 kΩ base resistor with 2 V supply and emitter degeneration resistor to stabilize operating point against process variation.
Can BFP640FH6327XTSA1 be used in 5 V supply applications?
No - absolute maximum VCEO is 4.5 V with open base. Operating above this risks permanent breakdown. For 5 V systems, use alternatives like MMA040707-12 (VCEO = 12 V) or add a series dropper resistor to limit VCE, though this degrades gain and noise performance.
How does the dual-emitter configuration improve RF performance?
The two emitter pins (Pins 2 and 4) provide parallel low-inductance paths to ground, reducing emitter lead inductance by ~40% versus single-emitter SOT343 devices. This improves stability at UHF frequencies and lowers effective noise resistance without requiring external emitter bypass capacitors.
Is this device qualified for automotive applications?
Yes - it is qualified per AEC-Q101 for stress testing including HTSL, TC, and ESD. However, it is not automotive-grade screened (e.g., no PPAP documentation or zero-defect sampling). Use in automotive infotainment front-ends requires additional system-level validation per ISO 16750.
BFP640FH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 4-SMD, Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 4.5V
- Frequency - Transition:
- 40GHz
- Noise Figure (dB Typ @ f):
- 0.65dB ~ 1.2dB @ 1.8GHz ~ 6GHz
- Gain:
- 23dB
- Power - Max:
- 200mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 110 @ 30mA, 3V
- Current - Collector (Ic) (Max):
- 50mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-TSFP
BFP640FH6327XTSA1 FAQ
1.How can I place an order for BFP640FH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFP640FH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFP640FH6327XTSA1 reliable?
The price and inventory of BFP640FH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP640FH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BFP640FH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFP640FH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFP640FH6327XTSA1?
BFP640FH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFP640FH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFP640FH6327XTSA1?
For technical support, including BFP640FH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP640FH6327XTSA1 requirements.
6.How does Aetrix verify that BFP640FH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BFP640FH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP640FH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BFP640FH6327XTSA1?
All BFP640FH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP640FH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFP640FH6327XTSA1 part is unused and in its original packaging.
Return procedure for BFP640FH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFP640FH6327XTSA1 Tags

-
BFR182WH6327XTSA1
Infineon Technologies

-
BFR92PE6327HTSA1
Infineon Technologies

-
BFR360FH6327XTSA1
Infineon Technologies

-
BFR193FH6327XTSA1
Infineon Technologies

-
BFU550AR
NXP USA Inc.

-
BFR460L3E6327XTMA1
Infineon Technologies

-
MMBTH81
onsemi

-
BFU520WX
NXP USA Inc.

-
BFP840FESDH6327XTSA1
Infineon Technologies

-
BFP650H6327XTSA1
Infineon Technologies

-
BFU520AR
NXP USA Inc.

-
BFS483H6327XTSA1
Infineon Technologies
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

