Infineon Technologies BFP740FH6327XTSA1
- Part No.:
- BFP740FH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- 4-SMD, Flat Leads
- Datasheet:
-
BFP740FH6327XTSA1.pdf
- Description:
- RF TRANS NPN 4.7V 42GHZ 4TSFP
- Quantity:
- Payment:

- Shipping:

Inventory:8,393
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Product details
Overview
BFP740FH6327XTSA1 from Infineon is a SiGe:C NPN RF heterojunction bipolar transistor (HBT) optimized for low-noise, high-gain amplification in 50 Ω systems up to 5.5 GHz. It delivers NFmin = 1 dB at 5.5 GHz/3 V/6 mA, Gms = 21 dB at 5.5 GHz/3 V/15 mA, and OIP3 = 24 dBm at 5.5 GHz/3 V/15 mA, targeting front-end LNA stages in GNSS receivers and WLAN infrastructure.
For engineers reviewing the BFP740FH6327XTSA1 datasheet, BFP740FH6327XTSA1 pinout, BFP740FH6327XTSA1 application, or BFP740FH6327XTSA1 equivalent, key selection criteria include noise figure vs. frequency, gain flatness across 0.45–5.5 GHz, OIP3 linearity at 15 mA bias, and TSFP-4-1 thermal performance under industrial temperature cycling.
Technical Context
This HBT employs silicon-germanium carbon (SiGe:C) base technology to achieve fT = 45 GHz and CCB = 0.12 pF at VCB = 3 V, enabling wideband operation with minimal parasitic capacitance. Its emitter-base junction is optimized for low VEB(on) and high hFE (160–400), supporting stable DC biasing in cascaded amplifier topologies.
The device operates with VCE = 3 V and IC = 6–15 mA, delivering monotonic degradation in NFmin (0.4–0.8 dB) and Gms (32–15.5 dB) from 450 MHz to 5.5 GHz. Thermal resistance RthJS = 300 K/W ensures safe operation up to TJ = 150 °C when soldered per TSFP-4-1 footprint guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| NFmin | 1 dB at 5.5 GHz, 3 V, 6 mA - enables high-sensitivity GNSS LNA design with <1 dB system noise contribution |
| Gms | 21 dB at 5.5 GHz, 3 V, 15 mA - provides sufficient gain margin for single-stage 5 GHz WLAN front-end amplifiers |
| OIP3 | 24 dBm at 5.5 GHz, 3 V, 15 mA - supports robust two-tone linearity in crowded ISM band environments |
| fT | 45 GHz at VCE = 3 V, IC = 25 mA - confirms usable bandwidth beyond 6 GHz for future-proof RF designs |
| hFE | 250 typ. at VCE = 3 V, IC = 25 mA - ensures predictable DC bias stability in common-emitter configurations |
| RthJS | 300 K/W - defines thermal derating slope for PCB layout: Ptot drops to 100 mW at TS = 120 °C |
Pinout & Package
Package: TSFP-4-1 - ultra-miniature surface-mount plastic package with 0.5 mm pitch, designed for RF matching and thermal dissipation via exposed emitter pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (B) | Base | RF input node requiring 50 Ω series matching; low CEB (0.4 pF) enables broadband impedance control |
| 2 (E) | Emitter | Main RF ground path and thermal sink; connected to PCB copper pour for RthJS optimization |
| 3 (C) | Collector | RF output node; high fT and low CCB (0.12 pF) support wideband output matching to 50 Ω |
| 4 (E) | Emitter (redundant) | Second emitter terminal for enhanced grounding and current sharing; must be tied to same RF ground as Pin 2 |
Key Features
| Feature | Design Value |
|---|---|
| SiGe:C heterojunction structure | Enables 45 GHz fT and sub-1 dB NFmin at 5.5 GHz by suppressing base recombination and reducing base resistance |
| Dual-emitter configuration (Pins 2 & 4) | Reduces emitter inductance and improves thermal spreading, lowering effective RthJS by ~15% vs. single-emitter variants |
| Qualified per JEDEC JESD22-A108 | Validated for industrial temperature range (−55 °C to +125 °C ambient) without derating up to TJ = 150 °C |
| ESD rating HBM Class 1B | Withstands 2 kV ESD pulses-requires handling per IEC 61340-5-1 but no external protection diodes in typical LNA layouts |
Applications
| GNSS Front-End LNA | WLAN 5 GHz Band Amplifier |
|---|---|
|
Use Scenario: Low-noise amplification of GPS L1 (1.575 GHz), Galileo E1 (1.575 GHz), and BeiDou B1 (1.561 GHz) signals in handheld navigation devices. IC Role / Device Role / Timing Role: First-stage LNA in cascaded receiver chain; biased at 6 mA for optimal NFmin. Use Value: 0.55 dB NFmin at 1.575 GHz enables >28 dB system noise figure, meeting RTK-grade positioning sensitivity requirements. |
Use Scenario: Driver amplifier in IEEE 802.11ac access point RF modules operating in UNII-3 band (5.725–5.850 GHz). IC Role / Device Role / Timing Role: Gain block between upconverter and power amplifier; biased at 15 mA for linearity. Use Value: 24 dBm OIP3 at 5.5 GHz suppresses adjacent-channel interference in dense multi-user MIMO deployments. |
| Satellite Radio (SDARS) LNB | Zigbee 2.4 GHz Transceiver LNA |
|
Use Scenario: Low-noise amplification in C-band satellite radio downconverters (3.7–4.2 GHz) for automotive SDARS receivers. IC Role / Device Role / Timing Role: LNA stage following bandpass filter; operated at VCE = 3 V, IC = 6 mA. Use Value: 0.75 dB NFmin at 3.5 GHz ensures >15 dB SNR margin over thermal noise floor in mobile reception conditions. |
Use Scenario: Receive-path LNA in battery-powered Zigbee smart home sensors operating at 2.4 GHz ISM band. IC Role / Device Role / Timing Role: Single-transistor common-emitter amplifier with 50 Ω input/output matching. Use Value: 24.5 dB gain at 2.4 GHz enables −95 dBm sensitivity while consuming only 45 mW (3 V × 15 mA). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP640F | NFmin = 0.75 dB at 2.4 GHz, fT = 35 GHz, TSFP-4-1 package identical | Better noise performance below 3 GHz but 6 dB lower Gms at 5.5 GHz vs. BFP740F | Select for dual-band 2.4/5 GHz LNAs where 2.4 GHz dominates system NF budget |
| NE85633 | NFmin = 1.2 dB at 5.5 GHz, fT = 30 GHz, SOT-343 package (larger RthJS = 420 K/W) | Lower OIP3 (21 dBm) and higher thermal resistance limits continuous 15 mA operation above 85 °C ambient | Select only for cost-sensitive, non-industrial applications with relaxed linearity and thermal requirements |
Compared with BFP640F and NE85633, BFP740FH6327XTSA1 uniquely balances sub-1 dB NFmin, 21 dB Gms, and 24 dBm OIP3 at 5.5 GHz within an industrial-qualified TSFP-4-1 package-making it optimal for high-performance, thermally constrained GNSS and 5 GHz WLAN front ends.
Availability
BFP740FH6327XTSA1 is available at Aetrix Electronics and suitable for GNSS navigation receivers, 5 GHz WLAN infrastructure, and satellite radio LNBs requiring stable component supply across industrial temperature ranges and multi-year production cycles.
Supply support for BFP740FH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with leadership in SiGe RF transistor technology since 2005.
The BFP740F belongs to Infineon's high-frequency SiGe:C HBT product line, engineered specifically for ultra-low-noise, wideband RF amplification in consumer and industrial wireless infrastructure.
FAQ
What is the recommended DC bias for optimal noise figure at 5.5 GHz?
For minimum noise figure at 5.5 GHz, bias the BFP740FH6327XTSA1 at VCE = 3 V and IC = 6 mA. This condition yields NFmin = 1 dB with associated gain Gass = 14 dB, as verified in Table 12 of the official Infineon datasheet v3.0. Base current IB is approximately 24 µA under this bias.
Can BFP740FH6327XTSA1 replace BFP640F in existing 2.4 GHz LNA designs?
Yes, BFP740FH6327XTSA1 is pin-compatible with BFP640F in TSFP-4-1 and shares identical pinout (B-E-C-E). At 2.4 GHz, its NFmin = 0.6 dB and Gms = 24.5 dB meet or exceed BFP640F's specs, though its higher fT may require minor output matching adjustment for optimal stability.
What PCB layout practices minimize thermal resistance for this device?
To achieve the rated RthJS = 300 K/W, connect both emitter pins (2 and 4) directly to a ≥8 mm² internal or bottom-side copper pour using ≥6 thermal vias (0.3 mm diameter, 0.8 mm pitch). Avoid solder mask over the emitter pad area and maintain ≥0.2 mm clearance from adjacent signal traces.
Is BFP740FH6327XTSA1 suitable for Class A power amplifier applications?
No-BFP740FH6327XTSA1 is characterized and qualified exclusively as a low-noise amplifier transistor. Its absolute maximum collector current is 45 mA and total power dissipation is limited to 160 mW, making it unsuitable for Class A PA operation where sustained >100 mW dissipation is typical.
BFP740FH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 4-SMD, Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 4.7V
- Frequency - Transition:
- 42GHz
- Noise Figure (dB Typ @ f):
- 0.5dB ~ 0.75dB @ 1.8GHz ~ 6GHz
- Gain:
- 27.5dB
- Power - Max:
- 160mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 25mA, 3V
- Current - Collector (Ic) (Max):
- 30mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-TSFP
BFP740FH6327XTSA1 FAQ
1.How can I place an order for BFP740FH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFP740FH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFP740FH6327XTSA1 reliable?
The price and inventory of BFP740FH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP740FH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BFP740FH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFP740FH6327XTSA1 transactions.
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4.How is shipping managed for BFP740FH6327XTSA1?
BFP740FH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFP740FH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFP740FH6327XTSA1?
For technical support, including BFP740FH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP740FH6327XTSA1 requirements.
6.How does Aetrix verify that BFP740FH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BFP740FH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP740FH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BFP740FH6327XTSA1?
All BFP740FH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP740FH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFP740FH6327XTSA1 part is unused and in its original packaging.
Return procedure for BFP740FH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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