Infineon Technologies BFP740H6327XTSA1
- Part No.:
- BFP740H6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- SC-82A, SOT-343
- Datasheet:
-
BFP740H6327XTSA1.pdf
- Description:
- RF TRANS NPN 4.7V 42GHZ SOT343
- Quantity:
- Payment:

- Shipping:

Inventory:1,967
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Product details
Overview
BFP740H6327XTSA1 from Infineon is a SiGe:C NPN RF heterojunction bipolar transistor (HBT) optimized for low-noise, high-gain amplification in 0.45–5.5 GHz front-end stages. It delivers NFmin = 0.85 dB at 5.5 GHz/3 V/6 mA, Gms = 19.5 dB at 5.5 GHz/3 V/15 mA, and OIP3 = 24.5 dBm at same bias, targeting GNSS LNA and WLAN receiver modules.
For engineers reviewing the BFP740H6327XTSA1 datasheet, BFP740H6327XTSA1 pinout, BFP740H6327XTSA1 application, or BFP740H6327XTSA1 equivalent, key selection criteria include noise figure vs. frequency trade-offs, SOT343 thermal resistance (RthJS = 310 K/W), ESD sensitivity (Class 1C), and DC bias stability across industrial temperature range (−55 °C to 150 °C).
Technical Context
The BFP740 operates as a single-stage common-emitter RF amplifier with emitter-degenerated biasing, supporting broadband matching from 450 MHz to 5.5 GHz. Its SiGe:C process enables high fT = 44 GHz and low CCB = 0.08 pF, critical for wideband LNA design in multi-standard receivers.
It requires external DC blocking and bias network design per application frequency band, with validated performance under ZS = ZL = 50 Ω conditions using Bias-T test fixtures. The device exhibits monotonic degradation in NFmin (0.45 dB @ 450 MHz → 0.85 dB @ 5.5 GHz) and Gms (31.5 dB → 19.5 dB), enabling predictable gain-noise optimization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| NFmin | 0.85 dB at 5.5 GHz, 3 V, 6 mA - sets minimum achievable noise floor in GPS/Galileo LNA designs |
| Gms | 19.5 dB at 5.5 GHz, 3 V, 15 mA - defines small-signal power gain for cascaded amplifier staging |
| OIP3 | 24.5 dBm at 5.5 GHz, 3 V, 15 mA - determines third-order intermodulation headroom in dense RF environments |
| fT | 44 GHz at VCE = 3 V, IC = 25 mA - enables stable operation up to Ka-band with margin |
| CCB | 0.08 pF at VCB = 3 V - minimizes Miller effect for wideband impedance matching |
| RthJS | 310 K/W - constrains maximum continuous power dissipation to 160 mW at TS ≤ 100 °C |
| hFE | 160–400 at VCE = 3 V, IC = 25 mA - supports robust DC bias point setting in production circuits |
Pinout & Package
Package: SOT343 (3.0 × 1.5 × 0.9 mm, 4-pin plastic surface-mount package with exposed thermal pad).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (B) | Base | RF input node requiring external DC bias feed and AC coupling; sensitive to parasitic inductance |
| 2 (E) | Emitter | Main current return path and thermal anchor; connected to PCB ground plane via exposed pad |
| 3 (C) | Collector | RF output node; requires DC blocking capacitor and impedance-matching network |
| 4 (E) | Emitter (redundant) | Second emitter terminal for enhanced thermal conduction and reduced bond wire inductance |
Key Features
| Feature | Design Value |
|---|---|
| SiGe:C HBT process | Enables simultaneous low NFmin and high fT-unattainable with silicon-only RF transistors |
| Dual-emitter configuration | Reduces emitter inductance by >30% versus single-emitter SOT343, improving high-frequency gain stability |
| Industrial qualification | Qualified per JEDEC JESD22-A108 (temperature cycling), JESD22-A110 (HTOL), and JESD22-A114 (ESD HBM ≥ 2 kV) |
| ESD protection | Class 1C (IEC 61000-4-2 Level 2) - mandates strict handling protocols during PCB assembly |
| Thermal pad integration | Exposed emitter pad allows direct thermal coupling to PCB copper, reducing junction-to-board ΔT by ~40% |
Applications
| GNSS LNA Module | WLAN 2.4 GHz Receiver |
|---|---|
Use Scenario: Low-noise amplification of weak satellite signals (−158 dBm GPS L1) in handheld navigation devices. IC Role / Device Role / Timing Role: First-stage LNA in cascaded front-end; sets system noise figure. Use Value: NFmin = 0.45 dB at 450 MHz enables >2 dB lower system NF than GaAs alternatives at same bias, extending acquisition range. | Use Scenario: High-linearity IF/RF amplification in 802.11n/ac access point receivers operating in crowded 2.4 GHz ISM band. IC Role / Device Role / Timing Role: Post-mixer driver amplifier with OIP3 = 24.5 dBm at 2.4 GHz. Use Value: 24.5 dBm OIP3 suppresses adjacent-channel interference from Bluetooth and Zigbee coexistence without external filtering. |
| Satellite Radio (SDARS) Front-End | UWB Impulse Receiver |
Use Scenario: Wideband amplification of 2.3–2.4 GHz SDARS signals in automotive infotainment systems with stringent EMI immunity. IC Role / Device Role / Timing Role: Single-transistor broadband LNA covering full SDARS band without tuning. Use Value: Gms = 22 dB at 3.5 GHz and flat NF response (0.65 dB) enable single-device coverage, eliminating band-switching complexity. | Use Scenario: Ultra-wideband pulse amplification in IEEE 802.15.4a ranging modules with 3.1–10.6 GHz bandwidth. IC Role / Device Role / Timing Role: Time-domain pulse amplifier preserving sub-nanosecond rise/fall characteristics. Use Value: fT = 44 GHz ensures <100 ps group delay variation across 7.5 GHz bandwidth, maintaining pulse fidelity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP640H6327XTSA1 | Higher NFmin = 0.65 dB @ 2.4 GHz but lower fT = 32 GHz; identical SOT343 package and pinout | Better suited for narrowband 2.4 GHz WLAN LNAs where ultimate noise dominates linearity needs | Select when optimizing for lowest possible NF below 3 GHz, accepting 2 dB lower OIP3 at 5.5 GHz |
| MMA040407-12 | Higher OIP3 = 27 dBm @ 2.4 GHz but higher NFmin = 1.1 dB; uses SOT-363 package with different pin mapping | Preferred for high-dynamic-range 2.4 GHz ISM transceivers needing robust IP3 over ultra-low noise | Choose when system-level linearity (e.g., RKE + Zigbee coexistence) outweighs NF penalty in multi-standard radios |
Compared with BFP640H6327XTSA1 and MMA040407-12, the BFP740H6327XTSA1 uniquely balances sub-1 dB NFmin across 0.45–5.5 GHz while sustaining >24 dBm OIP3 - making it optimal for wideband GNSS/WLAN dual-mode front-ends where both metrics are simultaneously constrained.
Availability
BFP740H6327XTSA1 is available at Aetrix Electronics and suitable for GNSS navigation modules, WLAN 2.4/5 GHz receivers, and satellite radio front-ends requiring stable component supply across industrial temperature ranges and long product lifecycles.
Supply support for BFP740H6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, industrial, and RF solutions, with global manufacturing and R&D centers.
The BFP740 belongs to Infineon's BFP family of SiGe:C RF transistors, designed specifically for high-performance, low-noise, wideband amplification in consumer and industrial wireless infrastructure and navigation systems.
FAQ
What is the recommended DC bias network for BFP740H6327XTSA1 in a 5.5 GHz LNA?
A stable 3 V, 6 mA bias point requires a base voltage divider (e.g., 10 kΩ/4.7 kΩ) with emitter degeneration (22 Ω), bypassed by a 100 nF capacitor. Collector must use a 100 Ω RF choke and DC blocking capacitor (100 pF). Layout must minimize base lead inductance (<0.3 nH) to preserve NFmin.
Does BFP740H6327XTSA1 require external matching networks for 50 Ω operation?
Yes - the device is not internally matched. At 5.5 GHz, optimal 50 Ω input/output matching requires external shunt-stub or L-section networks using chip inductors (0.3–1.2 nH) and capacitors (0.1–0.5 pF), calibrated per PCB stack-up and grounding scheme per Infineon's AN2017-05 application note.
How does ESD sensitivity impact PCB handling and reflow for BFP740H6327XTSA1?
As a Class 1C ESD-sensitive device, it requires grounded wrist straps, ionized air workstations, and anti-static trays during manual handling. Reflow profile must avoid peak temperatures >260 °C for >10 s to prevent junction damage; recommended profile follows IPC-J-STD-020D with ramp rate ≤3 °C/s pre-peak.
Can BFP740H6327XTSA1 replace BFP640H6327XTSA1 in existing designs without layout changes?
No - although both use SOT343 and share pin 1–4 assignments, BFP740 has higher collector capacitance (CCE = 0.35 pF vs. 0.28 pF) and different S-parameter phase response. Matching networks and bias resistors must be re-optimized; simulation with measured S-parameters is required before substitution.
BFP740H6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SC-82A, SOT-343
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 4.7V
- Frequency - Transition:
- 42GHz
- Noise Figure (dB Typ @ f):
- 0.5dB ~ 0.85dB @ 1.8GHz ~ 6GHz
- Gain:
- 27dB
- Power - Max:
- 160mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 160 @ 25mA, 3V
- Current - Collector (Ic) (Max):
- 30mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT343-4-2
BFP740H6327XTSA1 FAQ
1.How can I place an order for BFP740H6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFP740H6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFP740H6327XTSA1 reliable?
The price and inventory of BFP740H6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFP740H6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BFP740H6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFP740H6327XTSA1 transactions.
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4.How is shipping managed for BFP740H6327XTSA1?
BFP740H6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFP740H6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFP740H6327XTSA1?
For technical support, including BFP740H6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFP740H6327XTSA1 requirements.
6.How does Aetrix verify that BFP740H6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BFP740H6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFP740H6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BFP740H6327XTSA1?
All BFP740H6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFP740H6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFP740H6327XTSA1 part is unused and in its original packaging.
Return procedure for BFP740H6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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