Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Bipolar RF Transistors

Infineon Technologies BFQ19SH6327XTSA1

Name: BFQ19SH6327XTSA1
Brand: Infineon Technologies
SKU: BFQ19SH6327XTSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BFQ19SH6327XTSA1

Manufacturer:: Infineon Technologies

Category:: Bipolar RF Transistors

Package:: TO-243AA

Datasheet:: BFQ19SH6327XTSA1.pdf

Description:: RF TRANS NPN 15V 5.5GHZ SOT89-3

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,211

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BFQ19SH6327XTSA1 from Infineon Technologies is a low-noise silicon bipolar RF transistor designed for broadband amplifier stages in antenna front-ends and telecom infrastructure up to 1.5 GHz, with f_T = 5.5 GHz (typ), NF_min = 1.8 dB at 900 MHz, and P-1dB = 22 dBm at 1.8 GHz. It operates at V_CE = 8 V, I_C = 70 mA, and delivers G_ma = 11.5 dB.

For engineers reviewing the BFQ19SH6327XTSA1 datasheet, BFQ19SH6327XTSA1 pinout, BFQ19SH6327XTSA1 application, or BFQ19SH6327XTSA1 equivalent, key selection criteria include noise figure at 900/1800 MHz, third-order intercept (IP3 = 32 dBm), transducer gain under 50 Ω conditions, and thermal resistance (R_thJS = 65 K/W) for RF power stage reliability.

Technical Context

This NPN bipolar RF transistor uses epitaxial base technology optimized for high f_T and low noise at collector currents from 10–70 mA. Its SOT89 package enables direct PCB mounting with low-inductance emitter grounding-critical for stable broadband amplification above 500 MHz.

The device supports Class-A operation with V_CEO = 15 V and I_C = 120 mA absolute maximum ratings. Noise matching (Z_Sopt) and load matching (Z_Lopt) are required to achieve NF_min and G_ma; SPICE models and S-parameters are available from Infineon's RF model portal.

Key Specifications

Parameter	Value and Actual Design Meaning
f_T	5.5 GHz typical - enables stable gain up to 1.5 GHz with margin for layout parasitics
NF_min	1.8 dB at 900 MHz - critical for cellular LNA sensitivity in GSM/UMTS bands
P-1dB	22 dBm at 1.8 GHz - defines usable linear output power before compression in repeater stages
IP3	32 dBm at 1.8 GHz - determines intermodulation rejection in multi-carrier base station receivers
R_thJS	65 K/W - sets thermal derating slope for continuous-wave operation on FR4 PCBs
C_cb	1.05 pF typical - limits Miller effect and stabilizes high-frequency feedback design
h_FE	70–140 at I_C = 70 mA - ensures consistent bias point across production lots

Pinout & Package

SOT89 package: surface-mount, 3-pin, thermally enhanced plastic case with exposed collector tab soldered directly to PCB ground plane for low R_thJS.

Pin/Terminal	Circuit Role	Design Meaning
1 (Tab)	Collector	Exposed metal tab - must be soldered to large copper pour for thermal conduction and RF grounding
2	Base	High-impedance control node - requires DC blocking and impedance-matching network for RF drive
3	Emitter	Low-impedance current return - grounded via shortest possible path to minimize inductive reactance above 500 MHz

Key Features

Feature	Design Value
Low minimum noise figure	NF_min = 1.8 dB at 900 MHz - enables receiver sensitivity down to –115 dBm in 200 kHz bandwidth
High transition frequency	f_T = 5.5 GHz - supports stable small-signal gain in UMTS Band I (1920–1980 MHz) and LTE Band 3 (1710–1785 MHz)
Robust linearity	IP3 = 32 dBm and P-1dB = 22 dBm - allows simultaneous amplification of multiple carriers without adjacent-channel interference
AEC-Q101 qualified	Qualified per automotive stress test standard - validated for use in harsh-environment telecom outdoor units and remote radio heads
RoHS-compliant packaging	Pb-free SOT89 - meets EU Directive 2011/65/EU and supports lead-free reflow assembly

Applications

Cellular Base Station LNA

GSM/UMTS Antenna Tuner Driver

Use Scenario: Low-noise amplification of weak signals received by sector antennas in macrocell BTS.

IC Role / Device Role / Timing Role: First-stage NPN RF transistor in cascode configuration with matched input impedance.

Use Value: Achieves system noise figure < 2.0 dB at 900 MHz using Z_Sopt matching, enabling 3GPP-compliant sensitivity.

Use Scenario: Driving tunable matching networks in adaptive antenna systems for multi-band handsets.

IC Role / Device Role / Timing Role: High-linearity driver stage delivering 22 dBm P-1dB into variable capacitive loads.

Use Value: Maintains IP3 > 30 dBm across 800–2200 MHz, ensuring harmonic suppression in envelope-tracking PA modules.

Repeaters and Small Cells

ISM Band 915 MHz Transceivers

Use Scenario: Bidirectional amplification in in-building femtocell repeaters operating at 1800/1900 MHz.

IC Role / Device Role / Timing Role: Dual-purpose RF transistor used in both receive LNA and transmit driver paths.

Use Value: Enables single-component reuse across signal chains, reducing BOM count and calibration complexity.

Use Scenario: Receiver front-end in industrial IoT gateways compliant with FCC Part 15.247.

IC Role / Device Role / Timing Role: Low-noise active device in discrete LNA with external 50 Ω input match.

Use Value: Delivers NF < 2.2 dB and gain > 10 dB at 915 MHz, meeting link budget requirements for 100 m range LoRaWAN nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise RF transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BFP180H6327XTSA1	f_T = 7 GHz, NF_min = 1.3 dB at 900 MHz, R_thJS = 55 K/W, SOT343 package	Higher gain and lower noise but smaller package limits power handling (P-1dB = 18 dBm)	Select for ultra-low-noise LNA where thermal headroom exceeds 1 W dissipation requirement
MRF5812LSR3	f_T = 4.5 GHz, NF_min = 2.0 dB at 900 MHz, TO-247 package, higher P-1dB (25 dBm)	Through-hole mounting, higher thermal mass, not RoHS-compliant	Select for legacy industrial amplifiers requiring mechanical robustness over surface-mount density

Compared with BFP180H6327XTSA1, BFQ19SH6327XTSA1 trades 0.5 dB NF_min for +4 dBm P-1dB and 10 K/W higher thermal resistance-making it preferable for medium-power repeater stages. Against MRF5812LSR3, it offers RoHS compliance and SMT compatibility at the cost of lower ruggedness in vibration-prone deployments.

Availability

BFQ19SH6327XTSA1 is available at Aetrix Electronics and suitable for cellular base station LNAs, repeater RF front-ends, and ISM band transceiver designs requiring stable component supply across multi-year production cycles.

Supply support for BFQ19SH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with global manufacturing and R&D centers.

The BFQ19S series belongs to Infineon's discrete RF transistor product line, engineered specifically for high-linearity, low-noise amplification in wireless infrastructure equipment operating below 2 GHz.

FAQ

What is the recommended bias condition for optimal noise figure at 900 MHz?

For NF_min = 1.8 dB at 900 MHz, operate at V_CE = 6 V and I_C = 20 mA with source impedance Z_S = Z_Sopt = 12 + j15 Ω. This condition is verified in the datasheet's AC characteristics table and requires external matching network implementation-not internal circuitry.

Can BFQ19SH6327XTSA1 be used in Class AB amplifier configurations?

Yes, it supports Class AB operation with proper base biasing and emitter degeneration. The h_FE range (70–140) and f_T stability allow predictable gain compression behavior, but thermal design must account for R_thJS = 65 K/W under pulsed or modulated RF loads per the derating curve in datasheet Figure 4.

Is the SOT89 package lead-free and compatible with standard Pb-free reflow profiles?

Yes, BFQ19SH6327XTSA1 is RoHS-compliant with Pb-free terminations and rated for JEDEC J-STD-020D-compliant reflow. Peak temperature must not exceed 260 °C for ≤ 30 seconds; the exposed collector tab requires full wetting during soldering to ensure thermal performance.

Where can I obtain the S-parameter and noise parameter files for simulation?

S-parameters (including noise parameters) and SPICE GP models are hosted on Infineon's official RF model portal at www.infineon.com/rf.models. Users must download the latest version directly from that site-no embedded models are included in the datasheet PDF.

BFQ19SH6327XTSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: TO-243AA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Transistor Type:: NPN

Voltage - Collector Emitter Breakdown (Max):: 15V

Frequency - Transition:: 5.5GHz

Noise Figure (dB Typ @ f):: 3dB @ 1.8GHz

Gain:: 7dB

Power - Max:: 1W

DC Current Gain (hFE) (Min) @ Ic, Vce:: 70 @ 70mA, 8V

Current - Collector (Ic) (Max):: 120mA

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT89

BFQ19SH6327XTSA1 FAQ

1.How can I place an order for BFQ19SH6327XTSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BFQ19SH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BFQ19SH6327XTSA1 reliable?

The price and inventory of BFQ19SH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFQ19SH6327XTSA1 is usually 5 days.

3.What payment methods are accepted for BFQ19SH6327XTSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFQ19SH6327XTSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BFQ19SH6327XTSA1?

BFQ19SH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BFQ19SH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BFQ19SH6327XTSA1?

For technical support, including BFQ19SH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFQ19SH6327XTSA1 requirements.

6.How does Aetrix verify that BFQ19SH6327XTSA1 is sourced from the original manufacturer or authorized distributors?

All BFQ19SH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFQ19SH6327XTSA1 meets industry standards.

7.What is the process for return or replacement of BFQ19SH6327XTSA1?

All BFQ19SH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BFQ19SH6327XTSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BFQ19SH6327XTSA1 part is unused and in its original packaging.

Return procedure for BFQ19SH6327XTSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…