Infineon Technologies BFR 380T E6327
- Part No.:
- BFR 380T E6327
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- SC-75, SOT-416
- Datasheet:
-
BFR 380T E6327.pdf
- Description:
- RF TRANS NPN 9V 14GHZ SC75
- Quantity:
- Payment:

- Shipping:

Inventory:4,328
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BFR 380T E6327 from Infineon Technologies is an NPN silicon RF transistor in SC75 package, rated for 6 V VCEO, 80 mA IC, and 380 mW Ptot, optimized for low-phase-noise oscillators up to 3.5 GHz with 1.1 dB noise figure at 1.8 GHz and 14 GHz fT.
For engineers reviewing the BFR 380T E6327 datasheet, BFR 380T E6327 pinout, BFR 380T E6327 application, or BFR 380T E6327 equivalent, key selection criteria include verified 1.1 dB Fmin at 1.8 GHz, 14 GHz transition frequency, SC75 thermal resistance of 220 K/W, and ESD-sensitive handling requirements.
Technical Context
This RF transistor employs a high-frequency Gummel-Poon SPICE model (NF = 1.107, BF = 116.4, fT = 14 GHz) with validated parasitic network (L1 = 0.762 nH, C1 = 62 fF, Ccb = 0.5 pF typ.) for accurate small-signal simulation up to 6 GHz.
It operates with low-voltage biasing (VCE = 3 V, IC = 40 mA), delivers 12.5 dB maximum available gain at 1.8 GHz, and achieves 29.5 dBm OIP3 - enabling wide dynamic range in narrowband RF front-ends and local oscillator stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 6 V - Maximum safe collector-emitter voltage under open-base condition; defines DC bias headroom in oscillator and amplifier designs. |
| fT | 14 GHz typ. - Transition frequency confirming usable gain beyond 3.5 GHz; supports stable operation in UHF/low-L-band applications. |
| Fmin | 1.1 dB at 1.8 GHz - Minimum noise figure measured with optimal source impedance; critical for receiver LNA and LO buffer stages. |
| Ptot | 380 mW - Total power dissipation limit at TS = 66°C; constrains continuous RF output power in Class-A biased circuits. |
| Ccb | 0.5 pF typ. - Collector-base capacitance at 5 V; directly impacts Miller effect and tuning range in VCO tank circuits. |
| OIP3 | 29.5 dBm - Third-order output intercept point at 1.8 GHz; quantifies linearity for multi-tone signal handling in transceivers. |
| RthJS | 220 K/W - Junction-to-soldering-point thermal resistance; determines temperature rise per watt in PCB-mounted SC75 layout. |
Pinout & Package
Package: SC75 (SOT-323), 3-pin surface-mount plastic package with standard lead finish and moisture sensitivity level (MSL) 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Control electrode for current amplification; requires stable DC bias and RF decoupling due to low input impedance (~kΩ range). |
| 2 | Emiter (E) | Common reference node in common-base configuration; grounded in many oscillator topologies to minimize parasitic inductance. |
| 3 | Collector (C) | RF output node in common-emitter mode; connects to tank circuit or matching network; carries full RF current and heat. |
Key Features
| Feature | Design Value |
|---|---|
| Low-phase-noise oscillator support | Validated 1.1 dB Fmin at 1.8 GHz and 14 GHz fT enable stable, spectrally pure LO generation up to 3.5 GHz. |
| Wide dynamic range capability | 29.5 dBm OIP3 and 16 dBm P1dB ensure linear operation with strong interferers in cellular and ISM band receivers. |
| Low-voltage RF operation | Specified performance at VCE = 3 V enables compatibility with 3.3 V supply rails without external level-shifting. |
| ESD-protected design | Class 1B HBM rating (per JEDEC JESD22-A114); requires grounded wrist strap and conductive foam during handling. |
Applications
| Cellular Front-End LNA | ISM Band Oscillator |
|---|---|
Use Scenario: Low-noise amplification of 1.8 GHz LTE receive signals in smartphone transceiver modules. IC Role / Device Role / Timing Role: Common-emitter configured RF transistor acting as first-stage LNA with matched 50 Ω input impedance. Use Value: 1.1 dB noise figure preserves SNR in weak-signal conditions; 12.5 dB Gma provides sufficient gain before mixer stage. | Use Scenario: Voltage-controlled oscillator core for 2.4 GHz Wi-Fi access points operating in industrial environments. IC Role / Device Role / Timing Role: Common-base configured transistor sustaining oscillation in Clapp or Colpitts topology with varactor tuning. Use Value: Low Ccb (0.5 pF) minimizes frequency pulling; high fT ensures loop stability across temperature and process variation. |
| UHF RFID Reader PA | GPS/GLONASS L1 Band Buffer |
Use Scenario: Final-stage driver amplifier in 860–960 MHz RFID readers requiring +27 dBm output with harmonic suppression. IC Role / Device Role / Timing Role: Class-A biased RF transistor delivering broadband gain with external harmonic filtering. Use Value: 380 mW Ptot supports 200–250 mW saturated output; 14 GHz fT ensures gain margin above fundamental frequency. | Use Scenario: Local oscillator buffer driving quadrature mixer in dual-band GNSS receivers. IC Role / Device Role / Timing Role: Common-collector emitter follower isolating VCO from load variations while preserving phase integrity. Use Value: Low 1.1 dB Fmin prevents added phase noise; SC75 package enables compact layout adjacent to RF IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NPN RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP 640F E6327 | Higher fT (25 GHz), lower Ccb (0.35 pF), same SC75 package and 1.1 dB Fmin. | Better suited for 5 GHz Wi-Fi and higher-frequency VCOs where bandwidth exceeds 3.5 GHz. | Select when >4 GHz operation or tighter phase noise budget is required; otherwise BFR 380T E6327 offers cost advantage. |
| MRF581 | TO-92 package, higher Ptot (500 mW), but higher Fmin (1.5 dB at 1.8 GHz) and lower fT (8 GHz). | Preferred for through-hole prototyping or legacy designs where thermal mass improves reliability at elevated ambient. | Choose only if SC75 footprint is incompatible or board-level rework tolerance is critical; not drop-in compatible. |
Compared with BFP 640F E6327 and MRF581, the BFR 380T E6327 balances low-phase-noise performance, SC75 miniaturization, and 3.5 GHz operational ceiling - making it optimal for cost-sensitive, space-constrained 1.8–2.4 GHz RF subsystems.
Availability
BFR 380T E6327 is available at Aetrix Electronics and suitable for cellular front-end LNAs, ISM band oscillators, UHF RFID reader PAs, and GPS/GLONASS L1 band buffers requiring stable component supply and traceable sourcing.
Supply support for BFR 380T E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-performance discrete devices.
The BFR 380T E6327 belongs to Infineon's RF bipolar transistor product line, engineered specifically for low-noise, high-linearity RF signal generation and amplification in wireless infrastructure and consumer connectivity applications.
FAQ
Is the BFR 380T E6327 RoHS compliant?
Yes, the BFR 380T E6327 meets RoHS Directive 2011/65/EU and is lead-free with matte tin (Sn) termination on all leads. The SC75 package uses halogen-free molding compound and complies with IPC/JEDEC J-STD-020D moisture sensitivity level 1.
What is the recommended PCB layout for optimal RF performance?
Use a solid ground plane beneath the SC75 footprint, keep emitter pad connection direct and short (<1 mm), place 100 pF bypass capacitor within 2 mm of collector, and route base bias traces away from RF paths to avoid coupling. Thermal vias under the collector pad improve RthJA by ~30%.
Can the BFR 380T E6327 be used in common-base configuration?
Yes - the device is characterized and widely applied in common-base mode for wideband amplifiers and oscillator cores. Pin 2 (emitter) serves as AC ground, pin 1 (base) as input, and pin 3 (collector) as output; S-parameters confirm stable gain up to 3 GHz in this configuration.
Does Infineon provide SPICE models for the BFR 380T E6327?
Yes - a validated Gummel-Poon SPICE model is provided in Berkeley SPICE 2G.6 syntax, including all 32 parameters (e.g., BF = 116.376, NF = 1.107, CJC = 840 fF). Model files are available via Infineon's official support portal and pre-integrated into Keysight PathWave ADS and Cadence Virtuoso libraries.
BFR 380T E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SC-75, SOT-416
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 9V
- Frequency - Transition:
- 14GHz
- Noise Figure (dB Typ @ f):
- 1.1dB @ 1.8GHz
- Gain:
- 12.5dB
- Power - Max:
- 380mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 60 @ 40mA, 3V
- Current - Collector (Ic) (Max):
- 80mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SC75-3D
BFR 380T E6327 FAQ
1.How can I place an order for BFR 380T E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFR 380T E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFR 380T E6327 reliable?
The price and inventory of BFR 380T E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFR 380T E6327 is usually 5 days.
3.What payment methods are accepted for BFR 380T E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFR 380T E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFR 380T E6327?
BFR 380T E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFR 380T E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFR 380T E6327?
For technical support, including BFR 380T E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFR 380T E6327 requirements.
6.How does Aetrix verify that BFR 380T E6327 is sourced from the original manufacturer or authorized distributors?
All BFR 380T E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFR 380T E6327 meets industry standards.
7.What is the process for return or replacement of BFR 380T E6327?
All BFR 380T E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BFR 380T E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFR 380T E6327 part is unused and in its original packaging.
Return procedure for BFR 380T E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFR 380T E6327 Tags

-
BFR182WH6327XTSA1
Infineon Technologies

-
BFR92PE6327HTSA1
Infineon Technologies

-
BFR360FH6327XTSA1
Infineon Technologies

-
BFR193FH6327XTSA1
Infineon Technologies

-
BFU550AR
NXP USA Inc.

-
BFR460L3E6327XTMA1
Infineon Technologies

-
MMBTH81
onsemi

-
BFU520WX
NXP USA Inc.

-
BFP840FESDH6327XTSA1
Infineon Technologies

-
BFP650H6327XTSA1
Infineon Technologies

-
BFU520AR
NXP USA Inc.

-
BFS483H6327XTSA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

