Infineon Technologies BFR 93AW E6327
- Part No.:
- BFR 93AW E6327
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- SC-70, SOT-323
- Datasheet:
-
BFR 93AW E6327.pdf
- Description:
- RF TRANS NPN 12V 6GHZ SOT323-3
- Quantity:
- Payment:

- Shipping:

Inventory:5,308
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BFR93AW E6327 from Infineon Technologies is a low-noise silicon bipolar RF transistor designed for high-linearity amplification and oscillator circuits up to 2 GHz, with fT = 6 GHz (typ), NFmin = 1.5 dB at 900 MHz, and Gma = 15.5 dB at 900 MHz - deployed in cellular front-end modules and UHF receiver LNA stages.
For engineers reviewing the BFR93AW E6327 datasheet, BFR93AW E6327 pinout, BFR93AW E6327 application, or BFR93AW E6327 equivalent, key selection criteria include noise figure vs. bias current trade-off, SOT323 thermal resistance (RthJS = 140 K/W), third-order intercept point (IP3 = 15 dBm), and AEC-Q101 qualification status for automotive-grade reliability.
Technical Context
This NPN RF transistor operates with VCEO = 12 V and IC = 90 mA max, optimized for small-signal amplification under 5–30 mA collector bias. Its fT of 6 GHz (typ) and Ccb = 0.58 pF (typ) support stable gain and matching up to 1.8 GHz.
Designed for low-distortion operation, it delivers P-1dB = 6 dBm and IP3 = 15 dBm at 900 MHz with 50 Ω terminations, enabling use in GSM/UMTS/LTE band-selective receive paths where linearity and noise floor are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 12 V - maximum safe collector-emitter voltage before breakdown under operating conditions |
| fT | 6 GHz (typ) - unity-gain frequency defining usable RF bandwidth for small-signal amplification |
| NFmin | 1.5 dB at 900 MHz - lowest achievable noise figure at optimal source impedance, critical for LNA sensitivity |
| Gma | 15.5 dB at 900 MHz - maximum available power gain under conjugate match, determines stage gain ceiling |
| IP3 | 15 dBm - third-order intercept point indicating linearity headroom for two-tone intermodulation suppression |
| RthJS | 140 K/W - junction-to-soldering-point thermal resistance, constrains continuous power dissipation in PCB layout |
| AEC-Q101 | Qualified - certified for automotive electronics per stress test standard, supporting under-hood and infotainment applications |
Pinout & Package
Package: SOT323 - surface-mount plastic package with visible leads, RoHS-compliant and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Base (B) | Control terminal for forward-biased junction; requires DC bias network and RF choke or capacitor coupling |
| 2 | Emitter (E) | Common reference node; typically grounded via low-inductance path for RF stability and noise control |
| 3 | Collector (C) | Output terminal; connects to RF output matching network and DC supply through RF choke |
Key Features
| Feature | Design Value |
|---|---|
| Low noise figure | NFmin = 1.5 dB at 900 MHz enables high-sensitivity receiver front-ends in sub-2 GHz bands |
| High transition frequency | fT = 6 GHz (typ) supports stable gain and matching up to 1.8 GHz without parasitic roll-off |
| Linearity performance | IP3 = 15 dBm and P-1dB = 6 dBm allow simultaneous reception of weak and strong signals in crowded spectrum |
| AEC-Q101 qualification | Validated for automotive temperature range (−65 °C to +150 °C) and reliability stress testing |
| SOT323 thermal design | RthJS = 140 K/W enables 300 mW total dissipation with proper PCB copper area and soldering |
Applications
| Cellular Baseband Receiver | UHF RFID Reader Front-End |
|---|---|
Use Scenario: Amplifying weak downlink signals in GSM/UMTS/LTE handset receivers prior to downconversion. IC Role / Device Role / Timing Role: Low-noise amplifier (LNA) in first RF gain stage with 5–15 mA bias. Use Value: NFmin = 1.5 dB directly improves system noise figure and extends link budget by ~1.2 dB over higher-noise alternatives. | Use Scenario: Boosting tag response signals in 860–960 MHz UHF RFID readers with multi-tag interference. IC Role / Device Role / Timing Role: High-linearity LNA in reader receive chain with 30 mA bias for IP3-driven dynamic range. Use Value: IP3 = 15 dBm ensures clean demodulation of multiple tag responses without intermodulation distortion. |
| Automotive Telematics Module | ISM Band Sensor Transceiver |
Use Scenario: RF amplification in LTE-based vehicle-to-infrastructure (V2I) communication modules operating at −40 °C to +105 °C ambient. IC Role / Device Role / Timing Role: AEC-Q101-qualified LNA supporting wide-temperature operation with stable fT and hFE. Use Value: Junction temperature rating of 150 °C and qualified thermal derating curve ensure reliability under engine bay thermal cycling. | Use Scenario: Transmit/receive switching amplifier in 915 MHz industrial sensor nodes with battery-powered duty cycling. IC Role / Device Role / Timing Role: Low-power RF gain block biased at 5 mA for standby sensitivity and 30 mA for active burst transmission. Use Value: Dual-bias optimization enables >20 dB gain swing while maintaining NF < 2.0 dB and IP3 > 12 dBm across modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-noise RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP640FESD | fT = 25 GHz, NFmin = 0.75 dB at 1.8 GHz, SOT343 package, higher cost | Targets 2.4 GHz WiFi/BT coexistence designs requiring lower noise and wider bandwidth | Select when operating above 1.8 GHz or needing sub-1 dB noise; not drop-in due to different pinout and bias requirements |
| MRF9011LSR3 | fT = 8 GHz, NFmin = 1.8 dB at 900 MHz, TO-243AA package, higher Ptot = 500 mW | Used in higher-power base station repeaters where thermal margin and ruggedness outweigh size constraints | Prefer for industrial fixed infrastructure; incompatible with SOT323 footprint and requires larger heatsinking |
Compared with BFR93AW E6327, BFP640FESD offers superior high-frequency noise performance but demands redesign for layout and bias, while MRF9011LSR3 trades compactness for thermal robustness - making BFR93AW E6327 optimal for space-constrained, automotive-qualified 900 MHz/1.8 GHz portable RF front-ends.
Availability
BFR93AW E6327 is available at Aetrix Electronics and suitable for cellular handset receivers, UHF RFID readers, automotive telematics modules, and ISM-band sensor transceivers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BFR93AW E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with global R&D and manufacturing infrastructure.
The BFR93AW belongs to Infineon's discrete RF transistor product line, engineered specifically for low-noise, high-linearity amplification in sub-2 GHz wireless infrastructure and mobile terminals.
FAQ
What is the recommended DC bias condition for minimum noise figure?
The datasheet specifies NFmin = 1.5 dB at IC = 5 mA and VCE = 8 V with optimal source impedance (ZSopt). This bias point balances noise performance and gain stability; increasing IC beyond 10 mA degrades NF due to increased shot noise, while reducing below 3 mA raises thermal noise contribution.
Is BFR93AW E6327 suitable for 5G NR sub-6 GHz bands?
No - its fT = 6 GHz (typ) and verified AC characteristics only extend to 1.8 GHz per datasheet test conditions. At 3.5 GHz, gain rolls off significantly and NF increases beyond 3 dB; it is not characterized or guaranteed for n78/n77 band operation.
How does the SOT323 package affect thermal management in continuous operation?
With RthJS = 140 K/W, the SOT323 limits continuous Ptot to 300 mW only if the soldering point remains ≤108 °C. Achieving this requires ≥25 mm² of 1-oz copper on the collector pad and minimal thermal via resistance; exceeding 200 mW without thermal enhancement risks junction overheating.
Does the AEC-Q101 qualification cover all electrical parameters across temperature?
AEC-Q101 qualification confirms reliability under stress (HTOL, TC, HAST, etc.) but does not guarantee full parameter compliance across −65 °C to +150 °C. The datasheet specifies electrical characteristics only at TA = 25 °C; for automotive use, designers must validate hFE, fT, and NF at −40 °C and +125 °C using application-specific test setups.
BFR 93AW E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SC-70, SOT-323
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Frequency - Transition:
- 6GHz
- Noise Figure (dB Typ @ f):
- 1.5dB ~ 2.6dB @ 900MHz ~ 1.8GHz
- Gain:
- 10.5dB ~ 15.5dB
- Power - Max:
- 300mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 70 @ 30mA, 8V
- Current - Collector (Ic) (Max):
- 90mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT323
BFR 93AW E6327 FAQ
1.How can I place an order for BFR 93AW E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFR 93AW E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFR 93AW E6327 reliable?
The price and inventory of BFR 93AW E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFR 93AW E6327 is usually 5 days.
3.What payment methods are accepted for BFR 93AW E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFR 93AW E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFR 93AW E6327?
BFR 93AW E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFR 93AW E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFR 93AW E6327?
For technical support, including BFR 93AW E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFR 93AW E6327 requirements.
6.How does Aetrix verify that BFR 93AW E6327 is sourced from the original manufacturer or authorized distributors?
All BFR 93AW E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFR 93AW E6327 meets industry standards.
7.What is the process for return or replacement of BFR 93AW E6327?
All BFR 93AW E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BFR 93AW E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFR 93AW E6327 part is unused and in its original packaging.
Return procedure for BFR 93AW E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFR 93AW E6327 Tags

-
BFR182WH6327XTSA1
Infineon Technologies

-
BFR92PE6327HTSA1
Infineon Technologies

-
BFR360FH6327XTSA1
Infineon Technologies

-
BFR193FH6327XTSA1
Infineon Technologies

-
BFU550AR
NXP USA Inc.

-
BFR460L3E6327XTMA1
Infineon Technologies

-
MMBTH81
onsemi

-
BFU520WX
NXP USA Inc.

-
BFP840FESDH6327XTSA1
Infineon Technologies

-
BFP650H6327XTSA1
Infineon Technologies

-
BFU520AR
NXP USA Inc.

-
BFS483H6327XTSA1
Infineon Technologies
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
