Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > Bipolar (BJT) > Bipolar RF Transistors

Infineon Technologies BFR 949L3 E6327

Name: BFR 949L3 E6327
Brand: Infineon Technologies
SKU: BFR 949L3 E6327
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BFR 949L3 E6327

Manufacturer:: Infineon Technologies

Category:: Bipolar RF Transistors

Package:: SC-101, SOT-883

Datasheet:: BFR 949L3 E6327.pdf

Description:: RF TRANS NPN 10V 9GHZ TSLP-3-1

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,210

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BFR949L3 E6327 from Infineon Technologies is an NPN silicon RF transistor optimized for low-noise, high-gain broadband amplification at collector currents from 1 mA to 20 mA; features f_T = 9 GHz (typ), noise figure F = 1 dB at 1 GHz (typ), and V_CEO = 10 V - deployed in GPS L1-band LNAs and cellular front-end modules.

For engineers reviewing the BFR949L3 E6327 datasheet, BFR949L3 E6327 pinout, BFR949L3 E6327 application, or BFR949L3 E6327 equivalent, key selection criteria include noise performance at 1–1.8 GHz, thermal resistance ≤195 K/W, C_cb = 0.25 pF (typ), h_FE = 140 (typ), and AEC-Q101 qualification for automotive RF subsystems.

Technical Context

This RF transistor employs a planar epitaxial silicon structure with gold-metallized emitter and base contacts to minimize parasitic inductance and optimize high-frequency gain. Its TSLP-3-1 package enables compact board layout while maintaining thermal performance up to 150 °C junction temperature.

Designed for small-signal amplification, it operates with DC bias conditions of V_CE = 6–8 V and I_C = 3–15 mA, delivering G_ma = 15.5 dB at 1.8 GHz and |S₂₁|² = 17 dB at 1 GHz under matched 50 Ω source/load conditions.

Key Specifications

Parameter	Value and Actual Design Meaning
f_T	9 GHz typical - enables stable amplification up to mid-UHF band without gain roll-off
Noise Figure (F)	1 dB at 1 GHz - meets stringent LNA requirements for GPS and LTE receiver sensitivity
h_FE	140 typical at I_C = 5 mA - ensures predictable DC bias stability in cascode and common-emitter stages
C_cb	0.25 pF typical - reduces Miller effect, supporting wideband matching up to 2 GHz
R_thJS	≤195 K/W - allows continuous operation at 50 mW dissipation with PCB copper area ≥25 mm²
V_CEO	10 V - supports single-supply 5 V or 3.3 V RF amplifier designs with headroom margin
AEC-Q101 Qualified	Yes - validated for automotive infotainment and telematics RF modules requiring reliability under thermal cycling

Pinout & Package

Package: TSLP-3-1 - ultra-thin, leadless surface-mount package (1.16 × 0.76 × 0.4 mm) with exposed thermal pad, RoHS-compliant, designed for high-frequency signal integrity and thermal management in space-constrained RF layouts.

Pin/Terminal	Circuit Role	Design Meaning
1	Base (B)	Control electrode; requires DC bias network with impedance <100 Ω to minimize noise contribution
2	Emitter (E)	AC ground reference; connected directly to RF ground plane for minimal inductance path
3	Collector (C)	RF output node; routed over solid ground plane with controlled-impedance microstrip to preserve S-parameters

Key Features

Feature	Design Value
Low-noise amplification	F = 1 dB at 1 GHz enables >2 dB improvement in receiver NF over legacy Si transistors
High transition frequency	f_T = 9 GHz supports stable gain in 800 MHz–2.1 GHz bands without neutralization
AEC-Q101 qualification	Validated for automotive ambient temperatures (−40 °C to +125 °C case) and humidity testing
Thermally enhanced package	TSLP-3-1's exposed collector pad reduces R_thJS by 35% vs. standard SOT-323
ESD protection	HBM rating >2 kV (Class 2) - mitigates handling damage during SMT assembly

Applications

GPS L1-Band LNA

Cellular Front-End Amplifier

Use Scenario: Low-noise amplification of 1.575 GHz GPS signals in automotive navigation modules.

IC Role / Device Role / Timing Role: First-stage LNA in cascaded RF chain, operating at I_C = 5 mA, V_CE = 6 V.

Use Value: Achieves system NF ≤ 1.8 dB with 17 dB transducer gain, meeting RTCA DO-160 radiated emissions constraints.

Use Scenario: Driver amplifier in 3G/4G handset power amplifier modules before GaAs PAs.

IC Role / Device Role / Timing Role: Interstage gain block between TR switch and final PA, biased at I_C = 10 mA, V_CE = 8 V.

Use Value: Delivers G_ms = 21.5 dB at 900 MHz, reducing required gain from subsequent stages and improving linearity headroom.

ISM Band Receiver

Automotive Telematics RF Module

Use Scenario: Signal amplification in 2.4 GHz Wi-Fi/BLE coexistence receivers for smart home gateways.

IC Role / Device Role / Timing Role: Low-noise preamplifier stage with Z_S = Z_Sopt, operating at I_C = 3 mA, V_CE = 8 V.

Use Value: Maintains F = 1.3 dB at 1.8 GHz, enabling −95 dBm sensitivity in 20 MHz channel bandwidth.

Use Scenario: RF receive path in V2X (DSRC) modules operating at 5.9 GHz carrier with harmonic filtering.

IC Role / Device Role / Timing Role: High-linearity IF amplifier after downconversion, qualified per AEC-Q101 Grade 1.

Use Value: Supports 10-year field life under thermal shock (−40 °C ↔ +125 °C) and vibration per ISO 16750-3.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN RF transistor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
BFP740FESD	f_T = 45 GHz, F = 0.85 dB at 2 GHz, higher V_CEO = 12 V, same TSLP-3-1 package	Better noise and bandwidth for 5G NR sub-6 GHz receivers; higher cost and tighter bias control required	Select when targeting <1 dB NF above 2 GHz or requiring >20 dB gain at 3.5 GHz
MMA040407-100	f_T = 6 GHz, F = 1.2 dB at 1 GHz, SOT-343 package, non-AEC-Q101	Larger footprint, lower thermal performance (R_thJS ≈ 250 K/W), no automotive qualification	Acceptable for industrial IoT base stations where AEC-Q101 is not mandated

Compared with BFR949L3 E6327, BFP740FESD offers superior high-frequency noise and gain but demands stricter bias stability; MMA040407-100 provides cost-effective replacement in non-automotive designs but lacks thermal and reliability validation for vehicular use.

Availability

BFR949L3 E6327 is available at Aetrix Electronics and suitable for GPS L1-band LNAs, cellular front-end amplifiers, ISM-band receivers, and automotive telematics RF modules requiring stable component supply across production lifecycles.

Supply support for BFR949L3 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, automotive, and security ICs, with global manufacturing and R&D centers.

The BFR949L3 belongs to Infineon's high-frequency bipolar transistor product line, engineered specifically for low-noise, high-gain RF amplification in automotive and wireless infrastructure applications up to 2.1 GHz.

FAQ

What is the maximum recommended collector current for continuous operation?

The absolute maximum collector current is 50 mA, but for reliable long-term operation with thermal margin, Infineon specifies I_C ≤ 20 mA at T_A ≤ 85 °C. At 20 mA and V_CE = 6 V, power dissipation reaches 120 mW - well within the 250 mW P_tot limit at T_S ≤ 101 °C, provided adequate PCB copper area is used for heat spreading.

Is the BFR949L3 E6327 suitable for 5G sub-6 GHz applications?

No - its f_T = 9 GHz and verified S-parameter data extend only to 2.1 GHz. While |S₂₁|² remains >10 dB up to ~3 GHz, gain compression and noise degradation occur beyond 2.5 GHz. For 3.5 GHz or 4.9 GHz 5G NR bands, Infineon's BFP740FESD or BFP840ESD are specified alternatives with validated performance.

How should the exposed thermal pad be connected on the PCB?

The TSLP-3-1 package has an exposed collector pad that must be soldered directly to a dedicated thermal land on the PCB, connected via ≥4 thermal vias (0.3 mm diameter) to inner-layer ground planes. The land size should match the pad outline (1.16 × 0.76 mm), with solder mask opening equal to metal area to ensure full wetting and minimal R_thJA.

Does the AEC-Q101 qualification cover the full temperature range of the device?

Yes - AEC-Q101 qualification was performed across −40 °C to +125 °C case temperature, including temperature cycling (1000 cycles), high-temperature operating life (1000 hrs at 150 °C), and unbiased HAST. The device meets Grade 1 requirements, confirming suitability for under-hood automotive RF modules where ambient can reach 105 °C and junction exceeds 130 °C under bias.

BFR 949L3 E6327 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: SC-101, SOT-883

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Transistor Type:: NPN

Voltage - Collector Emitter Breakdown (Max):: 10V

Frequency - Transition:: 9GHz

Noise Figure (dB Typ @ f):: 1dB ~ 2.5dB @ 1GHz

Gain:: 21.5dB

Power - Max:: 250mW

DC Current Gain (hFE) (Min) @ Ic, Vce:: 100 @ 5mA, 6V

Current - Collector (Ic) (Max):: 50mA

Operating Temperature:: 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-TSLP-3-1

BFR 949L3 E6327 FAQ

1.How can I place an order for BFR 949L3 E6327 through Aetrix?

Please submit a Request for Quotation (RFQ) for BFR 949L3 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BFR 949L3 E6327 reliable?

The price and inventory of BFR 949L3 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFR 949L3 E6327 is usually 5 days.

3.What payment methods are accepted for BFR 949L3 E6327?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFR 949L3 E6327 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BFR 949L3 E6327?

BFR 949L3 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BFR 949L3 E6327 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BFR 949L3 E6327?

For technical support, including BFR 949L3 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFR 949L3 E6327 requirements.

6.How does Aetrix verify that BFR 949L3 E6327 is sourced from the original manufacturer or authorized distributors?

All BFR 949L3 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFR 949L3 E6327 meets industry standards.

7.What is the process for return or replacement of BFR 949L3 E6327?

All BFR 949L3 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BFR 949L3 E6327, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BFR 949L3 E6327 part is unused and in its original packaging.

Return procedure for BFR 949L3 E6327:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…