Infineon Technologies BFS 483 E6327
- Part No.:
- BFS 483 E6327
- Manufacturer:
- Infineon Technologies
- Category:
- Bipolar RF Transistors
- Package:
- 6-VSSOP, SC-88, SOT-363
- Datasheet:
-
BFS 483 E6327.pdf
- Description:
- RF TRANS 2 NPN 12V 8GHZ SOT363-6
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BFS483 E6327 from Infineon Technologies is a low-noise silicon bipolar RF transistor in SOT363 package, featuring dual isolated transistors (TR1/TR2), fT = 8 GHz, NFmin = 0.9 dB at 900 MHz, and VCEO = 12 V - used in broadband RF front-end amplifiers for GSM/UMTS handset receivers.
For engineers reviewing the BFS483 E6327 datasheet, BFS483 E6327 pinout, BFS483 E6327 application, or BFS483 E6327 equivalent, key selection criteria include noise figure at 900 MHz/1.8 GHz, dual-transistor isolation, SOT363 thermal resistance (RthJS = 245 K/W), and AEC-Q101 qualification status for automotive RF modules.
Technical Context
This dual NPN RF transistor supports independent biasing of TR1 and TR2 with galvanic isolation between emitter-base-collector paths, enabling cascode or differential amplifier topologies. Its fT ≥ 6 GHz (typ. 8 GHz) and Ccb = 0.34 pF (typ.) support stable gain up to 1.8 GHz with ZSopt-matched input impedance.
Designed for low-current operation (IC = 2–30 mA), it delivers Gms = 19 dB (900 MHz) and Gma = 12.5 dB (1.8 GHz) under matched conditions, with hFE = 70–140 ensuring predictable DC bias stability across production lots.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| fT | 8 GHz typical - enables stable small-signal gain in UMTS Band I (2100 MHz) and PCS (1900 MHz) front-ends |
| NFmin | 0.9 dB at 900 MHz - critical for sensitivity-limited GSM receiver LNA stages |
| VCEO | 12 V - supports 5 V or 3.3 V supply rails with headroom for transient voltage margins |
| hFE | 70–140 at IC = 15 mA - ensures consistent bias point setting without external feedback trimming |
| RthJS | 245 K/W - defines maximum allowable power dissipation (450 mW at TS ≤ 40 °C) for PCB layout thermal design |
| Ccb | 0.34 pF typical - limits Miller effect in common-emitter configurations above 1 GHz |
| IC max | 65 mA - sets upper limit for pulsed or continuous-wave output stage drive capability |
Pinout & Package
SOT363 (SC-70-6) plastic surface-mount package with visible leads, RoHS-compliant and halogen-free; thermal pad not present - soldering point defined at collector lead per AN077.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (B1) | Base of TR1 | DC bias and RF input node for first transistor; requires external matching network for ZSopt |
| 2 (E1) | Emitter of TR1 | AC ground reference for TR1; connects to RF ground plane with minimal inductance |
| 3 (C1) | Collector of TR1 | RF output node for TR1; interfaces directly to next stage or bandpass filter |
| 4 (B2) | Base of TR2 | Independent bias control for second transistor; enables differential or cascaded gain architectures |
| 5 (E2) | Emitter of TR2 | Galvanically isolated ground path from TR1 - prevents inter-stage coupling via shared emitter |
| 6 (C2) | Collector of TR2 | Second RF output; allows parallel or interleaved amplifier configurations without cross-talk |
Key Features
| Feature | Design Value |
|---|---|
| Dual isolated NPN transistors | Enables cascode LNA designs with >40 dB reverse isolation (S12) without external shielding |
| AEC-Q101 qualified | Validated for automotive infotainment RF front-ends operating from −40 °C to +125 °C ambient |
| Low Ccb (0.34 pF typ.) | Reduces high-frequency instability risk in 50 Ω systems - eliminates need for neutralization capacitors |
| ZSopt-matched NFmin | 0.9 dB at 900 MHz allows direct integration into GSM receiver chains without impedance-tuning components |
| Pb-free & halogen-free | Complies with JEDEC J-STD-020 reflow profile and IPC-J-STD-006 solderability requirements |
Applications
| GSM Receiver LNA | UMTS Diversity Front-End |
|---|---|
Use Scenario: Primary low-noise amplifier in quad-band GSM handset receiver, operating at 900 MHz with 5 V supply. IC Role / Device Role / Timing Role: First-stage RF amplifier providing 15.5 dB transducer gain and 0.9 dB NFmin before downconversion. Use Value: Enables −102 dBm sensitivity in 200 kHz channel bandwidth while maintaining <1.5 dB gain variation over temperature. | Use Scenario: Secondary receive path amplifier in UMTS mobile terminal supporting Band I (2100 MHz) diversity switching. IC Role / Device Role / Timing Role: Matched-gain companion amplifier to main LNA, using TR2 for identical noise performance and phase tracking. Use Value: Achieves >2.5 dB diversity gain improvement by preserving amplitude/phase correlation between paths. |
| Automotive Telematics RF Module | ISM Band 915 MHz Transceiver |
Use Scenario: Low-noise front-end in LTE-based vehicle-to-infrastructure (V2I) communication module operating at 700 MHz. IC Role / Device Role / Timing Role: Dual-transistor configuration used in balanced LNA topology to suppress common-mode interference in engine bay environments. Use Value: Delivers 19 dB Gms with <−35 dBc 2nd-harmonic distortion, meeting AEC-Q101 EMC immunity requirements. | Use Scenario: Receive amplifier in 915 MHz ISM-band smart meter RF transceiver with 20 mA average current budget. IC Role / Device Role / Timing Role: Single-ended LNA stage biased at IC = 5 mA to optimize NFmin = 0.9 dB while staying within power envelope. Use Value: Extends wireless range by 35% compared to discrete BJT alternatives due to lower Ceb (1.1 pF) and higher fT. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar low-noise bipolar RF transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BFP640FESD | fT = 25 GHz, NFmin = 0.75 dB at 1.8 GHz, single transistor, SOT343 package | Higher frequency coverage but no dual-transistor isolation; requires separate devices for differential use | Select when targeting LTE Band 3/7/40 with >2 GHz bandwidth and single-path architecture |
| MMA040407-12 | fT = 5 GHz, NFmin = 1.1 dB at 900 MHz, dual transistor, SOT363, no AEC-Q101 qualification | Lower fT and higher noise floor; lacks automotive reliability validation | Acceptable for cost-sensitive consumer IoT receivers where AEC-Q101 is not mandated |
Compared with BFP640FESD and MMA040407-12, BFS483 E6327 uniquely balances dual-transistor integration, AEC-Q101 compliance, and sub-1 dB noise at 900 MHz - making it optimal for space-constrained automotive and handset RF designs requiring matched-pair stability.
Availability
BFS483 E6327 is available at Aetrix Electronics and suitable for GSM receiver LNAs, UMTS diversity front-ends, and automotive telematics RF modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BFS483 E6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, RF, and automotive ICs, with global R&D and manufacturing infrastructure.
The BFS483 belongs to Infineon's RF bipolar transistor product line, engineered specifically for high-linearity, low-noise RF amplification in mobile communications and automotive connectivity systems.
FAQ
Is BFS483 E6327 pin-compatible with BFS484 E6327?
No. BFS484 E6327 has identical SOT363 package and pin numbering (B1/E1/C1/B2/E2/C2), but its hFE range is 100–200 and NFmin is 1.0 dB at 900 MHz. While mechanical replacement is possible, circuit re-biasing and noise performance verification are required due to parameter shifts.
What is the recommended PCB layout for minimizing noise in BFS483 E6327 LNA designs?
Use dedicated RF ground plane under the SOT363 footprint, keep base and emitter traces <0.5 mm long with 0.15 mm width, place input matching components within 1 mm of pins 1 and 2, and isolate TR1/TR2 bias networks to prevent crosstalk - validated per Infineon Application Note AN117.
Does BFS483 E6327 support 50 Ω system design without external matching?
No. Its ZSopt is 12 + j15 Ω at 900 MHz, requiring a two-element L-network (series inductor + shunt capacitor) for 50 Ω match. Direct 50 Ω connection yields >3 dB gain loss and degraded NF due to impedance mismatch.
Can BFS483 E6327 be used in Class-A power amplifier applications?
Not recommended. Its Ptot = 450 mW and IC max = 65 mA limit output power to <100 mW in Class-A; harmonic distortion exceeds −25 dBc above 10 mA. It is optimized for small-signal LNA use, not power amplification.
BFS 483 E6327 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 6-VSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- 2 NPN (Dual)
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Frequency - Transition:
- 8GHz
- Noise Figure (dB Typ @ f):
- 0.9dB ~ 1.4dB @ 900MHz ~ 1.8GHz
- Gain:
- 19dB
- Power - Max:
- 450mW
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 70 @ 15mA, 8V
- Current - Collector (Ic) (Max):
- 65mA
- Operating Temperature:
- 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT363-PO
BFS 483 E6327 FAQ
1.How can I place an order for BFS 483 E6327 through Aetrix?
Please submit a Request for Quotation (RFQ) for BFS 483 E6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BFS 483 E6327 reliable?
The price and inventory of BFS 483 E6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BFS 483 E6327 is usually 5 days.
3.What payment methods are accepted for BFS 483 E6327?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BFS 483 E6327 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BFS 483 E6327?
BFS 483 E6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BFS 483 E6327 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BFS 483 E6327?
For technical support, including BFS 483 E6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BFS 483 E6327 requirements.
6.How does Aetrix verify that BFS 483 E6327 is sourced from the original manufacturer or authorized distributors?
All BFS 483 E6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BFS 483 E6327 meets industry standards.
7.What is the process for return or replacement of BFS 483 E6327?
All BFS 483 E6327 units undergo pre-shipment inspection (PSI). If there is an issue with BFS 483 E6327, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BFS 483 E6327 part is unused and in its original packaging.
Return procedure for BFS 483 E6327:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BFS 483 E6327 Tags

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Infineon Technologies

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Infineon Technologies

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onsemi

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BFU520WX
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BFP650H6327XTSA1
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BFU520AR
NXP USA Inc.

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BFS483H6327XTSA1
Infineon Technologies
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