NXP Semiconductors BLS3135-65,114
- Part No.:
- BLS3135-65,114
- Manufacturer:
- NXP Semiconductors
- Category:
- Bipolar RF Transistors
- Package:
- SOT-422A
- Datasheet:
-
BLS3135-65,114.pdf
- Description:
- RF TRANS NPN 75V 3.5GHZ CDFM2
- Quantity:
- Payment:

- Shipping:

Inventory:9,067
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BLS3135-65 from Philips Semiconductors is an NPN silicon planar epitaxial microwave power transistor in common-base configuration, rated for ≥65 W pulsed RF output at 3.1–3.5 GHz with ≥7 dB power gain and ≥35% collector efficiency under 100 µs pulse width and 10% duty cycle. It integrates internal input/output matching networks and emitter ballasting resistors, and is designed for radar transmitter stages requiring rugged, high-power pulsed amplification.
For engineers reviewing the BLS3135-65 datasheet, BLS3135-65 pinout, BLS3135-65 application, or BLS3135-65 equivalent, this device demands attention to flange-grounded base connection, BeO-ceramic thermal management, SOT422A mechanical mounting constraints, and class-C biasing requirements in pulsed radar front-ends.
Technical Context
The BLS3135-65 operates exclusively in common-base class-C mode with base tied to the metal flange (pin 3), enabling high-efficiency pulsed amplification in the 3.1–3.5 GHz band. Its interdigitated emitter-base structure and multicell geometry deliver high emitter efficiency and reduced thermal resistance (0.57 K/W at 100 µs pulse).
It features gold metallization for reliability and internal matching networks optimized for 50 Ω systems, eliminating external tuning components in standard radar amplifier layouts. The device requires strict thermal interface control due to its beryllium oxide (BeO) ceramic cap - damage to the BeO disc poses toxic exposure risk.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Band | 3.1–3.5 GHz - supports X-band radar pulse amplification without external frequency tuning. |
| Pulsed Output Power (PL) | ≥65 W - delivers peak RF power in short/medium pulse radar transmitters with 100 µs pulse width. |
| Power Gain (Gp) | ≥7 dB - enables single-stage amplification with minimal driver stage complexity. |
| Collector Efficiency (ηC) | ≥35% - reduces DC power demand and heatsink burden in pulsed operation. |
| Thermal Impedance (Zth j-h) | 0.57 K/W - mandates low-thermal-resistance mounting to heatsink for safe 200 W peak dissipation. |
| Collector-Base Voltage (VCBO) | 75 V - sets maximum allowable DC bias swing across collector-base junction. |
| Peak Collector Current (ICM) | 8 A - defines instantaneous current capability during pulse conduction. |
Pinout & Package
Package: SOT422A - hermetic ceramic-capped, rectangular flanged package with two leads and base connected to flange. Dimensions: 22.99 × 10.29 × 4.83 mm (L × W × H); flange includes two 3.43 mm mounting holes. Requires BeO-handling precautions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Collector | Main RF power output node; electrically isolated from flange; connects to output matching network. |
| 2 | Emiter | RF input node in common-base configuration; carries full RF drive current and DC emitter bias path. |
| 3 | Base | Internally tied to metal flange; must be DC-grounded via heatsink; no external base connection required. |
Key Features
| Feature | Design Value |
|---|---|
| Internal input/output matching | Eliminates discrete matching components in 50 Ω radar amplifier designs, reducing layout sensitivity and tuning time. |
| Emitter ballasting resistors | Improves current sharing across multicell structure, enhancing ruggedness against load mismatch and VSWR stress. |
| Interdigitated emitter-base geometry | Increases emitter injection efficiency and reduces series resistance, supporting high-frequency gain at 3.5 GHz. |
| Gold metallization | Ensures long-term bond-wire reliability and corrosion resistance under thermal cycling in military-grade radar environments. |
| Multicell power-sharing architecture | Distributes thermal load across parallel transistor cells, lowering local junction temperature rise during pulsed operation. |
Applications
| Radar Pulse Transmitter | X-Band Weather Radar |
|---|---|
|
Use Scenario: High-power pulsed amplification in ground-based or airborne radar transmitters operating at 3.1–3.5 GHz. IC Role / Device Role / Timing Role: Final-stage common-base class-C RF power amplifier delivering ≥65 W peak output per pulse. Use Value: Enables compact, high-efficiency transmitter design with integrated matching and proven ruggedness against radar pulse VSWR transients. |
Use Scenario: Medium-range precipitation detection using pulsed Doppler radar in meteorological systems. IC Role / Device Role / Timing Role: Pulsed RF power stage driving antenna array with precise 100 µs pulse timing and 10% duty cycle. Use Value: Delivers stable ≥35% collector efficiency and ≥7 dB gain across 3.1–3.5 GHz band, minimizing thermal drift in uncooled outdoor enclosures. |
| Military Surveillance Radar | Electronic Warfare Jammer |
|
Use Scenario: Compact surveillance radar modules deployed on UAVs or mobile platforms requiring high peak power in limited volume. IC Role / Device Role / Timing Role: Ruggedized RF power amplifier with flange-grounded base for EMC-stable mounting on aluminum chassis. Use Value: Multicell geometry and emitter ballasting allow reliable operation under high VSWR conditions typical of rapidly scanning antennas. |
Use Scenario: Broadband jamming transmitters generating high-power pulses across X-band for electronic countermeasures. IC Role / Device Role / Timing Role: High-efficiency class-C amplifier stage generating spectrally concentrated pulses with minimal harmonic distortion. Use Value: Internal matching and gold metallization support repeatable performance over extended field deployment with minimal recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microwave pulsed power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BLF374 | Higher frequency range (2.5–3.5 GHz), lower PL (50 W), same SOT422A package but non-BeO ceramic cap. | Suitable for wider-bandwidth radar where peak power < 65 W is acceptable and BeO handling restrictions must be avoided. | Select BLF374 when BeO-free construction and broader low-end frequency coverage are prioritized over peak power. |
| MRP3001 | Higher PL (100 W), higher VCB rating (100 V), TO-252-3 package (non-flanged), no internal matching networks. | Requires external matching and larger heatsinking; better suited for custom-designed amplifiers needing >65 W and flexible bias schemes. | Select MRP3001 when system-level matching control and higher voltage headroom justify added design complexity and board space. |
Compared with BLS3135-65, BLF374 trades peak power and BeO dependency for broader low-band coverage and safer handling, while MRP3001 offers higher power and voltage margin at the cost of external matching and non-flanged thermal management - making BLS3135-65 optimal for drop-in, matched, flange-cooled X-band radar modules.
Availability
BLS3135-65 is available at Aetrix Electronics and suitable for radar pulse transmitters, X-band weather radar systems, military surveillance platforms, and electronic warfare jammers requiring stable component supply and legacy military-grade microwave transistor sourcing.
Supply support for BLS3135-65 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Philips Semiconductors (now NXP Semiconductors) was a global leader in analog, RF, and discrete semiconductor solutions, emphasizing high-reliability components for industrial, automotive, and defense applications.
The BLS3135-65 belongs to Philips' microwave power transistor product line, engineered specifically for rugged, high-efficiency pulsed amplification in X-band radar systems where thermal stability, VSWR tolerance, and hermetic packaging are critical.
FAQ
What is the maximum safe operating junction temperature for the BLS3135-65?
The BLS3135-65 has a maximum operating junction temperature (Tj) of 200 °C, as specified in its limiting values table. To maintain reliability, actual junction temperature must remain below this limit under all operating conditions - requiring careful thermal design using its 0.57 K/W thermal impedance and proper heatsink interface. The BLS3135-65 must never exceed 200 °C at the die level during pulsed operation.
Why is the base terminal of the BLS3135-65 connected to the flange?
The base of the BLS3135-65 is internally bonded to the metal flange (pin 3) to provide a low-inductance, low-impedance RF ground reference essential for stable common-base operation at 3.1–3.5 GHz. This eliminates base lead inductance that would degrade gain and efficiency. Mounting the BLS3135-65 on a grounded heatsink directly establishes the required RF ground path - no external base connection is needed or permitted.
Can the BLS3135-65 be used in continuous-wave (CW) mode?
No - the BLS3135-65 is characterized and rated only for pulsed operation (tp ≤ 100 µs, δ ≤ 10%). Its thermal impedance, efficiency, and power ratings assume short-duty-cycle conditions. CW operation exceeds its 200 W total power dissipation limit and risks rapid thermal runaway. The BLS3135-65 must not be operated in CW mode; it is strictly a pulsed RF power transistor.
What safety precautions apply when handling the BLS3135-65?
The BLS3135-65 contains beryllium oxide (BeO) in its ceramic cap. If the BeO disc is cracked or damaged, inhalation of BeO dust poses serious health hazards. Always wear appropriate PPE (gloves, mask) when inspecting or mounting the BLS3135-65. Never grind, drill, or thermally shock the package. Dispose of failed BLS3135-65 units as chemical/special waste per local regulations - never with general trash.
Does the BLS3135-65 require external matching networks in a 50 Ω system?
No - the BLS3135-65 integrates internal input and output matching networks optimized for 50 Ω operation in the 3.1–3.5 GHz band. Philips' application circuit (Fig.9) confirms direct 50 Ω stripline interfacing without discrete matching components. External tuning is unnecessary unless system-level VSWR correction or bandwidth extension beyond 400 MHz is required - in which case, the BLS3135-65's internal matching remains the baseline starting point.
BLS3135-65,114 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- SOT-422A
- Packaging:
- Tray
- Product Status:
- Obsolete
- Transistor Type:
- NPN
- Voltage - Collector Emitter Breakdown (Max):
- 75V
- Frequency - Transition:
- 3.5GHz
- Noise Figure (dB Typ @ f):
- -
- Gain:
- 7dB
- Power - Max:
- 200W
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 40 @ 2A, 5V
- Current - Collector (Ic) (Max):
- 8A
- Operating Temperature:
- 200°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- CDFM2
BLS3135-65,114 FAQ
1.How can I place an order for BLS3135-65,114 through Aetrix?
Please submit a Request for Quotation (RFQ) for BLS3135-65,114 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BLS3135-65,114 reliable?
The price and inventory of BLS3135-65,114 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BLS3135-65,114 is usually 5 days.
3.What payment methods are accepted for BLS3135-65,114?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BLS3135-65,114 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BLS3135-65,114?
BLS3135-65,114 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BLS3135-65,114 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BLS3135-65,114?
For technical support, including BLS3135-65,114 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BLS3135-65,114 requirements.
6.How does Aetrix verify that BLS3135-65,114 is sourced from the original manufacturer or authorized distributors?
All BLS3135-65,114 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BLS3135-65,114 meets industry standards.
7.What is the process for return or replacement of BLS3135-65,114?
All BLS3135-65,114 units undergo pre-shipment inspection (PSI). If there is an issue with BLS3135-65,114, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BLS3135-65,114 part is unused and in its original packaging.
Return procedure for BLS3135-65,114:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BLS3135-65,114 Tags

-
BFR182WH6327XTSA1
Infineon Technologies

-
BFR92PE6327HTSA1
Infineon Technologies

-
BFR360FH6327XTSA1
Infineon Technologies

-
BFR193FH6327XTSA1
Infineon Technologies

-
BFU550AR
NXP USA Inc.

-
BFR460L3E6327XTMA1
Infineon Technologies

-
MMBTH81
onsemi

-
BFU520WX
NXP Semiconductors

-
BFP840FESDH6327XTSA1
Infineon Technologies

-
BFP650H6327XTSA1
Infineon Technologies

-
BFU520AR
NXP Semiconductors

-
BFS483H6327XTSA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

